• 제목/요약/키워드: 3D micro-structure

검색결과 226건 처리시간 0.039초

에틸렌-프로필렌-디엔 삼원 공중합 (EPDM) 발포체의 충격음 저감 특성에 관한 연구 (A Study on Impact Sound Insulation Properties of EPDM Micro Cellular Pad)

  • 이경원;이정희;손호성
    • Elastomers and Composites
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    • 제35권2호
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    • pp.138-148
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    • 2000
  • EPDM 발포체의 정적/동적 특성을 측정하여 재료 특성과 진동 특성과의 연관성을 알아보고 이로부터 충격음 저감재로서의 적용 가능성을 검토하였다. 정적/동적 특성은 material test system (MTS)를 사용하여 시편의 형상, 두께, 초기하중, 발포도 등에 따라 정적 탄성계수, 동적 탄성계수, 전달율의 변화를 조사하였다. 정적 탄성계수와 동적 탄성계수의 경우, 형상이 단순하고 두께가 얇을수록 큰 값을 나타냈고, 전달율과 동적 탄성계수는 상호 비례 관계에 있음을 확인할 수 있었다. 특징적으로 동적 탄성계수가 증가하면, 전달율의 특성 피크치는 같은 주파수 영역에서의 증가 혹은 고주파수 영역으로의 전이의 형태로 일어나게 되는 것을 알 수 있었다. 실험실적 모사 시험장치를 통해 충격에 따른 주파수별 진동 속도측정과 유한 요소 해석 모델을 사용하여 mode shape에 의한 충격 해석 결과를 알아보았는데, EPDM 발포체를 사용함으로써 2.5-3.5배의 진동 속도 저감이 이루어짐을 알 수 있었고, mode shape의 경우 몰타르와 콘크리트만으로 구성된 구조물에 비해 진동 충격에 대한 변위가 급감함으로써 충격음 저감재로서의 EPDM 발포체의 적용 가능성은 상당히 높은 것을 확인할 수 있었다.

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CA모형을 이용한 미시적 교통류 시뮬레이션 시스템 개발에 관한 연구 (A Traffic Flow Micro-simulation System Using Cellular Automata)

  • 조중래;고승영;김진구;김채만
    • 대한교통학회지
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    • 제19권3호
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    • pp.133-144
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    • 2001
  • 본 연구에서는 대규모 네트워크에 적용 가능한 미시적 교통류 시뮬레이션 모형을 개발하였다. 본 연구는 대규모 가로망에 대한 미시적 교통류 시뮬레이션 시스템개발의 첫 번째 단계로, 연속류 구간을 중심으로 우리나라의 가로망 구조, 차량 주행행태에 적합한 미시적 교통류 시뮬레이션 모형개발에 초점을 두었다. 차량 전이 모형으로는 Cellular Automata 모형(CA모형)을 기반으로 하였으며, 기존의 CA모형 중 교통공학적 측면에서 문제가 있다고 판단되는 부분에 대해서는 새로운 모형을 개발하거나 수정하여 적용하였다. 개발된 모형의 모의실험을 통해 기존의 거시적 교통류 시뮬레이션 모형에서 설명할 수 없었던 여러 교통현상(합류, 차로축소, 분류등으로 유발되는 교통현상)을 설명할 수 있는 것으로 확인되었고, 또한 본 모형은 우리나라의 가로망구조에 기반을 두고 개발되었기 때문에 기존에 외국에서 개발된 미시적 시뮬레이션 모형이 표현하지 못했던 가로망에 대한 교통류 시뮬레이션이 가능한 것으로 나타났다.

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Fabrication and characterization of CdS film, nanowires and nanobelts grown by VPE

  • Son, Moon-A;Lee, Dong-Jin;Kang, Tae-Won
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.69-69
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    • 2010
  • The research is the structural and optical characteristics of the Cadmium Sulfide(CdS) film, nanowires and nanobelts grown on the $Al_2O_3$ substrate using the vapor phase epitaxy method. The field-emission scanning electron microscopy(FE-SEM) were used to identify the shape of the surface of the nanostructures and x-ray diffraction(XRD) and transmission electron microscopy (TEM) were used to evaluate the structural characterisitcs. As a result, the XRD was confirmed the CdS peak and the substrate peak and TEM showed single crystals with wurtzite hexagonal structure on the nanostructures. As for the optical characteristic of the nanostructures, photoluminescence(PL) and micro-raman spectrum were measured. The PL measurements confirmed the emission peak related bound exciton to neutral donor($D^0X$) peak and free exciton(FX) peak. The micro-raman spectrum showed that the peak of the nanostructures were similar to the pure crystalline CdS peak and each peak were overtone of LO phonon of the hexagonal CdS of the longitudinal optical(LO) phonon mode. Therefore, it is confirmed that the CdS nanostructures grown in this research have superior crystallinity.

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SM45C강의 연속파 Nd:YAG레이저표면경화와 고주파표면경화특성 비교 (Comparison of Characteristics on Induction and Continuous Nd:YAG Laser Surface hardening of SM45C Steel)

  • 신호준;유영태;안동규;신병헌
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.176-183
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    • 2005
  • Laser heat treatment technology is used for improving the feature of fatigue resistance and wear resistance in mobile parts. The purpose of this study is to compare the characteristics of laser heat treatment and high frequency heat treatment, which is commonly used in industrial place. For the preemptive experiment, the distribution, depth and size of hardening and its micro-structural features were compared between surface heat treatment case by defocusing and variables of each process for heat treatment by exclusively manufactured heat treatment optical system. As a result, high frequency heat treatment has wide distribution of hardening depth and width about 3 times larger than laser heat treatment, however, its average hardness showed 621.4Hv which is smaller than the average hardness of laser heat treatment with 691Hv.

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마이크로 엑츄에이터용 형상기억 리본 제조 및 제특성 평가 (The Fabrication and Evaluation of SMA Ribbons for Micro Actuator Application)

  • 이영수;장우양
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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    • pp.554-554
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    • 2000
  • To improve mechanical properties of Cu-Al-Ni alloy by the grain refinement, Cu-Al-Ni SMA ribbons were fabricated by melt spinning apparatus. The variations of microstructure, mechanical properties and transformation characteristics with the condition of rapid solidification and annealing time-temperature were investigated in Cu-Al-Ni SMA ribbons. The ribbons fabricated by melt spinning obtained around 1.5nm in width and 50-60${\mu}{\textrm}{m}$ in thickness. With increasing wheel speed in order of 10m/s, 15m/s, 20m/s, 30m/s and 3m/s, the grain size was decreased in order of 10${\mu}{\textrm}{m}$, 6.25${\mu}{\textrm}{m}$, 5.5${\mu}{\textrm}{m}$, 3${\mu}{\textrm}{m}$ and 3${\mu}{\textrm}{m}$. $M_{s}$ and $A_{s}$ temperature were decreased with decreasing grain size. By X-ray diffraction test, ordered $\beta$$_1$ phase was observed in all the SMA ribbons and the volume friction of it was increased with increasing wheel speed. With increasing wheel speed, strain was increased from 4.2% to 5.8% and fracture mode has changed from mixture of intergranular and dimple fracture to mixture of fiber structure and dimple fracture. The grain size of ribbon heat-treated at $600^{\circ}C$ was increased with increasing time. In the heat-treated ribbons at 55$0^{\circ}C$, ${\gamma}$$_2$ phases were observed.d.d.

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저온 및 고전류밀도 조건에서 전기도금된 구리 박막 간의 열-압착 직접 접합 (Thermal Compression of Copper-to-Copper Direct Bonding by Copper films Electrodeposited at Low Temperature and High Current Density)

  • 이채린;이진현;박기문;유봉영
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2018년도 춘계학술대회 논문집
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    • pp.102-102
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    • 2018
  • Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

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In-situ 스퍼터링을 이용한 잔고상 박막 전지의 제작 및 전기화학적 특성 평가 (Fabrication and Electrochemical Characterization of All Solid-State Thin Film Micro-Battery by in-situ Sputtering)

  • 전은정;윤영수;남상철;조원일;신영화
    • 전기화학회지
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    • 제3권2호
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    • pp.115-120
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    • 2000
  • 양극 물질로 산화바나듐 박막, 고체전해질로는 LiPON 박막 그리고 음극 물질로는 리튬 금속 박막을 선택하여 $Li/LiPON/V_2O_5/Pt$ 구조의 전고상 박막 전지를 제작하였고 전지 특성을 평가하였다. 산화바나듐 박막은 여러 산소 분압에서 직류 반응성 스퍼터링으로 증착하여 전기화학적 특성을 분석한 결과 $20\%\;O_2/Ar$비에서 가장 우수한 가역 특성을 나타내었다. 직류 반응성 스퍼터링에 의해 산화바나듐 박막을 제작한 후 진공을 그대로 유지한 상태에서 r.f. 반응성 스퍼터링에 의해 LiPON 고체전해질 박막을 증착하였다. 그 후 dry room내에서 진공 열증착법에 의해 리튬 금속 박막을 증착하여 전고상의 박막 전지를 제작하였다. $Li/LiPON/V_2O_5$ 박막 전지를 전압 범위와 전류 밀도를 변화시켜 충방전 시험을 행한 결과 $7{\mu}A/cm^2$의 전류 밀도와 3.6-2.7 V의 전압범위에서 가장 우수한 가역 특성을 나타내었다. $Li/LiPON/V_2O_5$박막 전지로 초시계를 구동 시켰으며 이는 in-situ공정에 의해 제작된 박막 전지가 소자 에너지원으로의 응용 가능성을 보여 주었다.

3D 계층적 나노구조화된 표면을 갖는 소수성 유/무기 복합 필름 (Hydrophobic Organic/Inorganic Composite Films with 3D Hierarchical Nanostructured Surfaces)

  • 서희진;안진성;박준용
    • Composites Research
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    • 제34권4호
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    • pp.264-268
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    • 2021
  • 이 연구에서 우리는 3차원 계층적 나노구조화된 유/무기 복합 표면을 가진 소수성 코팅/필름을 제조하는 방법을 제안한다. 먼저 근접장 나노패터닝(PnP)이라 불리는 첨단 포토리소그래피 기술을 통해 에폭시 기반의 대면적 3차원 정렬 나노다공성 템플릿을 준비하였다. 이후, 딥 코팅을 통해 평균 직경이 22 nm인 실리카 나노입자를 템플릿에 조밀하게 함침시켜 계층적 구조화된 표면을 구현하였다. 표면에 공존하는 마이크로 및 나노 스케일 거칠기로 인해, 제조된 복합 필름은 대조군에 비해 물에 대한 높은 접촉각(>137도)을 나타내었다. 따라서 본 연구를 통해 개발된 소재 및 공정은 전통적인 코팅/필름 분야에서 다양하게 활용될 수 있을 것으로 기대된다.

Practical Challenges Associated with Catalyst Development for the Commercialization of Li-air Batteries

  • Park, Myounggu;Kim, Ka Young;Seo, Hyeryun;Cheon, Young Eun;Koh, Jae Hyun;Sun, Heeyoung;Kim, Tae Jin
    • Journal of Electrochemical Science and Technology
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    • 제5권1호
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    • pp.1-18
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    • 2014
  • Li-air cell is an exotic type of energy storage and conversion device considered to be half battery and half fuel cell. Its successful commercialization highly depends on the timely development of key components. Among these key components, the catalyst (i.e., the core portion of the air electrode) is of critical importance and of the upmost priority. Indeed, it is expected that these catalysts will have a direct and dramatic impact on the Li-air cell's performance by reducing overpotentials, as well as by enhancing the overall capacity and cycle life of Li-air cells. Unfortunately, the technological advancement related to catalysts is sluggish at present. Based on the insights gained from this review, this sluggishness is due to challenges in both the commercialization of the catalyst, and the fundamental studies pertaining to its development. Challenges in the commercialization of the catalyst can be summarized as 1) the identification of superior materials for Li-air cell catalysts, 2) the development of fundamental, material-based assessments for potential catalyst materials, 3) the achievement of a reduction in both cost and time concerning the design of the Li-air cell catalysts. As for the challenges concerning the fundamental studies of Li-air cell catalysts, they are 1) the development of experimental techniques for determining both the nano and micro structure of catalysts, 2) the attainment of both repeatable and verifiable experimental characteristics of catalyst degradation, 3) the development of the predictive capability pertaining to the performance of the catalyst using fundamental material properties. Therefore, under the current circumstances, it is going to be an extremely daunting task to develop appropriate catalysts for the commercialization of Li-air batteries; at least within the foreseeable future. Regardless, nano materials are expected to play a crucial role in this field.

Design, development and ground testing of hingeless elevons for MAV using piezoelectric composite actuators

  • Dwarakanathan, D.;Ramkumar, R.;Raja, S.;Rao, P. Siva Subba
    • Advances in aircraft and spacecraft science
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    • 제2권3호
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    • pp.303-328
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    • 2015
  • A design methodology is presented to develop the hingeless control surfaces for MAV using adhesively bonded Macro Fiber Composite (MFC) actuators. These actuators have got the capability to deflect the trailing edge surfaces of the wing to attain the required maneuverability, besides achieving the set aerodynamic trim condition. A scheme involving design, analysis, fabrication and testing procedure has been adopted to realize the trailing edge morphing mechanism. The stiffness distribution of the composite MAV wing is tailored such that the induced deflection by piezoelectric actuation is approximately optimized. Through ground testing, the proposed concept has been demonstrated on a typical MAV structure. Electromechanical analysis is performed to evaluate the actuator performance and subsequently aeroelastic and 2D CFD analyses are carried out to see the functional requirements of wing trailing edge surfaces to behave as elevons. Efforts have been made to obtain the performance comparison of conventional control surfaces (elevons) with morphing wing trailing edge surfaces. A significant improvement in lift to drag ratio is noticed with morphed wing configuration in comparison to conventional wing. Further, it has been shown that the morphed wing trailing edge surfaces can be deployed as elevons for aerodynamic trim applications.