• 한국기계가공학회지
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• 제7권1호
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• pp.47-52
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• 2008

We present a 3-D profiler specially devised for the profile measurement of rough surfaces that are difficult to be measured with conventional non-contact interferometer. The profiler comprises multiple two-point-diffraction sources made of single-mode optical fibers. Test measurement proves that the proposed profiler is well suited for the warpage inspection of microelectronics components with rough surface, such as unpolished backsides of silicon wafers and plastic molds of integrated-circuit chip package.

• 한국기계가공학회지
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• 제7권3호
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• pp.81-86
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• 2008

I present a 3-D profiler specially devised for the profile measurement of specular surfaces that requires precision shape accuracy up to a few nanometer. A profile is reconstructed from the curvature of a test part of the surface at several locations along a line. The local curvature data are acquired with White-light Scanning Interferometry. Test measurement proves that the proposed profiler is well suited for the specular surface inspection like precision mirror.

• Tribology and Lubricants
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• 제40권2호
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• pp.47-53
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• 2024

Surface topography plays a decisive role in determining the performance of several precision components. In particular, the surface roughness of semiconductor devices affects the precision of the circuit. In this regard, the surface topography of a given surface needs to be appropriately assessed. Typically, the average roughness is used as one of the main indicators of surface finish quality because it is influenced by both dynamic and static parameters. Owing to the increasing demand for such accurate and reliable surface measurement systems, studies are continuously being conducted to understand the parameters of surface roughness and measure the average roughness with high reliability. However, the differences in the measurement methods of surface roughness are not clearly understood. Hence, in this study, the surface roughness of the back of a silicon wafer was measured using both contact and noncontact methods. Subsequently, a comparative analysis was conducted according to various surface roughness parameters to identify the differences in surface roughness depending on the measurement method. When using a 3D laser confocal microscope, even smaller surface asperities can be measured compared with the use of a 3D profiler. The results are expected to improve the understanding of the surface roughness characteristics of precision components and be used as a useful guideline for selecting the measurement method for surface topography assessment.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2016년도 추계학술대회 논문집
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• pp.76-92
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• 2016

산업이 고도화될수록 높은 품질과 보다 정밀하게 가공된 제품의 안정된 생산이 요구되고 있으며, 그에 대한 표준화된 측정법 및 관리법이 요구되고 있다. 산업체에서 생산되는 다양한 형태의 제품들 중, 마이크로메타 또는 나노메타 수준의 정밀한 가공 및 측정에 있어서, 정확하고 일관성 있게 빠른 시간 안에 제품분석을 수행 할 수 있는 방법은 오래 전부터 활발히 연구되고 있으며, 그 중 광학 기반의 3D-profiler 는 빠른 속도와 간편한 사용으로 많은 인기를 얻고 있다. 이러한 분석법은 광학 현미경의 평면 분해능을 가지고, 나노크기의 물체 높이를 판별하여, 측정된 정보를 3차원 이미지로 형태를 재 구성할 수 있어, 미세한 표면 조도 변화나 나노 수준의 패턴 단차에 대한 정보를 간단하게 얻을 수 있다. 또한 빛의 간섭현상에 기초하여 시료 표면에 대한 정보를 얻기 때문에 원자단위 이하 수준의 측정 해상도를 가지게 된다. 표면의 칼라패턴에 대해서도 2D 평면 정보를 기초로, 다양한 색상의 패턴들에 대해 각각의 색에 따른 정확한 높이 분석 및 그 패턴 분리, 색깔과 매칭되는 3D 이미지 구현 등과 같은 분석이 가능하여, 이를 활용하여 다양한 분야에서 활발히 사용되고 있다. 실제 현장에서 측정된 다양한 3D 이미지를 소개하며, 이를 통해 광학 3D-Profiler에 대한 전반적인 성능 소개와 그 이해를 돕고자 한다.

• Current Optics and Photonics
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• 제2권2호
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• pp.172-178
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• 2018

We propose a precise 3D endoscopic technique for medical and industrial applications. As the 3D measuring principle, the continuously scanning structured illumination microscopy (CSSIM), which enables to obtain 3D sectional images by the synchronous axial scanning of the target with the lateral scanning of the sinusoidal pattern, is adopted. In order to reduce the size of the probe end, the illumination and detection paths of light are designed as coaxial and a coherent imaging fiber bundle is used for transferring the illumination pattern to the target and vice versa. We constructed and experimentally verified the proposed system with a gauge block specimen. As the result, it was confirmed that the 3D surface profile was successfully measured with $16.1{\mu}m$ repeatability for a gauge block specimen. In order to improve the contrast of the sinusoidal illumination pattern reflected off on the target, we used polarizing optical components and confirmed that the visibility of the pattern was suitable in CSSIM.

• International Journal of Precision Engineering and Manufacturing
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• 제7권4호
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• pp.3-7
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• 2006

Confocal scanning microscopy is a measurement technique used to observe micrometer and sub-micrometer features due to its high resolution, nondestructive properties, and 3D surface profiling capabilities. The design, implementation, and performance test of a confocal scanning microscopy system are presented in this paper. A short-wavelength laser (405 nm) and an objective lens with a high numerical aperture (0.95) were used to achieve the desired high resolution, while the x- and y-axis scans were implemented using an acousto-optic deflector and galvanomirror, respectively. An objective lens with a piezo-actuator was used to scan the z-axis. A spatial resolution of less than 138 nm was achieved, along with successful 3D surface reconstructions.

• 대한원격탐사학회:학술대회논문집
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• 대한원격탐사학회 2003년도 Proceedings of ACRS 2003 ISRS
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• pp.1177-1179
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• 2003

Recently, the ground-based laser profiler is used for acquisition of 3D spatial information of a rchaeological objects. However, it is very difficult to measure complicated objects, because of a relatively low-resolution. On the other hand, texture mapping can be a solution to complement the low resolution, and to generate 3D model with higher fidelity. But, a huge cost is required for the construction of textured 3D model, because huge labor is demanded, and the work depends on editor's experiences and skills . Moreover, the accuracy of data would be lost during the editing works. In this research, using the laser profiler and a non-calibrated digital camera, a method is proposed for the automatic generation of 3D model by integrating these data. At first, region segmentation is applied to laser range data to extract geometric features of an object in the laser range data. Various information such as normal vectors of planes, distances from a sensor and a sun-direction are used in this processing. Next, an image segmentation is also applied to the digital camera images, which include the same object. Then, geometrical relations are determined by corresponding the features extracted in the laser range data and digital camera’ images. By projecting digital camera image onto the surface data reconstructed from laser range image, the 3D texture model was generated automatically.

• 대한치과의사협회지
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• 제58권1호
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• pp.19-26
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• 2019

Purpose: The purpose of this study is to compare the adhesion of Candida albicans according to build angle in 3D printing denture base resin. Methods: The 3D printing was performed by setting the build angle of the disk type specimen designed by CAD program at 0 degree, 30 degrees, 60 degrees, and 90 degrees. Surface roughness was measured using a non-contact 3D microsurface profiler. The specimens were incubated in Candida albicans suspension for 24 hours. The attached Candida albicans were detached by cell scraper. The suspension of detached C. albicans was serially diluted and plated on Trypticase soy broth. After 48 hours of incubation, total colony forming unit was counted. Results: There was no significant difference in surface roughness(Sa) between the test groups, but the interlayer boundary was observed. There was no statistically significant difference in total colony forming units of Candida albicans between the test groups. Conclusion: There was no difference in the average surface roughness and adhesion of Candida albicans between the specimens. It is considered that the setting of the build angle should be set considering the accuracy or strength rather than the roughness of the surface.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.175.1-175.1
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• 2015

CuSn thin films were deposited by rf magnetron co-sputtering method with pure Cu and Sn metal targets with a variety of rf powers. CuSn thin films were studied with a surface profiler (alpha step), X-ray photoelectron spectroscopy (XPS), X-ray induced Auger electron spectroscopy (XAES), X-ray diffraction (XRD), and contact angle measurement. The thickness of CuSn thin films was fixed at $200{\pm}10nm$ and deposition rate was calculated by the measured with a surface profiler. From the survey XPS spectra, the characteristic peaks of Cu and Sn were observed. Therefore, CuSn thin films were successfully synthesized on the Si (100) substrate. The oxidation state and chemical environment of Cu and Sn were investigated with the binding energy regions of Cu 2p XPS spectra, Sn 3d XPS spectra, and Cu LMM Auger spectra. Change of the crystallinity of the films was observed with XRD spectra. Using contact angle measurement, surface free energy (SFE) and wettability of the CuSn thin films were studied with distilled water (DW) and ethylene glycol (EG).

• 한국광학회지
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• 제15권4호
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• pp.287-292
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• 2004

광 커넥터 접합면의 스크래치가 삽입손실에 미치는 영향에 대하여 연구하였다. 광파의 투과계수가 스크래치의 깊이에 따라 선형적으로 변화한다고 가정하고 스크래치의 기하학적 파라미터들의 함수로 표현된 광 커넥터의 삽입손실을 계산하는 모델을 제시하였다. 3D Optical interferometry surface profiler를 이용하여 임의로 발생된 스크래치의 위치, 폭과 깊이와 같은 기하학적 파라미터들을 측정하였다. 측정된 삽입손실과 제안된 모델을 이용하여 계산한 삽입손실을 비교하여 스크래치의 깊이에 따라 선형적으로 변화하는 투과계수 식을 구하였다. 깊이에 따른 투과계수 식과 제시된 모델을 이용하여 스크래치로 인한 삽입손실을 스크래치의 위치, 폭과 깊이의 함수로 계산하였다. 스크래치가 코어 중심에서 코어 반경의 2배 정도를 벗어난 위치에 존재하면 삽입손실에 영향을 거의 주지 않음을 확인하였다.