• Computers and Concrete
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• v.4 no.3
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• pp.221-241
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• 2007

Based on the experiment results, the damage and fracture behavior of concrete at the ages of 1d, 2d, 7d and 28d, in three-point bending and uniaxial tensile tests, were simulated with a finite element program, ABAQUS. The critical stress intensity factor $K_{IC}^s$ and the critical crack tip opening displacement ($CTOD_C$) of concrete were calculated with effective-elastic crack approach for the three-point bending test of grade C30 concrete. Based on the crack band model, a bilinear strain-softening curve was derived to simulate the LOAD-CMOD curves and LOAD-Displacement curves. In numerical analysis of the uniaxial tension test of concrete of grade C40, the damage and fracture mechanics were combined. The smeared cracking model coupling with damaged variable was adopted to evaluate the onset and development of microcracking of uniaxial tensile specimen. The uniaxial tension test was simulated by invoking the damage plastic model which took both damage and plasticity as inner variables with user subroutines. All the numerical simulated results show good agreement with the experimental results.

• Journal of Bio-Environment Control
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• v.27 no.4
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• pp.391-399
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• 2018

In this paper, experimental study performed on steel-pipe connections for structural members of a greenhouse is presented. By those experiments performed, bending moment, deformation and stress distribution of specimens were investigated under four point bending test. The bending performance according to connection method using pin and the stretching is also investigated. The results of bending performance of the no connection specimen were compared to those of other connection specimens. The pin and stretching connection specimens showed lower banding performance than the no connection specimen. The stretching connection method was relatively higher bending performance than the pin connection specimens. According to the results, we proposed the connection method with good bending performance that can be applied to steel-pipe connection in greenhouse.

• Journal of the Korean Wood Science and Technology
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• v.46 no.5
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• pp.486-496
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• 2018

This study was conducted to confirm an effect of span length on bending properties of larch dimensional lumber in the four point bending test. The size of specimen in this study was 38 (width) ${\times}$ 89 (depth) ${\times}$ 3,600 (length) $mm^3$, and average air-dry density and moisture content of the specimens was $543.5kg/m^3$ and 10.5%, respectively. Visually graded No. 1 dimensional lumbers of 248 were divided by two groups to compare modulus of rupture (MOR) and modulus of elasticity (MOE). One group was tested in the four point bending test with span length of 1,650 mm, and other was tested with span length of 3,000 mm. While MOE was not different according to span length in 5% significance level, MOR was different in accordance with span lengths and was in inverse proportion to change of span length. Fifth percentiles of MOR in span length of 1,650 and 3,000 mm were 28.65 and 25.70 MPa, respectively. It was confirmed that the difference between MORs in each case increased as normalized rank increased. This is because of size effect in Weibull weakest link failure theory. Therefore, KS F 2150, in which there is only regulation about span to depth ratio of 15 or more, is needed to be revised to contain a method considering size effect for MOR. From the method, various results of bending test with different size of lumber could be used to determine design value of lumber.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.40-44
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• 2008

The interfacial adhesion energy between resist and a substrate is very important due to resist pull-off problems during separation of mold from a substrate in nanoimprint process. And effect of substrate surface roughness on interfacial adhesion energy is very important. In this paper, we have treated glass wafer surface using $CF_4$ gas for increase surface roughness and it has tested interfacial adhesion properties of UV resin/glass substrate interfaces by 4 point bending test. The interfacial adhesion energies by bare, 30, 60 and 90 sec surface treatments are 0.62, 1.4, 1.36 and 2 $J/m^2$, respectively. The test results showed quantitative comparisons of interfacial fracture energy (G) effect of glass wafer surface roughness.

• Composites Research
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• v.27 no.2
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• pp.77-81
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• 2014

In this study, it was performed damage assessment and repair of small scale aircraft adopted on composite. This aircraft adopted the sandwich structure to skin of wing. This study aims to investigate the residual strength of sandwich composites with nomex honeycomb core and carbon fiber face sheets after the open hole damage by the experimental investigation. The 4-point bending tests were used to find the bending strength, and the open hole was applied to introduce the simulated damage on the specimen. The bending strength test results after open hole were compared with the results of no damaged specimen test. In addition, The damaged composite structure was repaired using external patch repair method after removing damaged area. After that, this study presents comparison results of the experimental investigation between the damaged and the repaired specimen. It was found that the bending strength of repaired specimen was recovered up to 95% of undamaged specimen.

• Composites Research
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• v.26 no.5
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• pp.295-302
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• 2013

In this study, Al5052/CFRP composites were fabricated for an automobile component by compression molding process inside a U-channel mold. Al5052 sheet were treated by sand blasting with two different particle sizes. Accordingly, surface roughness (Ra) values of $4.25{\mu}m$ and $1.85{\mu}m$ were obtained for the treated Al5052 sheets. The effect of surface roughness of Al5052 sheets on the adhesion and mechanical properties of Al5052/CFRP composites have been evaluated. Shear lap test and 3-point bending test were conducted. Results showed that the shear load for the composite fabricated by using the treated Al5052 sheets with Ra value of $1.85{\mu}m$ and $4.25{\mu}m$ were 3 and 5 times higher than Ra value of $0.73{\mu}m$ of the composite fabricated by using the untreated sheet. The bending stress of 200MPa was obtained for the composite fabricated with untreated Al5052 sheets. The bending stress increased to 400MPa when the composite fabricated from treated sheets. However, the bending stress was not influenced by treating condition through sand blasting.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.345-350
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• 2001

In order to perform elastic-plastic fracture mechanical analyses, fracture resistance curves for concerned materials are required. 1T-CT specimen was used to obtain fracture resistance curves. But the fracture resistance curve by the 1T-CT specimen was very conservative to evaluate the integrity of the structure. And fracture resistance curve was affected by the specimen geometry and crack plane orientation. The objective of this paper is to be certain the conservativeness of the fracture resistance curve by the 1T-CT specimen and to provide the additional safety margin. For these, the fracture tests using the real pipe specimen and standard 1T-CT specimen test were performed. 4-point bending jig was manufactured for pipe test and direct current potential drop method was used to measure the crack extension and length for pipe test. From the pipe and the 1T-CT specimen test results, it was observed that the J-integral of the 1T-CT specimen test at the crack initiation point was very small compare to that of the pipe specimen test.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.41-48
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• 2018

The quantitative interfacial adhesion energy measurement method of copper redistribution layer and WPR dielectric interface were investigated using $90^{\circ}$ peel test, 4-point bending test, double cantilever beam (DCB) measurement for FOWLP Applications. Measured interfacial adhesion energy values of all three methods were higher than $5J/m^2$, which is considered as a minimum criterion for reliable Cu/low-k integration with CMP processes without delamination. Measured energy values increase with increasing phase angle, that is, in order of DCB, 4-point bending test, and $90^{\circ}$ peel test due to increasing roughness-related shielding and plastic energy dissipation effects, which match well interfacial fracture mechanics theory. Considering adhesion specimen preparation process, phase angle, measurement accuracy and bonding energy levels, both DCB and 4-point bending test methods are recommended for quantitative adhesion energy measurement of RDL interface depending on the real application situations.

• The Journal of Advanced Prosthodontics
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• v.9 no.6
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• pp.439-446
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• 2017

PURPOSE. To evaluate the effects of different surface treatments on the bond strength of novel CAD/CAM restorative materials to resin cement by four point bending test. MATERIALS AND METHODS. The CAD/CAM materials under investigation were e.max CAD, Mark II, Lava Ultimate, and Enamic. A total of 400 bar specimens ($4{\times}1.2{\times}12mm$) (n=10) milled from the CAD/CAM blocks underwent various pretreatments (no pretreatment (C), hydrofluoric acid (A), hydrofluoric acid + universal adhesive (Scotchbond) (AS), sandblasting (Sb), and sandblasting + universal adhesive (SbS)). The bars were luted end-to-end on the prepared surfaces with a dual curing adhesive resin cement (Variolink N, Ivoclar Vivadent) on the custom-made stainless steel mold. Ten test specimens for each treatment and material combination were performed with four point bending test method. Data were analyzed using ANOVA and Tukey's test. RESULTS. The surface treatment and type of CAD/CAM restorative material showed a significant effect on the four point bending strength (FPBS) (P<.001). For LDC, AS surface treatment showed the highest FPBS results ($100.31{\pm}10.7MPa$) and the lowest values were obtained in RNC ($23.63{\pm}9.0MPa$) for control group. SEM analyses showed that the surface topography of CAD/CAM restorative materials was modified after treatments. CONCLUSION. The surface treatment of sandblasting or HF acid etching in combination with a universal adhesive containing MDP can be suggested for the adhesive cementation of the novel CAD/CAM restorative materials.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.77-86
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• 2008

The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.