• 한국정밀공학회지
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• 제31권12호
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• pp.1061-1066
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• 2014

Generally electrical circuits are fabricated as PCB(Printed Circuit Board) and mounted on a casing of the product. And it requires lots of other parts and some labor for assembly. Recently a molding technology is increasingly applied to embed simple circuits on a plastic casing. The technology is called as MID(Molded Interconnected Device). Therefore this paper introduces a new MID fabrication process by using direct 3D printing technology.