• Current Optics and Photonics
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• v.2 no.6
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• pp.568-575
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• 2018

Various techniques to measure the three-dimensional (3D) surface profile of a 3D micro- or nanostructure have been proposed. However, it is difficult to apply such techniques directly to industrial uses because most of them are relatively slow, unreliable, and expensive. The HiLo optical imaging technique, which was recently introduced in the field of fluorescence imaging, is a promising wide-field imaging technique capable of high-speed imaging with a simple optical configuration. It has not been used in measuring a 3D surface profile although confocal microscopy originally developed for fluorescence imaging has been adapted to the field of 3D optical measurement for a long time. In this paper, to the best of our knowledge, the HiLo optical imaging technique for measuring a 3D surface profile is proposed for the first time. Its optical configuration and algorithm for a precisely detecting surface position are designed, optimized, and implemented. Optical performance for several 3D microscale structures is evaluated, and it is confirmed that the capability of measuring a 3D surface profile with HiLo optical imaging technique is comparable to that with confocal microscopy.

• Tribology and Lubricants
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• v.40 no.2
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• pp.47-53
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• 2024

Surface topography plays a decisive role in determining the performance of several precision components. In particular, the surface roughness of semiconductor devices affects the precision of the circuit. In this regard, the surface topography of a given surface needs to be appropriately assessed. Typically, the average roughness is used as one of the main indicators of surface finish quality because it is influenced by both dynamic and static parameters. Owing to the increasing demand for such accurate and reliable surface measurement systems, studies are continuously being conducted to understand the parameters of surface roughness and measure the average roughness with high reliability. However, the differences in the measurement methods of surface roughness are not clearly understood. Hence, in this study, the surface roughness of the back of a silicon wafer was measured using both contact and noncontact methods. Subsequently, a comparative analysis was conducted according to various surface roughness parameters to identify the differences in surface roughness depending on the measurement method. When using a 3D laser confocal microscope, even smaller surface asperities can be measured compared with the use of a 3D profiler. The results are expected to improve the understanding of the surface roughness characteristics of precision components and be used as a useful guideline for selecting the measurement method for surface topography assessment.

• Tunnel and Underground Space
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• v.12 no.4
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• pp.268-276
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• 2002

In this study, a 3D coordinate measurement system equipped with a laser displacement meter for digitizing rock joint surface was established and the digitized data were used to calculate several roughness parameters. The parameters used in this study were micro avenge inclination $angle(i_{ave})$, average slope of joint $asperity(SL_{ ave})$, root mean square of $i-angle(i_{rms})$, standard deviation of height(SDH), standard deviation of $i-angle(SD_i)$, roughness profile $index(R_P)$, and fractal dimension(D). The relationships between the roughness parameters based on the digitzation of the surface profile were analyzed. Since the measured value varied according to the degree of reflection and the variation of colors at the measuring point, rock joint surface was painted in white to minimize the influence of the surface conditions. The comparison of the measured values and roughness parameters before and after painting revealed the better consequence from measurement on the painted surfaces. Also, effect of measuring interval was studied. As measured interval was increased, roughness parameters were exponentially decreased. The incremental sequence of degree of decrease was $SDH\; i_{ave},\; i_{rms},\; SD_i,\;and\; R_ p-1$. As a result of comparison of parameters from pin-type measurement system and laser type measurement system, all value of parameters were higher when laser-type measurement system was used, except SDH.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.11
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• pp.968-973
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• 2013

In the transportation industry, especially in the shipbuilding process, 3D surface measurement of large-scale hull pieces is needed for fabrication and assembly. We suggest an efficient method for checking the shape of curved plates under the forming operation with short time by measuring 3D profiles along the multi lines of the target surface. For accurate profile reconstruction, 2D camera calibration and 3D calibration using gauge blocks were performed. The evaluation test shows that the measurement accuracy is within the boundary of tolerance required in the shipbuilding process.

• Transactions of Materials Processing
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• v.8 no.3
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• pp.294-305
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• 1999

A vision-based surface-strain measurement system has been still improved since the authors devel-oped the first version of it. New algorithms for the subpixel measurement and surface smoothing are introduced to improve the accuracy and precision in the present study. The effects of these algorithms are investigated by error analysis. And the equations required to calculate 3D surface-strain of a shell element are derived from the shape function of a linear solid finite-element. The influences of external factors on the measurement error are also examined, and several trials are made to obtain possible optimal condition which may minimize the error.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.3
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• pp.81-86
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• 2008

I present a 3-D profiler specially devised for the profile measurement of specular surfaces that requires precision shape accuracy up to a few nanometer. A profile is reconstructed from the curvature of a test part of the surface at several locations along a line. The local curvature data are acquired with White-light Scanning Interferometry. Test measurement proves that the proposed profiler is well suited for the specular surface inspection like precision mirror.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.76-81
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• 1998

The purpose of this study is the generation of B-spline surface by the 3D measurement data. The hardware of the system comprises PC and digitizing machine, machining center. There are three steps, (1) physical model measuring on the 3D laser digitizing machine, (2) B-spline surface modeling and Fairing, (3) CNC machining by the NC code. It is developed a software package, with which can conduct a micro CAM system in the PC without economical burden.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.1
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• pp.129-137
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• 2000

In this paper, a new method of noncontact measurement has been developed for a 3 dimensional topography in semiconductor wafer, implementing a new optical probe based on the precision defocus measurement. The developed technique consists of the new optical probe, precision stages, and the measurement/control system. The basic principle of the technique is to use the reflected slit beam from the specimen surface, and to measure the deviation of the specimen surface. The defocusing distance can be measured by the reflected slit beam, where the defocused image is measured by the proposed optical probe, giving very high resolution. The distance measuring formula has been proposed for the developed probe, using the laws of geometric optics. The precision calibration technique has been applied, giving about 10 nanometer resolution and 72 nanometer of four sigma uncertainty. In order to quantitize the micro pattern in the specimen surface, some efficient analysis algorithms have been developed to analyse the 3D topography pattern and some parameters of the surface. The developed system has been successfully applied to measure the wafer surface, demonstrating the line scanning feature and excellent 3 dimensional measurement capability.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.10
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• pp.119-124
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• 2000

One of the main problems in 3D shape measuring systems that use the triangulation of line-shaped laser light is precise center line detection of line-shaped laser stripe. The intensity of a line-shaped laser light stripe on the CCD image varies following to the reflection angles, colors and shapes of objects. In this paper, a new center line detection algorithm to compensate the local intensity variation on a line-shaped laser light stripe is proposed. The 3-D surface shape measuring system using the proposed center line detection algorithm can measure 3-D surface shape with enhanced measurement resolution by using the dynamic shape reconstruction with adaptive pattern clustering of the line-shaped laser light. This proposed 3-D shape measuring system can be easily applied to practical situations of measuring 3-D surface by virtue of high speed measurement and compact hardware compositions.

• Journal of the Korean Academy of Clinical Electrophysiology
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• v.3 no.1
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• pp.61-70
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• 2005

The purpose of study correlation between 3D-surface topography and Cobb angle in scoliotic patients. It would be recognizing possibility of clinical application with 3D-surface topography with scoliosis assessment and correlation analysis of obtained Cobb angle through measured results of surface topography and took X-ray of subjects with scoliosis, which used to 3D-surface topography of laser scan method. A scoliosis subjects 16(males 4, females 12) agreed for study's purport volunteer our study that diagnose the scoliosis through 3D-surface topography and X-ray. The results were as follow: It was shown that the relation of Cobb angle of scoliosis and itemized 3D-surface topography measurement in horizontal view(p<0.01). top difference of cervicothoracic and lumbar in anterior-posterior view(p<0.05), the top difference of thoracic, thoracolumbar(p<0.01). These results suggest that an itemized 3D-surface topography measurement was highly correlated with Cobb angle. It would be a useful diagnosis method and assessment of physical therapy plan.