• Journal of Korean Society for Atmospheric Environment
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• v.22 no.3
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• pp.373-381
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• 2006

The catalytic combustion of toluene was investigated on the Cu-Mn oxide catalysts prepared by the deposition-precipitation method. Experiment of toluene combustion was performed with a fixed bed flow reactor in the temperature range of $100{\sim}280^{\circ}C$. Among the catalysts, 1.29Cu/Mn showed the most activity at $260^{\circ}C$. The deposition-precipitation method may be showed the potential to enhance the activity of catalysts. The catalysts were characterized by BET, scanning electron microscopy (SEM), temperature-programmed reduction (TPR), X-ray photoelectron spectroscopy (XPS) and X-ray diffraction (XRD) techniques. On the basis of catalyst characterization data, the results showed that the surface of catalysts by deposition-precipitation method had uniform distribution and smaller particle size, which enhanced the reduction capability of catalysts. The XRD results showed that $Cu_{1.5}Mn_{1.5}O_{4}$ spinel phase was made by deposition-precipitation method, and increased catalyst activity and redox characteristic. It was assumed that the reduction step of $Cu_{1.5}Mn_{1.5}O_{4}$ spinel phase progressed $Cu_{1.5}Mn_{1.5}O_{4}\;to\;CuMnO_{2},\;and\;Cu_{2}O\;to\;CuMn_{2}O_{4}\;and\;Cu$.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.7 no.2
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• pp.207-215
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• 1997

Aluminum (Al) thin films were deposited on the Si(100) and TiN(60 nm)/Si (100) substrate by the ionized cluster beam deposition (ICBD) method. The characteristics of thin films were examined by the $\alpha$-step, four-point-probe, Scanning Electron Spectroscopy (SEM), Auger Electron Spectroscopy (AES). The growth rate of the Al thin film increased and the resistivity decreased as the crucible temperature increased. At the crucible temperature $1800^{\circ}C$, the microstructure of Al thin film deposited was smooth and continuous the resistivity decreased as the acceleration voltage increased. Also, the minimum resistivity in Si(100) substrate and TiN(60 nm)/Si(100) substrate were 3.4 $\mu \Omega \textrm {cm}$, 3.6 $\mu \Omega \textrm {cm}$ at the acceleration voltage 4 kV and 2 kV respectively. From the AES spectrumt 14 wasn't detected any impurities In the Al thin film. Therefore the resistivity of Al thin film was affected by the microstructure of film.

• Journal of Korean Vacuum Science & Technology
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• v.3 no.1
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• pp.16-23
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• 1999

Deposition of parylene (PA) films has been explored at substrate temperatures below 2$0^{\circ}C$ and pressures below 4 torr. The film thickness was measured using AFM and the film thickness measured was 3,500-12,000$\AA$ and the growth rate was 20-70$\AA$/min. T도 dielectric constant of the deposited PA films was found to be 2.66 and the dielectric strength was in excess of 2$\times$105V/cm. The growth rate became a maximum at a precursor decomposition temperature of $600^{\circ}C$. It was found that the growth rate decreased with increasing substrate temperature, whereas it increased with increasing pressure. At a precursor decomposition temperature of 75$0^{\circ}C$ or at a deposition pressure above 1 Torr the film surface became rough due to particle formation in the gas phase. The condensation of a p-xylylene monomer on the substrate surface turned out to be a rate-limiting step in the growth of the PA films.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.6
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• pp.518-523
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• 2002

The influences of ion beam energy and reactive oxygen partial pressure on the physical and crystallographic characteristics of transition metal oxide compound(CrOx) film were studied in this paper. Chromium oxide films were deposited onto a cover-glass using ion Beam Sputter Deposition(IBSD) technique according to the various processing parameters. Crystallinity and grain size of as-deposited films were analyzed using XRD analysis. Thickness and Resistivity of the films were measured by $\alpha$-step and 4-point probe measurement. According to the XRD, XPS and resistivity results, the deposited films were the cermet type films which had crystal structure including amorphous oxide(a-oxide) phase and metal Cr phase simultaneously. The increment of the ion beam energy during the deposition process led to decreasing of metal Cr grain size and the rapid change of resistivity above the critical $O_2$ partial pressure.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.12a
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• pp.59-63
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• 2003

체적 음향파 공진기(Film bulk acoustic resonator, FBAR)는 2~10 Ghz 대역의 차세대 이동 통신용 구현에 필수적인 부품이기 때문에 국내외에서 활발한 연구가 진행되고 있다. 본 논문에서는 FBAR 소자 제조를 위한 연구에서 원자층 증착(Atomic layer deposition, ALD) 방법에 의한 ZnO buffer layer 위에 스퍼터링 방법을 이용한 2-step 방법을 사용하여 제조하였다. ALD를 이용한 ZnO buffer layer는 diethylzinc(DEZn)/$H_2O$를 순차적으로 주입하여 증착하였다. 이 때 두 원료물질 사이에 고순도 Ar 가스를 purge gas로 사용하였다. 원료의 주입시간은 1초, 원료간 purge 시간은 23 초로 하고 증착하였다. 2-step 방법을 이용할 경우, 스퍼터링 방법만을 이용하였을 때 보다 우수한 c-축 배향성 및 박막의 표면형상이 관찰되었다. 2-step 방법을 FBAR 소자 제작에 적용할 경우 보다 우수한 특성의 공진기를 제작할 수 있을 것으로 기대된다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.33-33
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• 2001

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.478.2-478.2
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• 2014

Atomic layer deposition (ALD) provides self-limiting processes based on chemisorption-based reactions. Such unique features allow for superior step coverage, atomic-scale control in thickness, and surface-dependent reaction controls. Furthermore, the surface-limited deposition enables the artificial deposition of oxide and/or metallic materials onto the porous systems as long as the supply is guaranteed in terms of time in providing reactant species and removing the byproducts and redundant reactants. The unique feature of atomic layer deposition is applied to solid oxide fuel cells whose incorporates two porous cathode and anode compartments in addition to the ionic electrolyte. Specific materials are deposited to the surface sites of porous electrodes, with the aim to controlling the triple phase boundaries crucial for the optimized SOFC performances. The effect of ALD on the SOFC performance is characterized using current-voltage characteristics in addition to frequency-dependent impedance spectroscopy. The pros and cons of ALD-controlled SOFCs are discussed toward high-performance SOFC systems.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1997.06a
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• pp.275-280
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• 1997

We have investigated the deposition characteristics of (Ni0.8Fe0.2)20Ag80 thin films as a function of chamber pressure and nitrogen flow rate with scanning electron microscopy(SEM), atomic force microscopy(AFM), XRD and $\alpha$-step. The deposition rate of these film is decreased with increasing the chamber pressure and the nitrogen flow rate. With raising the chamber pressure, the growth mode of thin film is changed from island growth to columnar one, which is probably due to energy of atom. Contrary, the nitrogen flow rate is raised, growth mode is changed from columnar to island one. According to the XRD patterns, the preferred orientation is inhibited as the nitrogen flow rate is kept above 10 sccm, but that is nearly independent on the chamber pressure. When the chamber pressure decrease or the nitrogen flow rate increase, phase separation into permoally and silver is occured.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.8
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• pp.49-55
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• 1992

We Have investigated the properties of the titanium nitrite films widely used in VLSI devices as diffusion barrier in Al-based metallization. TiN films were formed by reactive sputtering from Ti target in Ar-N$_2$ mixtures, varying deposition parameters such as N$_2$ partial pressure, substrate temperature, power, and total pressure. All the samples received the heat treatment at 45$0^{\circ}C$ for 30 min. The resulting films are characterized by mechanical stylus($\alpha$-step), x-ray diffraction(XRD), scanning electron microscopy(SEM), and four point probe method. The Tin film properties strongly depend on the deposition condition. The stoichiometry and Ti deposition rate are critically affected by nitrogen partial pressure, and the resistivity, in particular, is dependent on both the substrate temperature and sputtering power.

• Journal of the Korean Ceramic Society
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• v.24 no.2
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• pp.170-178
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• 1987

Changes of the properties of PECVD-SiN film with the variation of deposition process parameters were investigated and optimum process parameters were determined. The refractive index of the film increased with increasing substrate temperature and pressure, and decreasing rf-power, NH3/SiH4 gas ratio and total gas flow. BHF etch rate and deposition rate show a decreasing tendency with increasing refractive index. The step coverage of the film was not affected much by deposition rate and pressure, but improved apparently with increasing rf-power and NH3/SiH4 gas ratio. Also the optimum process parameters were determined by considering the characteristic properties as well as thickness uniformity of films. The refractive index of the film deposited under this condition was 2.06.