• Title/Summary/Keyword: 3차원 회로 프린팅 장치

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Basic Research For The 3DCD (3D Circuit Devices) (3DCD (3D Circuit Devices) 개발을 위한 기초 연구)

  • Yun, Hae Yong;Kim, Ho Chan
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.12
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    • pp.1061-1066
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    • 2014
  • Generally electrical circuits are fabricated as PCB(Printed Circuit Board) and mounted on a casing of the product. And it requires lots of other parts and some labor for assembly. Recently a molding technology is increasingly applied to embed simple circuits on a plastic casing. The technology is called as MID(Molded Interconnected Device). Therefore this paper introduces a new MID fabrication process by using direct 3D printing technology.