• Journal of Information Technology Applications and Management
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• v.20 no.3_spc
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• pp.231-257
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• 2013

The recent rise in the unstructured data generated by social media has resulted in an increasing need to collect, store, search, analyze, and visualize it. These data cannot be managed effectively by using traditional data analysis methodologies because of their vast volume and unstructured nature. Therefore, many attempts are being made to analyze these unstructured data (e.g., text files and log files) by using commercial and noncommercial analytical tools. Especially, the attempt to discover meaningful knowledge by using text mining is being made in business and other areas such as politics, economics, and cultural studies. For instance, several studies have examined pending national issues by analyzing large volumes of texts on various social issues. However, it is difficult to create satisfactory information services that can identify R&D documents on specific national issues from among the various R&D resources. In other words, although users specify some words related to pending national issues as search keywords, they usually fail to retrieve the R&D information they are looking for. This is usually because of the discrepancy between the terms defining pending national issues and the corresponding terms used in R&D documents. We need a mediating logic to overcome this discrep 'ancy so that we can identify and package appropriate R&D information on specific pending national issues. In this paper, we use association analysis and social network analysis to devise a mediator for bridging the gap between the keywords defining pending national issues and those used in R&D documents. Further, we propose a methodology for packaging R&D information services for pending national issues by using the devised mediator. Finally, in order to evaluate the practical applicability of the proposed methodology, we apply it to the NTIS(National Science & Technology Information Service) system, and summarize the results in the case study section.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.39-43
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• 2009

In order to develop piezoelectric inverter module for CCFL driving, Rosen-type multilayer piezoelectric transformer was fabricated. The output power and efficiency of mutilayer piezoelectric transformer according to the variation inner electrode layer were investigated. Mutilayer piezoelectric transformer was fabricated conventional mutilayer ceramic method using PZT base ceramics. Also, piezoelectric inverter module was adopted driving circuit with half-bridge type. The piezoelectric inverter module was set up with input voltage 12.5 V, switching frequency 104.3 KHz. The results showed the value of step-up ratio 100, efficiency 87% at load resistance of $100k{\Omega}$.

• ETRI Journal
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• v.9 no.3
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• pp.127-138
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• 1987

본고에서는 MMIC (Monolithic Microwave Integrated Circuit)의 연구동향을 미국을 중심으로 소개한다. MMIC의 역사, 공정, 소자, 설계, packaging, 측정에 대하여 조사함으로써 차세대 화합물반도체 MMIC개발의 앞으로의 방향을 모색하고자 한다. 본고는 미국 Microwave & RF 논문지 1987년 3월호에 게재된 R. S. Pegally와 D. Maki의 논문내용을 중심으로 편역한 것이다.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.21 no.3
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• pp.97-106
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• 2015

Thermal deformation of packaging materials was observed in some ready-to-eat food products for microwave use. Therefore, the deformation patterns depending on packaging types and shapes of 9 domestic and 11 foreign products after microwave heating were investigated. Among the domestic and foreign products, thermal deformations of packaging material were observed in 5 and 8 samples, respectively. Besides, thermal deformation occurred on the lid and cup body of tray filled with a spicy chicken sauce after having microwaved where previously no deformation had been observed with other food types. No consistent results of thermal deformation were obtained by the analysis of salinity, brix, pH and viscosity of RTE products for microwave heating. However, thermal deformations of packages were less found in the packages used for the RTE foods contained very high or low viscosity than those with medium viscosity. Furthermore, the degree of thermal deformations was dependent on the food composition and shape as well as package type. In order to prevent the thermal deformation of packaging materials, therefore, technological advances and further studies are required to develop the heat-resistant packaging system and to improve the non-uniformity during microwave heating of RTE foods.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.11a
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• pp.61-64
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• 2000

We fabricated and characterized Low Noise Amplifier (LNA) using MCM-C (Multi-Chip-Module-Cofired) technology for 2.14 GHz IMT-2000 mobile terminal application. First, We designed LNA circuits and simulated it's high frequency characteristics using circuits simulator. For the simulation, we adopted high frequency libraries of all the devices used in LNA samples. By the simulation, Gain was 17 dB and Noise Figure was 1.4 dB. We used multilayer process of LTCC (Low Temperature Co-fired Ceramics) substrate and conductor, resistor pattern for the MCM-C LNA fabrication. We made 2 buried inductors, 2 buried capacitors and 3 buried resistors. The number of the total layers was 6. On the top layer, we patterned microstrip line and pads for the SMT device. We measured the high frequency characteristics, and the results were 14.7 dB Gain and 1.5 dB Noise Figure.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.177-179
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• 2002

본 연구는 Ag와 Ce이 함유된 유리를 용융법에 의해 제조하였으며, 355nm Nd:YAG 펄스 레이저를 조사하였을 때의 광학적 특성과 열처리과정에서 발생하는 결정화의 변화과정에 대해 평가하였다. Ce이 함유된 유리는 환원 분위기에서 제조되었으며, Optical Absorption을 통하여 Ce$^{3+}$ 이온이 존재하는 유리의 흡수대역을 관찰하고자 하였다. Photo Luminescence(PL) 측정을 통해 Ce$^{3+}$ 이 존재하고 있음을 확인하였으며, Ce$^{3+}$ 이온의 5d$\longrightarrow$4f 전이를 관찰하였다. 이와같이 Ce$^{3+}$ 가 함유된 유리는 레이저를 조사하였을 경우 PL의 강도가 저하됨을 확인하였다. 열처리과정에서 발생하는 결정화현상을 고찰하기 위해 열분석을 실시하였으며, 레이저조사된 유리에서 최대결정화온도가 감소함을 관찰하였다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.213-216
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• 2001

극자외선영역의 빛에대한 Mo/Si 반사형 다층 박막 미러를 스퍼터링 시스템으로 증착하여, 특성을 평가한 결과 3mTorr의 낮은 공정 압력에서 최적의 구조인자를 가진 다층 박막을 증착할 수 있었다. TEM, low angle XRD peak, 반사도 그래프로부터 다층 박막의 구조인자를 분석하였으며, 특히 low angle XRD peak로부터 다층박막의 d-spacing, 층간 두께 uniformity에 대한 정보 및 광학적 정보를 간접적으로 분석할 수 있었다. 최대 반사도는 12.7nm 파장에서 약 53%였으며, low angle XRD에서 추출한 d-spacing 값이 TEM 이미지에서 측정한 값보다 더 정확한 값을 얻을 수 있었다.

• Korean Journal of Optics and Photonics
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• v.11 no.3
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• pp.179-186
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• 2000

Optical coupling coefficients and misalignment tolerance of 155 Mbps optical transmitter module of passive alignment technology, to be usable in ATM system, B-NT (Broadband Network Termination) system, and 10 G transmission system for information super-highway networks, were calculated, compaired with it's engineer samples, and discussed. These engineer samples of -4.5 dBm maximum output power were packaged in the method of butt coupling of flat-fiber and tested reliability evaluation. Hence the cheap packaging method of optical transmitter module was researched. rched.

• The monthly packaging world
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• s.251
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• pp.51-63
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• 2014

바이오 플라스틱, 에코패키징, 인체 무해성 등과 관련하여 국내외적으로 다양한 규격 및 시험방법이 있다. 바이오 플라스틱(Bio plastics)은 최근 생분해 플라스틱(Biodegradable plastics), 산화생분해 플라스틱(Oxo biodegradable plastics), 바이오 베이스 플라스틱(Bio based plastics)의 3가지로 나뉘어지고 있는 추세이다. 생분해 플라스틱 규격기준은 국제규격인 ISO 14855를 기준으로 국가별로 자국내 규격기준이 제정되어 있고, 이에 따른 인증마크를 시행하고 있다. 최근에 아랍에미레이트(UAE)에서 국제 환경규제를 전면 시행하면서 부각되고 있는 산화생분해 플라스틱은 미국의 ASTM D 6954:2004, ISO 14855 등의 기준을 토대로 제정한 UAE S 5009:2009에 의해 시행되고 있다. 또한 산업화가 급속하게 추진되고 있는 바이오 베이스 플라스틱 관련한 규격 기준은 미국 ASTM D 6866을 기준으로 시행되고 있고, 일부 국가는 자국내 규격기준을 제정하여 인증라벨을 부여하고 있다. 현재 바이오 베이스 플라스틱 인증라벨은 2002년 미국을 시작으로 2006년 일본, 2009년 벨기에, 2010년 독일, 2011년 한국에서 시행되고 있다. 그 외에도 GR마크, 녹색 인증, 단체 규격 인증, 업계 자체 규격 기준 등이 다양하게 시행되고 있다.

• Journal of the Microelectronics and Packaging Society
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• v.4 no.2
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• pp.1-16
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• 1997

Modern electronic components require its sophistication to meet the stringent requirements which are demanded for high tech industry. In an attempt to meet to such demand miniaturization of the components has been considrably progressed to increase its circuit density. High density of the components can be achieved by an innovative technology of design and manufacturing with functionally improved or new materials such as small bulk devices thick films and thin films circuits (2D). Recently many efforts have been extensively made in the community of the Hybrid Microelectronics through out world. In this paper an approach is introduced in realizing a sophisticated passive circuit for the microelectronics applications by use of hybrid thick/thin films technology. The merit of this technology is discussed and the future trend is speculated.