• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.77-86
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• 2008

The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1990.11a
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• pp.36-40
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• 1990

세라믹재료는 ductility가 작아 그 강도가 균열의 가혹성, 즉 크기와 모양에 의하여 결정되는 특징을 가지고 있다. 한편 마모는 표면에 균열을 생성시킬 수 있기 때문에 강도에 큰 영향을 미칠 수 있다. 그러나 지금까지 강도에 미치는 마모의 영향은 잘 밝혀져 있지 않다. 따라서 본 연구에서는 세라믹재료중에서도 물리적 성질들이 잘 알려져 있는 알루미나를 택하여 마모기구를 관찰하고 마모가 강도에 미치는 영향을 관찰하였다. 소결후 고온등방가압 처리된 알루미나 소결체를 입수하여 3mmX4mmX40mm크기의 굽힘시험시편으로 가공하였다. 두개의 4mmX40mm면중에서 한명을 diamond paste $1\mu m$까지 사용하여 polishing하였다. 시편의 polishing된 면위에 질화규소 볼을 올려 놓고, 하중을 가한 상태에서 볼을 와복운동시켰다. 시편위에 형성되는 마모흔적의 길이를 16mm이상이 되도록 하였다. 왕복속도는 약 2 헤르쯔도 하였다. 하중은 300, 600, 900N으로 하였다. 윤활유로는 paraffin oil을 사용하였다. 마모시험이 끝난 시편을 광학현미경 및 주사전자현미경으로 관찰한 후, 4-점굽힘시험하여 강도를 구하였다. 4-점굽힘시험시 외부 및 내부 지지점간의 거리는 30mm, 10mm로 하였으며, cross head speed는 분당 0.5mm로 하였다.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.55-60
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• 2012

In order to develop electroless-plated Nickel Phosphate (Ni-P) as a contact material for high efficient low-cost silicon solar cells, we evaluated the effect of ambient thermal annealing on the degradation behavior of interfacial adhesion energy between electroless-plated Ni-P and silicon solar cell wafers by applying 4-point bending test method. Measured interfacial adhesion energies decreased from 14.83 to 10.83 J/$m^2$ after annealing at 300 and $600^{\circ}C$, respectively. The X-ray photoelectron spectroscopy analysis suggested that the bonding interface was degraded by environmental residual oxygen, in which the oxidation inhibit the stable formation of Ni silicide phase between electroless-plated Ni-P and silicon interface.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.173-174
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• 2008

The four-point bending test is a widely used method to determine material parameters. The aim of the present study was to evaluate the flexural strength (or modulus of rupture) and the Weibull modulus of cordierite ceramic substrate by means of four-point bending tests. The strength data from experiments followed Weibull statistics. These data indicate that the fatigue effects are more severe when the substrate temperature in the peripheral region is near $200^{\circ}$. At temperatures well above $200^{\circ}C$ the available design strength can be as high as 65% as substrate's initial strength.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.10a
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• pp.248-253
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• 1998

Recently, the uses of Ceramic/metal bonded joints, resin/metal joints, adhesive joints, composite materials which are composed of dissimiliar materials have increased in various industry fields. Since the ceramic/metal bonded joints material is made at a high temperature, residual stress distributions due to differences in material properties were investigated by varying material parameters. The two dimensional finite element analysis was performed to study residual stress distribution in Si3N4/SM45C bonded joint with a copper interlayer between the silicon nitride(Si3N4) and the structural carbon steel(SM45C) and 4-point bending tests were carried out under room temperature. Fracture surface and crack propagation path were observed using scanning electron microscope and characteristics of its fracture was discussed.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.40-44
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• 2008

The interfacial adhesion energy between resist and a substrate is very important due to resist pull-off problems during separation of mold from a substrate in nanoimprint process. And effect of substrate surface roughness on interfacial adhesion energy is very important. In this paper, we have treated glass wafer surface using $CF_4$ gas for increase surface roughness and it has tested interfacial adhesion properties of UV resin/glass substrate interfaces by 4 point bending test. The interfacial adhesion energies by bare, 30, 60 and 90 sec surface treatments are 0.62, 1.4, 1.36 and 2 $J/m^2$, respectively. The test results showed quantitative comparisons of interfacial fracture energy (G) effect of glass wafer surface roughness.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.49-55
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• 2016

The effects of post-annealing and temperature/humidity conditions on the interfacial adhesion energies of atomic layer deposited RuAlO diffusion barrier layer for Cu interconnects were systematically investigated. The initial interfacial adhesion energy measured by four-point bending test was $7.60J/m^2$. The interfacial adhesion energy decreased to $5.65J/m^2$ after 500 hrs at $85^{\circ}C$/85% T/H condition, while it increased to $24.05J/m^2$ after annealing at $200^{\circ}C$ for 500 hrs. The X-ray photoemission spectroscopy (XPS) analysis showed that delaminated interface was RuAlO/$SiO_2$ for as-bonded and T/H conditions, while it was Cu/RuAlO for post-annealing condition. XPS O1s peak separation results revealed that the effective generation of strong Al-O-Si bonds between $AlO_x$ and $SiO_2$ interface at optimum post-annealing conditions is responsible for enhanced interfacial adhesion energies between RuAlO/$SiO_2$ interface, which would lead to good electrical and mechanical reliabilities of atomic layer deposited RuAlO diffusion barrier for advanced Cu interconnects.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.345-350
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• 2001

In order to perform elastic-plastic fracture mechanical analyses, fracture resistance curves for concerned materials are required. 1T-CT specimen was used to obtain fracture resistance curves. But the fracture resistance curve by the 1T-CT specimen was very conservative to evaluate the integrity of the structure. And fracture resistance curve was affected by the specimen geometry and crack plane orientation. The objective of this paper is to be certain the conservativeness of the fracture resistance curve by the 1T-CT specimen and to provide the additional safety margin. For these, the fracture tests using the real pipe specimen and standard 1T-CT specimen test were performed. 4-point bending jig was manufactured for pipe test and direct current potential drop method was used to measure the crack extension and length for pipe test. From the pipe and the 1T-CT specimen test results, it was observed that the J-integral of the 1T-CT specimen test at the crack initiation point was very small compare to that of the pipe specimen test.

• Journal of Power System Engineering
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• v.14 no.5
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• pp.17-23
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• 2010

In recent, the capacity of a commercial wind power has reached the range of 6 MW, with large plants being built world-wide on land and offshore. The rotor blades and the nacelle are exposed to external loads. Wind power system concepts are reviewed, and loadings by wind and gravity as important factors for the mechanical performance of the materials are considered. So, the mechanical properties of fiber composite materials are discussed. Plain woven fabrics Carbon Fiber Reinforced Plastics (CFRP) are advanced materials which combine the characteristics of the light weight, high stiffness, strength and chemical stability. However, Plain woven CFRP composite have a lot of problems, especially delamination, compared with common materials. Therefore, the aim of this work is to estimate the mechanical properties using the tensile specimen and to evaluate strain using the CNF specimen on plain woven CFRP composites. For the strain, we tried to apply to plain woven CFRP using Digital Image Correlation (DIC) method and strain gauge. DIC method can evaluate a strain change so it can predict a location of fracture.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.1 s.232
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• pp.107-114
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• 2005

In order to analyze the elastic-plastic fracture behavior of a structure, the fracture resistance curve of the material should be known first. The standard CT specimen was used to obtain the fracture resistance curves of a piping system. However, it is known that the fracture resistance curve by the standard CT specimen is very conservative to evaluate the integrity of a structure. Also the fracture resistance curve is effected by the specimen geometry and the dimensions because of the constraint effect. The objective of this paper is to be certain the conservativeness of the fracture resistance curve by the standard CT specimen and to provide an additional safety margin. For these, the fracture tests using a real pipe specimen and the standard CT specimen test were performed. A 4-point bending jig was manufactured for the pipe test and the direct current potential drop method was used to measure the crack extension and the length for the pipe test. Also finite element analyses were performed with a CT specimen and a pipe in order to prove the additional safety margin. From the result of tests and analyses of the pipe and the standard CT specimen, it was observed that the fracture analysis with the standard CT specimen is conservative and the additional safety margin was proved.