• Title/Summary/Keyword: 3d stress state

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3D stress-fractional plasticity model for granular soil

  • Song, Shunxiang;Gao, Yufeng;Sun, Yifei
    • Geomechanics and Engineering
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    • v.17 no.4
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    • pp.385-392
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    • 2019
  • The present fractional-order plasticity models for granular soil are mainly established under the triaxial compression condition, due to its difficult in analytically solving the fractional differentiation of the third stress invariant, e.g., Lode's angle. To solve this problem, a three dimensional fractional-order elastoplastic model based on the transformed stress method, which does not rely on the analytical solution of the Lode's angle, is proposed. A nonassociated plastic flow rule is derived by conducting the fractional derivative of the yielding function with respect to the stress tensor in the transformed stress space. All the model parameters can be easily determined by using laboratory test. The performance of this 3D model is then verified by simulating multi series of true triaxial test results of rockfill.

A Galerkin Layerwise Formulation for three-dimensional stress analysis in long sandwich plates

  • Ahmadi, Isa
    • Steel and Composite Structures
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    • v.24 no.5
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    • pp.523-536
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    • 2017
  • A layerwise (LW) formulation based on the Galerkin method is presented to investigate the three-dimensional stress state in long sandwich plate which is subjected to tension force and pure bending moment. Based on the Galerkin method and the LW discretization approach, the equilibrium equations of elasticity for the long plate are written in the weak form and discretized through the thickness of the plate. The discretized equations are written in terms of displacement components of the numerical layers. The governing equations of the plate are solved analytically for the free edge boundary conditions. The distribution of stress state especially the 3D stress state in the vicinity of the edges of the sandwich plate which is subjected to tension and pure bending is studied. In order to increase the accuracy, the out of plane stresses are obtained by integrating the equilibrium equations of elasticity. The convergence and accuracy of the predictions are studied and various numerical results are presented for distribution of the in-plane and out of plane stresses in symmetric and un-symmetric sandwich plates.

Analysis of a three-dimensional FEM model of a thin piezoelectric actuator embedded in an infinite host structure

  • Zeng, Xiaohu;Yue, Zhufeng;Zhao, Bin;Wen, S.F.
    • Advances in materials Research
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    • v.3 no.1
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    • pp.237-257
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    • 2014
  • In this paper, we adopted a two-dimensional analytical electro-elastic model to predict the stress distributions of the piezoelectric actuator in 3D case. The actuator was embedded in an elastic host structure under electrical loadings. The problem is reduced to the solution of singular integral equations of the first kind. The interfacial stresses and the axial normal stress in both plane stress state and plane strain state were obtained to study the actuation effects being transferred from the actuator to the host. The stress distributions of the PZT actuator in different length and different thickness were analyzed to guarantee the generality. The validity of the present model has been demonstrated by application of specific examples and comparisons with the corresponding results obtained from the Finite Element Method.

Non-Quadratic Anisotropic Strain Rate Potential Defined in Plane Stress State (평면 응력 조건에서 정의된 비이차 비등방 변형률 속도 포텐셜)

  • Kim, D.;Kim, J.H.;Lee, Y.S.;Barlat, Frederic;Chung, K.
    • Transactions of Materials Processing
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    • v.20 no.5
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    • pp.369-376
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    • 2011
  • A non-quadratic anisotropic strain rate potential was introduced as a conjugate potential of the yield stress potential Yld2000-2d to describe anisotropic behavior of sheet metals, in particular, aluminum alloy sheets under plane stress state. This strain-rate potential takes into account the anisotropic yield stresses and R-values measured along the directions measured at 0, 45 and 90 degrees from the rolling direction, as well as the balanced biaxial yield stress and strain-rate ratio. The convexity of the strain-rate potential was completely proven. The strain-rate potential was applied for two anisotropic aluminum alloy sheets, AA6022-T4 and AA2090-T3. The results verified that the strain rate potential properly described the anisotropic behavior of aluminum alloy sheets and was closely conjugate of Yld2000-2d under the plane stress state.

The effect of relax therapy on the change of facial temperature by D.I.T.I. (이완요법(弛緩療法)이 안면(顔面) 체열(體熱) 변화(變化)에 미치는 영향(影響))

  • Cho, Jung-Hoon;Lee, Kyung-Sub
    • Journal of Oriental Medical Thermology
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    • v.3 no.1
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    • pp.27-35
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    • 2004
  • Today, everybody lives in the stress. So 50% to 80% or 60% to 80% of the modern diseases are estimated what is caused by the stress. And one of the most important point of the stress is a too serious and continuos tension state. Therefore the best way to promotion, persistence, prevention and treatment of the modern man's health will be the relaxion from the tension state. The relax therapy as known as am effective method to the disease which as concerned with stress. that can be adapted to the treatment of anxiety-related diseases, insomnia, hypertension, tension headache, migraine, asthma, preparation of delivery, G-I disorders and menstrual disorders. Until now we guess the change of a relaxed state by the observation to the change of autonomic nervous system(ANS) and EEG. From the point of the ANS, sympathetic nervous system progresses slowly but parasympathetic nervous system increases the activity. In the EEG, both the alpha-wave concerned with the deep physical relaxed state and emotional stability and the theta-wave appeared in the state of meditation are increased. Current studies show that among the biochemical changes, especially serotinin like body hormone is increased by the feeling of the stability or the happiness. So, to see the change of the relaxed state in the image of the D.I.T.I., we used the deviational differences between the pre-relaxed state and the post-relaxed state of 70 people. As a result, the portional deviation of the face is decreased in the image of the D.I.T.I. So it can be thaught that we can determine the changes of the relaxed state by the D.I.T.I.

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Effect of the thickness on the mixed mode crack front fields

  • Khan, Shafique M.A.
    • Structural Engineering and Mechanics
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    • v.42 no.5
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    • pp.701-713
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    • 2012
  • Results pertaining to 3D investigations on the effect of the thickness on the stress fields at the crack front are presented. A 3D finite element analysis is performed using a modified single edge-notched tension specimen configuration, with an inclined crack to include mixed mode I-II. A technique to mesh the crack front (3D) with singular finite elements in ANSYS without using third party software is introduced and used in this study. The effect of the specimen thickness is explicitly investigated for six thicknesses ranging from 1 to 32 mm. In addition, three crack inclination angles, including pure Mode-I, are used to study the effect of mixed-mode I-II fracture. An attempt is made to correlate the extent of a particular stress state along the crack front to thickness. In addition, ${\sigma}_{zz}/{\nu}({\sigma}_{xx}+{\sigma}_{yy})$ contours at the crack front are presented as a useful means to analyze the stress state.

Static bending study of AFG nanobeam using local stress-and strain-driven nonlocal integral models

  • Yuan Tang;Hai Qing
    • Advances in nano research
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    • v.16 no.3
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    • pp.265-272
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    • 2024
  • In this paper, the problem of static bending of axially functionally graded (AFG) nanobeam is formulated with the local stress(Lσ)- and strain-driven(εD) two-phase local/nonlocal integral models (TPNIMs). The novelty of the present study aims to compare the size-effects of nonlocal integral models on bending deflections of AFG Euler-Bernoulli nano-beams. The integral relation between strain and nonlocal stress components based on two types nonlocal integral models is transformed unitedly and equivalently into differential form with constitutive boundary conditions. Purely LσD- and εD-NIMs would lead to ill-posed mathematical formulation, and Purely εD- and LσD-nonlocal differential models (NDM) may result in inconsistent size-dependent bending responses. The general differential quadrature method is applied to obtain the numerical results for bending deflection and moment of AFG nanobeam subjected to different boundary and loading conditions. The influence of AFG index, nonlocal models, and nonlocal parameters on the bending deflections of AFG Euler-Bernoulli nanobeams is investigated numerically. A consistent softening effects can be obtained for both LσD- and εD-TPNIMs. The results from current work may provide useful guidelines for designing and optimizing AFG Euler-Bernoulli beam based nano instruments.

Experimental study on fatigue crack propagation of fiber metal laminates

  • Xie, Zonghong;Peng, Fei;Zhao, Tianjiao
    • Steel and Composite Structures
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    • v.17 no.2
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    • pp.145-157
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    • 2014
  • This study aimed to investigate the fatigue crack growth behavior of a kind of fiber metal laminates (FML) under four different stress levels. The FML specimen consists of three 2024-T3 aluminum alloy sheets and two layers of glass/epoxy composite lamina. Tensile-tensile cyclic fatigue tests were conducted on centrally notched specimen at four stress levels with various maximum values. A digital camera system was used to take photos of the propagating cracks on both sides of the specimens. Image processing software was adopted to accurately measure the length of the cracks on each photo. The test results show that: (1) a-N and da/dN-a curves of FML specimens can be divided into transient crack growth segment, steady state crack growth segment and accelerated crack growth segment; (2) compared to 2024-T3 aluminum alloy, the fatigue properties of FML are much better; (3) da/dN-${\Delta}K$ curves of FML specimens can be divided into fatigue crack growth rate decrease segment and fatigue crack growth rate increase segment; (3) the maximum stress level has a large influence on a-N, da/dN-a and da/dN-${\Delta}K$ curves of FML specimens; (4) the fatigue crack growth rate da/dN presents a nonlinear accelerated increasing trend to the maximum stress level; (5) the maximum stress level has an almost linear relationship with the stress intensity factor ${\Delta}K$.

A Study on the Creep Fracture Life of Al 7075 alloy( I ) (Al 7075 합금의 크리이프 파단수명에 관한 연구( I ))

  • 강대민
    • Journal of the Korean Society of Safety
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    • v.8 no.4
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    • pp.27-40
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    • 1993
  • High temperature tensile tests, steady state creep tests, Internal stress tests and creep rupture tests using A17075 alloy( $T_{6}$ ) were performed over the temperature range of 9$0^{\circ}C$~50$0^{\circ}C$ (0.4 $T_{m}$ ~0.85 $T_{m}$ ) and stress range of 0.64~17.2(kgf/$\textrm{mm}^2$). The main results obtained in this paper were as follows. (1) The activation energies for yielding at the temperature of 0.4 $T_{m}$ ~0.75 $T_{m}$ were calculated to be 25.7~36.5kcal/mol, which were nearly equal to the activation energies for creep. (2) At around the temperature of 9$0^{\circ}C$~12$0^{\circ}C$ and under the stress level of 10~17.2(kgf/$\textrm{mm}^2$), and at around the temperature of 200~41$0^{\circ}C$ and under the stress level of 1.53~9.55(kgf/$\textrm{mm}^2$) and again at around the temperature of 470~50$0^{\circ}C$ and under the stress level of 0.62~l.02(kgf/$\textrm{mm}^2$), the applied stress dependence of steady state creep rate $n_{measu}$ measured were, respectively, 3.15, 6.62 and 1.1, which were in good agreement the calculated stress dependence $n_{ealeu}$ obtained by the difference of the applied stress dependence of the Internal stress and the ratio of the internal stress to the applied stress. (3) At the temperature range of 0.4~0.43 $T_{m}$ , and at the temperature range of 0.52~0.75 $T_{m}$ and again at the temperature range of 0.82~0.85 $T_{m}$ , the activation energies $Q_{measu}$ obtained by steady state creep rate, respective, 26. 16, 34.9, 36.2 and 36.1kcal/mol, which were in good agreement with those obtained with the activation energies under constant effective stress and the temperature dependence of Internal stress. (4) At the temperature range of the 0.52~0.73 $T_{m}$ and under the stress level of 1.53~9.55(kgf/$\textrm{mm}^2$), the stress dependence of rupture life(n’) measured was 6.3~6.6, which was in good agreement with the stress dependence of steady state creep rate(n). And at the same condition the activation energy for rupture( $Q_{f}$ ) measured was 32.0~36.9kca1/mol, which was also in good agreement with the activation energy obtained by steady state creep rate ( $Q_{c}$ ). (5) The rupture life( $t_{f}$ ) might be represented by athermal process attributed to the difference of the applied stress dependence of the internal stress and the ratio of the internal stress to the applied stress, and the thermal activated process attributied to the temperature dependence of the internal stress as $t_{f}$ = A'$\sigma$$_{a}$ {n(1-d $\sigma$$_{i}$ /d $\sigma$$_{a}$ )/(1-$\sigma$$_{i}$ / $\sigma$$_{a}$ )}.exp[{ $Q_{c}$ $^{*}$-( $n_{o}$ R $T^2$/ $E_{(T)}$) (d $E_{(T)}$/dT) - ( $n_{0}$ R $T^2$/ $\sigma$$_{a}$ - $\sigma$$_{i}$ ) (d $\sigma$$_{i}$ /dT)}/RT]. (6) The relationship betwween Larson-Miller rupture parameter and logarithmic stress was linearly decreased, so creep rupture life of Al 7075 alloy seemed to be predicted exactly with Larson-Miller parameter.meter.

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Thermo-Mechanical Reliability of TSV based 3D-IC (TSV 기반 3차원 소자의 열적-기계적 신뢰성)

  • Yoon, Taeshik;Kim, Taek-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.1
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    • pp.35-43
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    • 2017
  • The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.