• Structural Engineering and Mechanics
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• 제19권3호
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• pp.337-346
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• 2005

The paper reports on a study of bond strength between reduced-water-content concrete and tensile reinforcement in spliced mode. Three different diameters (12, 16 and 22 mm) of tensile steel were spliced in the constant moment zone, where there were two bars of same size in tension. For each diameter of reinforcement, a total of nine beams ($1900{\times}270{\times}180mm$) were tested, of which three beams were with no axial force (positive bending) and the other six beams were with axial force (combined bending). The splice length was selected so that bars would fail in bond, splitting the concrete cover in the splice region, before reaching the yield point. It was found that there was a considerable size effect in the experimental results, i.e., as the diameter of the reinforcement reduced the bond strength and the deflection recorded at the midspan increased significantly, whilst the stiffness of the beams reduced. It was also found for all reinforcement sizes that higher bond strength and stiffness were obtained for beams tested in combined bending than that of the beams tested in positive bending only.

• 대한기계학회논문집
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• 제18권7호
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• pp.1664-1673
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• 1994

As a fundamental study on effects of thermal-cycles on residual stress of ceramics/metal joints, residual stresses in $Si_3N_4$/SUS304 joint specimens were measured before and single thermal-cycle by X-ray diffraction method and finite element method(FEM). The residual stress was found to increase after single thermal-cycle, which was agreeable with the results of residual stress measurement by X-ray diffraction method and residual stress analysis by finite element method. After the residual stress measurement, 4-point bending tests were performed. The relationship between the bending strength, the thermal-cycle temperature and hold time was examined. The bending strength was found to decrease with the increase of residual stress in linear relation.

• 한국재료학회지
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• 제12권6호
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• pp.508-512
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• 2002

$2000{\AA}-SiO_2/Si(100)$ and $560{\AA}-Si_3N_4/Si(100)$ wafers, which are 10 cm in diameter, were directly bonded using a rapid thermal annealing method. We fixed the anneal time of 30 second and varied the anneal temperatures from 600 to $1200^{\circ}C$. The bond strength of bonded wafer pairs at given anneal temperature were evaluated by a razor blade crack opening method and a four-point bonding method, respectively. The results clearly slow that the four-point bending method is more suitable for evaluating the small bond strength of 80~430 mJ/$\m^2$ compared to the razor blade crack opening method, which shows no anneal temperature dependence in small bond strength.

• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2006년 창립20주년기념 정기학술대회 및 국제워크샵
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• pp.166-168
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• 2006

$Si_3N_4/SiC$ composite ceramics was sintered in order to investigate their bending strength behavior after crack healing. $Y_2O_$ and $TiO_2$ power was added as sintering additives to enhance it's sintering property. A three-point bending specimen was cut out from sintered plates. About $100\;{\mu}m$ semi-circular surface cracks were made on the center of the tension surface of the three-point bending specimen using Vickers indenter. After the crack-healing processing from $500^{\circ}C$ to $1300^{\circ}C$, for 1 h, in air, the bending strength behavior of these crack-healed specimen coated with $SiO_2$ colloidal were determined systematically at room temperature. $Si_3N_4/SiC$ ceramics using additive powder ($Y_2O_3+TiO_2$) was superior to that of additive powder $Y_2O_3$. The additive powder $TiO_2$ exerted influence at growth of $Si_3N_4$. The optimum crack healing conditions coated $SiO_2$ colloidal were $1000^{\circ}C$ at $Si_3N_4/SiC$ using additive powder ($Y_2O_3+TiO_2$), and $1300^{\circ}C$ at $Si_3N_4/SiC$ using additive powder $Y_2O_3$.

• 반도체디스플레이기술학회지
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• 제5권3호
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• pp.5-10
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• 2006

This paper investigates cutting qualities after laser dicing and predicts the problems that can be generated by laser dicing. And through 3 point bending test, die strength is measured and the die strength after laser dicing is compared with the die strength after mechanical sawing. Laser dicing is chiefly considered as an alternative to overcome the defects of mechanical sawing such as chipping on the surface and crack on the back side. Laser micromachining is based on the thermal ablation and evaporation mechanism. As a result of laser dicing experiments, debris on the surface of wafer is observed. To eliminate the debris and protect the surface, an experiment is done using a water soluble coating material and ultrasonic. The consequence is that most of debris is removed. But there are some residues around the cutting line. Unlike mechanical sawing, chipping on the surface and crack on the back side is not observed. The cross section of cutting line by laser dicing is rough as compared with that by mechanical sawing. But micro crack can not be seen. Micro crack reduces die strength. To measure this, 3 point bending test is done. The die strength after laser dicing decreases to a half of the die strength after mechanical sawing. This means that die cracking during package assembly can occur.

• 대한치과보철학회지
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• 제37권6호
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• pp.767-775
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• 1999

The purpose of this study was to evaluate the effect of wattage and curing time on surface hard-ness, three-point bending strength and internal porosity of microwave curing denture base resin. Two sizes of resin specimens were made of Acron $MC^{(R)}\;;\;3.5{\times}10{\times}60mm$ for surface hardness and three-point bending strength measurement and $5{\times}12{\times}60mm$ for internal porosity measurement. They were cured by microwave energy at varing wattages(500W, 700W) and curing times(2min., 3min., 4min.) to determine if a certain wattage/curing time combination would improve physical properties. Surface hardness was measured with Vikers hardness tester, three-point bend-ing strength with universal testing machine and internal porosity was calculated by measuring the weight in air and in water. The results obtained were as follows: 1. There was no significant difference in percent porosity among experimental groups(p>0.05). 2. 500W/3min. group showed the higher surface hardness than 700W/2, 3, 4min. groups(p<0.05), and 700W/4 min. group showed the lower surface hardness than 500W/2, 3, 4min. groups(p<0.05), but there was no significant difference among others(p>0.05). 3. 500W/3min. group yielded the higher value of bending strength than 500W/2min., 700W/3, 4min. groups(p<0.05), but there was no significant difference among others(p>0.05).

• 대한금속재료학회지
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• 제50권2호
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• pp.146-151
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• 2012

The present article shows how the fracture strength of single crystal silicon chips, which are generally used as semiconductor devices, is influenced by loading rate variation during a 3-point bending test. It was found that the fracture strength of the silicon chips slightly increases up to 4% with increasing loading rate for loading rates lower than 20 mm/min. Meanwhile, the fracture strength of the chips hardly increases with increase of loading rate to levels higher than 40 mm/min. However, there was an abrupt transition in the fracture strength within a loading rate range of 20 mm/min to 40 mm/min. This work explains through microscopic examination of the fracture surface of all test chips that such a big transition is related to the deflection of crack propagation direction from the (011) [${\bar{1}}00$] system to the (111) [${\bar{2}}11$] system in a particular loading rate (i.e. from 20 mm/min to 40 mm/min).

• 동력기계공학회지
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• 제8권4호
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• pp.44-48
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• 2004

For many years researchers have been attempting to establish the relations among the preparation history, structure and properties of ceramics. In this study, the strength property of $Al_2O_3$ ceramics with components and giudes of the textile machinery was investigated. The optimized conditions of ressureless sintering were investigated in order to obtain the maximum strength of $Al_2O_3$ ceramics for using at the textile machinery. As the sintering conditions, $1,400{\sim}1,700^{\circ}C$ of temperatures and $30{\sim}150$ minutes of times were applied. Three-point bending test was conducted on the sintered materials to obtain the strength property. From test results, the optimum sintering temperature has $1,600^{\circ}C$. And the optimum sintering time in $1,600^{\circ}C$ has about 100 minutes.

• Journal of the Korean Wood Science and Technology
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• 제41권4호
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• pp.318-326
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• 2013

소나무와 스프루스재를 사용하여 핑거공차를 0.15 mm로 고정하고 핑거피치 4.4 mm (Type S)와 6.8 mm(Type L)의 2종류 및 레조시놀 페놀 수지 접착제 및 수용성 비닐 우레탄 수지접착제로 2종류의 사용하여 종접합시키고 또한 2본의 종접합재를 이용하여 횡방향으로 핑거접합부를 양쪽으로 이동시키면서 접착하여 핑거접합부위의 배치거리를 접합재의 두께를 기준으로 하중점 중앙으로부터 양쪽 핑거접합부까지의 거리를 접합재 두께의 비율($R_t$) 0, 1.5, 2, 2.5, 3배의 5조건으로 제조하여 3점 중앙집중식 휨강도성능시험을 한 결과는 다음과 같다. 1) 휨탄성계수는 핑거접합부의 위치 이동과 관계없이 접착제의 종류, 핑거의 형상에 따른 영향은 나타나지 않았다. 2) 휨강도는 접착제의 종류, 핑거의 형상에 관계없이 하중점 중앙에서부터 멀어질수록 거의 직선적으로 증가하였으며 핑거접합부가 소재두께 비율의 3배에서는 소재와 같은 값을 나타내었다. 3) 시험편의 파괴는 하중점 중앙에서부터의 핑거접합부까지의 거리가 두께의 비율이 0, 1.5배에서 모두 핑거접합부에서 파괴되었으며 거리가 멀어질수록 접합부에서의 파괴가 적게 일어나다가 두께비율의 3배에서는 전혀 나타나지 않았다.

• 대한치과기공학회지
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• 제32권4호
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• pp.351-356
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• 2010

Purpose: The purpose of this study was to evaluate the fracture strength between the core and veneering ceramic according to 2 core materials, In-Ceram Alumina and In-Ceram Zirconia, fabricated by electro ceramic layering technique. 2 different fixed partial denture cores of three units were veneered by veneering ceramic(Ceranion, Noritake) (n=10). Methods: The fracture strengths between the core and veneering ceramic were measured through the 3 point bending test. The interfaces between the core and veneering ceramic were observed with the X-ray dot mapping of EPMA. Results: The result of fracture strength was observed that IZP group, In-Ceram Zirconia core, had higher fracture strength. IPA group, In-Ceram Alumina core, had fracture strength of 359.9(${\pm}$86.2) N. IZP group, In-Ceram Zirconia core, had fracture strength of 823.2(${\pm}$243.0) N. X-ray dot mapping observation showed that a major element in the core and veneering ceramic of IPA group was alumina and silica, respectively. No binder was observed in interfaces between the core and veneering ceramic, and no ion diffusion or transition was observed between the core and veneering ceramic. However, apparent ion diffusion or transition was observed between the core and veneering ceramic of IZP group.