• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.157-158
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• 2006

A novel nanofabrication process has been developed using two-photon crosslinking (TPC) for the fabrication of three-dimensional (3D) SiCN ceramic microstructures applicable to high functional 3D devices, which can be used in harsh working environments requiring a high temperature, a resistance to chemical corrosion, as well as tribological properties. After sequential processes: TPC and pyrolysis, 3D ceramic microstructures are obtained. However, large shrinkage due to low-ceramic yield during the pyrolysis is a serious problem to be solved in the precise fabrication of 3D ceramic microstructures. In this work, silica nanoparticles were employed as a filler to reduce the amount of shrinkage. In particular, the ceramic microstructures containing 40 wt% silica nanoparticles exhibited relatively isotropic shrinkage owing to its sliding free from the substrate during pyrolysis.

• Journal of Sensor Science and Technology
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• v.15 no.2
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• pp.148-152
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• 2006

This paper describes the fabrication of SiCN microstructures for super-high temperature MEMS using photopolymerization of pre-ceramic polymer. In this work, polysilazane liquide as a precursor was deposited on Si wafers by spin coating, microstructured and solidificated by UV lithography, and removed from the substrate. The resulting solid polymer microstructures were cross-linked under HIP process and pyrolyzed to form a ceramic of withstanding over $1400^{\circ}C$. Finally, the fabricated SiCN microstructures were annealed at $1400^{\circ}C$ in a nitrogen atmosphere. Mechanical characteristics of the SiCN microstructure with different fabrication process conditions were evaluated. The elastic modules, hardness and tensile strength of the SiC microstructure implemented under optimum process condtions are 94.5 GPa, 10.5 GPa and 11.7 N/min, respectively. Consequently, the SiCN microstructure proposed in this work is very suitable for super-high temperature MEMS application due to very simple fabrication process and the potential possiblity of sophisticated mulitlayer or 3D microstructures as well as its good mechanical properties.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.392-393
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• 2006

This paper describes the fabrication of SiCN microstructures for super-high temperature MEMS using photopolymerization of pre-ceramic polymer. In this work. polysilazane liquide as a precursor was deposited on Si wafers by spin coating. microstructured and solidificated by UV lithography. and removed from the substrate. The resulting solid polymer microstructures were cross-linked under HIP process and pyrolyzed to form a ceramic of withstanding over $1400^{\circ}C$. Finally, the fabricated SiCN microstructures were annealed at $1400^{\circ}C$ in a nitrogen atmosphere. Mechanical characteristics of the SiCN microstructure with different fabrication process conditions were evaluated. The elastic modules. hardness and tensile strength of the SiC microstructure implemented under optimum process conditions are 94.5 GPa, 10.5 GPa and 11.7 N/min, respectively. Consequently, the SiCN microstructure proposed in this work is very suitable for super-high temperature MEMS application due to very simple fabrication process and the potential possiblity of sophisticated multlayer or 3D microstructures as well as its good mechanical properties.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.31 no.3
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• pp.133-140
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• 2018

This paper is concerned with the 2-D micostructure generation for $Ni-A{\ell}_2O_3$ dual-phase composite materials and the numerical analysis of mechanical characteristic of hierarchical models of microstructure which are defined in terms of the scale of microstructure. The microstructures of dual-phase composite materials were generated by applying the mathematical RMDF(random morphology description functions) technique to a 2-D RVE of composite materials. And, the hierarchical models of microstructure were defined by the number of Gaussian points. Meanwhile, the volume fractions of metal and ceramic particles were set by adjusting the level of RMD functions. The microstructures which were generated by RMDF technique are definitely random even though the total number of Gaussian points is the same. The randomly generated microstructures were applied to a 2-D beam model, and the variation of normal and shear stresses to the scale of microstructure was numerically investigated. In addition, through the crack analyses, the influence of RMDF randomness and Gauss point number on the crack-tip stress is investigated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.332-332
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• 2010

We have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films withouWe have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films without a high temperature sintering process. In order to remove the coffee ring effect in the ink drop, we have introduced a co-solvent system in order to create Marangoni flow in the ink drop, which leads to the dense packing of ceramic powders on the substrate during inkjet process. The packing density of the Inkjet-printed $Al_2O_3$ films is around 60% (max. 70%) which is very high compared to the value obtained from the same material films by other conventional methods such as film casting, dip coating process, etc. The voids inside the films (which are around 40% of the entire film volume) are filled with the polymer resin (Cyanate ester) by the infiltration process. This resin infiltration is also implemented by the inkjet printing process right after the Ah03 film ink-jetting process. The microstructures of the printed $Al_2O_3$ films are investigated by Scanning Electron Microscope (SEM) to understand the degree of packing density in the printed films. The inkjet-printed $Al_2O_3$ films have been characterized to investigate its thickness and roughness. Quality factor of the printed $Al_2O_3$ film is also measured to be over 300 at 1MHz.

• Journal of the Korean Ceramic Society
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• v.30 no.6
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• pp.457-468
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• 1993

In oxide matrix-SiC(W) composites, instability and glassy phase formation due to oxidation at the high temperature and the diffusion of Si, respectively, cause brittle fracture and low reliability for ceramic materials. The mode of contribution in each mechanisms induced by matrix-whisker debonding, varies with the morphology of matrix-whisker interfaces. This work has described the dispersion behaviours and stabilization mechanisms in slip systems, and multiple toughening mechanisms by dint of two second phase different from each other when spherical ZrO2 and chemically stable Al2O3(W) is respectively added in Al2O3 matrix. To obtain complexshaped components, slip casted bodies were sintered at 1$600^{\circ}C$, 2hrs up to 98~99% R.D.. Multiple toughening mechanisms in comparison with theories reported until now will be discussed as a result of the phase analysis of ZrO2 by athermal behaviours and microstructural characterizations as well as measured mechanical properties.

• Journal of Powder Materials
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• v.27 no.3
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• pp.219-225
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• 2020

The directed energy deposition (DED) process of metal 3D printing technologies has been treated as an effective method for welding, repairing, and even 3-dimensional building of machinery parts. In this study, stainless steel 316L (STS316L) and Inconel 625 (IN625) alloy powders are additively manufactured using the DED process, and the microstructure of the fabricated STS316L/IN625 sample is investigated. In particular, there are no secondary phases in the interface between STS316L and the IN625 alloy. The EDS and Vickers hardness results clearly show compositionally and mechanically transient layers a few tens of micrometers in thickness. Interestingly, several cracks are only observed in the STS 316L rather than in the IN625 alloy near the interface. In addition, small-sized voids 200-400 nm in diameter that look like trapped pores are present in both materials. The cracks present near the interface are formed by tensile stress in STS316L caused by the difference in the CTE (coefficient of thermal expansion) between the two materials during the DED process. These results can provide fundamental information for the fabrication of machinery parts that require joining of two materials, such as valves.

• Journal of the Korean Ceramic Society
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• v.31 no.9
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• pp.1021-1029
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• 1994

SiC ultrafine particles of 1, 10, 20 and 30 vol% were dispersed in $\alpha$-Si3N4 matrix and hot-pressed under the condition of 30 MPa at 1800 and 190$0^{\circ}C$ respectively. Physical, mechanical properties and microstructures of sintered Si3N4-SiC nanocomposites were investigated. Flexural strength and density of Si3N4-10 vol% SiC nanocomposites hot-pressed at 190$0^{\circ}C$ represented the 1002 MPa and 97.9%T.D respectively, and it was confirmed as a remarkable improvement of 67% compared to Si3N4 monolith. Fracture toughness was shown as 7.2 MPa.m1/2 when the same composition was hot pressed at 180$0^{\circ}C$. This effect was supposed to be due to the improvement of microstructure by the adequate suppression of the excessive growth of Si3N4 grain with SiC nano-particles.

• Transactions on Electrical and Electronic Materials
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• v.13 no.6
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• pp.283-286
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• 2012

(1-X)$(Na_{0.5}K_{0.5})NbO_3-XK_{5.4}Cu_{1.3}Ta_{10}O_{29}$ (NKN-KCT) lead-free piezoelectric ceramics have been synthesized by the conventional solid state sintering method, and their sinterability and piezoelectric properties were investigated. Typically, this material is sintered between 1,025 and $1,100^{\circ}C$ for 2 hours to achieve the required densification. Crystalline structures and Microstructures were analyzed by X-ray diffraction and scanning electron microscope. The density, dielectric constant (${\varepsilon}_r$), piezoelectric constant $d_{33}$, electromechanical coupling factor $k_p$ and mechanical quality factor $Q_m$ value of the NKN ceramics depended upon the KCT content and the sintering temperature. In particular, the KCT addition to NKN greatly improved the mechanical quality factor $Q_m$ value. The ceramic with X = 1.0 mol% sintered at $1,050^{\circ}C$ exhibited optimum properties (${\varepsilon}_r$=246, $d_{33}$=95, $k_p$=0.38 and $Q_m$=1,826). These results indicate that the ceramic is a promising candidate material for applications in lead free piezoelectric transformer and filter materials.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.7
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• pp.563-567
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• 2011

The most widely used piezoelectric ceramics are lead oxide based ferroelectrics (PZT). However, the toxicity of lead oxide and its high vapor pressure during processing have led to a demand for alternative lead-free piezoelectric materials. We synthesized Lead-free piezoelectric ceramics of $0.96(K_{0.5}Na_{0.5})NbO_3-0.04SrZrO_3+x$ mol% $ZrO_2$ [KNN-SZ+$xZrO_2$; x= 0~0.10] doped with 0.1 wt% $MnO_2$ by a conventional solid state method. We investigated the piezoelectric properties and microstructures of these disk samples sintered in reduced atmosphere in order to evaluate the possibility of the multilayered piezoelectric ceramics having the base metal such as Ni as a internal electrode. All of these KNN-SZ samples sintered in 3%$H_2-97%N_2$ atmosphere at $1,140^{\circ}C$ exhibit pure perovskite structure irrespective of the content of $ZrO_2$. Meanwhile, the sintering denisty and piezoelectric properties such as $K_p$, $Q_m$ and $d_{33}$ of KNN-SZ samples as a function of $ZrO_2$ content show the maxima ($k_p$=28.07%, $Q_m$= 101.34, $d_{33}$= 156 pC/N) at x= 0.04 and it is likely that there is some morphotropic phase boundary(MPB) in this KNN-SZ+$xZrO_2$ composition system. These results indicate that the ceramic composition is a promising candidate material for applications in lead free multilayer piezoelectric ceramics.