• New & Renewable Energy
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• v.17 no.4
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• pp.36-45
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• 2021

To remove the Cu secondary phase remaining on the surface of a CIGSSe absorber layer manufactured by the two-step process, KCN etching was applied before depositing the CdS buffer layer. In addition, it was possible to increase the conversion efficiency by air annealing after forming the CdS buffer layer. In this study, various pre-treatment/post-treatment conditions wereapplied to the S-containing CIGSSe absorber layerbefore and after formation of the CdS buffer layer to experimentally confirm whether similareffects as those of Se-terminated CIGSe were exhibited. Contrary to expectations, it was noted that CdS air annealing had negative effects.

• Advances in Energy Research
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• v.3 no.2
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• pp.117-124
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• 2015

In this paper, we have reported an enhancement in thermoelectric properties of un-doped zinc oxide (ZnO) grown by molecular beam epitaxy (MBE) on silicon (001) substrate by annealing treatment. The grown ZnO thin films were annealed in oxygen environment at $500^{\circ}C-800^{\circ}C$, keeping a step of $100^{\circ}C$ for one hour. Room temperature Seekbeck measurements showed that Seebeck coefficient and power factor increased from 222 to $510{\mu}V/K$ and $8.8{\times}10^{-6}$ to $2.6{\times}10^{-4}Wm^{-1}K^{-2}$ as annealing temperature increased from 500 to $800^{\circ}C$ respectively. This observation was related with the improvement of crystal structure of grown films with annealing temperature. X-ray diffraction (XRD) results demonstrated that full width half maximum (FWHM) of ZnO (002) plane decreased and crystalline size increased as the annealing temperature increased. Photoluminescence study revealed that the intensity of band edge emission increased and defect emission decreased as annealing temperature increased because the density of oxygen vacancy related donor defects decreased with annealing temperature. This argument was further justified by the Hall measurements which showed a decreasing trend of carrier concentration with annealing temperature.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.11
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• pp.734-739
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• 2017

We prepared $SnS_x$ thin films on both soda-lime glass (SLG) and molybdenum(Mo)/SLG substrates by a two-step process using a Sn precursor followed by sulfur reaction in rapid thermal annealing (RTA) at different sulfurization temperatures ($Ts=200^{\circ}C$, $230^{\circ}C$, $250^{\circ}C$, and $300^{\circ}C$) and annealing times ($t_s=10min$ and 30 min). The single SnS phase was dominant for $200^{\circ}C{\leq}T_s$<$250^{\circ}C$, while an additional phase of $SnS_2$ was appeared at $T_s{\geq}250^{\circ}C$ alongside SnS. The SnS grains in all the samples showed strong growth along the preferred [040] direction. The band-gap energy ($E_g$) of the films was estimated to be 1.24 eV.

• Electrical & Electronic Materials
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• v.9 no.6
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• pp.584-592
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• 1996

Coupling optical modulator which on the $LiTaO_3$ substrate is fabricated by using proton exchange method and self-aligned method. Proton exchange of proton diffusion method was applied to pattern a waveguide on $LiTaO_3$ substrate. The annealing at >$400^{\circ}C$ was carded out to control waveguide width and depth. The depths of the two annealed optical waveguides, which were measured by using .alpha.-step, were 1.435 K.angs. and 1.380 K.angs. Using .alpha.-step facility, we examined that the width of waveguides is increased from 5.mu.m to 6.45 .mu.m and 6.3.mu.m due to the annealing effects. The process of proton exchange was done at 150.deg. C for 120 min, >$200^{\circ}C$ for 60 min and annealing process was done at >$400^{\circ}C$ for 90 min, >$400^{\circ}C$ for 60 min. The high speed coupling optical modulator has very good figures of merits; the measured high frequency power were achieved.

• Journal of the Korean Vacuum Society
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• v.2 no.2
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• pp.161-165
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• 1993

The geometrical and electronic structure of epitaxially grown Ge on Si(100) and Si(111) surfaces has been studied by scanning tunneling microscopy. Since Ge atoms could be distinguished from Si atoms by scanning tunneling spectroscopy and voltage dependent STM images, the growth mode of the added layer could be studied. On the (100) surface with a (2${\times}$1) reconstruction, Ge overlayer grow preferentially on the B type step edges at 720K. On the (111) surface, Ge overlayer also grow on the step edges with (7${\times}$7) and (5${\times}$5) structure depending on their coverage and annealing temperature.

• Journal of Ceramic Processing Research
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• v.13 no.spc1
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• pp.59-63
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• 2012

Ga2O3-core/CdO-shell nanowires were synthesized by a two step process comprising thermal evaporation of GaN powders and sputter-deposition of CdO. Transmission electron microscopy (TEM) and X-ray diffraction (XRD) analyses revealed that the cores and the shells of the annealed coaxial nanowires were single crystal of monoclinic Ga2O3 and FCC CdO, respectively. As-synthesized Ga2O3 nanowires showed a broad emission band at approximately 460 nm in the blue region. The blue emission intensity of the Ga2O3 nanowires was slightly decreased by CdO coating, but it was significantly increased by subsequent thermal annealing in a reducing atmosphere. The major emission peak was also shifted from ~500 nm by annealing in a reducing atmosphere, which is attributed to the increases in the Cd interstitial and O vacancy concentrations in the cores.

• Journal of the Korean institute of surface engineering
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• v.33 no.2
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• pp.101-106
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• 2000

SOI (Silicon-On-Insulator) substrates were fabricated with varying annealing temperature of $25-660^{\circ}C$ by a linear annealing method, which was modified RTA process using a linear shape heat source. The annealing method was applied to Si ∥ $SiO_2$/Si pair pre-contacted at room temperature after wet cleaning process. The bonding strength of SOI substrates was measured by two methods of Razor-blade crack opening and direct tensile test. The fractured surfaces after direct tensile test were also investigated by the optical microscope as well as $\alpha$-STEP gauge. The interface bonding energy was 1140mJ/m$^2$ at the annealing temperature of $430^{\circ}C$. The fracture strength was about 21MPa at the temperature of $430^{\circ}C$. These mechanical properties were not reported with the conventional furnace annealing or rapid thermal annealing method at the temperature below $500^{\circ}C$. Our results imply that the bonded wafer pair could endure CMP (Chemo-Mechanical Polishing) or Lapping process without debonding, fracture or dopant redistribution.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.2
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• pp.174-179
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• 2011

This paper focuses on the optimal step-over value for magnetic tool path. Since magnetic flux density is changed according to distance from center of magnetic tool. Enhanced surface roughness is also different according to change of radius. Therefore, to get a identical surface roughness on workpiece, it is necessary to find optimal tool path including step-over. In this study, response surface models for surface roughness according to change of radiuses were developed, and then optimal enhanced surface roughness for each radius was selected using genetic algorithm and simulated annealing to investigate relation between radius and surface roughness. As a result, it found that step-over value of 6.6mm is suitable for MAP of magnesium alloy.

• Korean Journal of Materials Research
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• v.5 no.6
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• pp.723-731
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• 1995

P $b_2$S $r_2$( $Y_{1-x}$ C $a_{x}$)C $u_3$ $O_{8+}$$\delta$/ samples were prepared with x=0.4~0.6 and small $\delta$. To minimize the extent of oxidative decomposition reaction which occurs during the preparation of this phase, two annealing steps were adopted : First, sintered samples of P $b_2$S $r_2$( $Y_{1-x}$ C $a_{x}$)C $u_3$ $O_{8+}$$\delta$/ are oxygenated under 100% $O_2$, which leads to a large $\delta$(e.g., $\delta$=1.8). Second, the resulting samples are deoxygenated under 0.1~1.0% $O_2$in $N_2$, lowering $\delta$ to desired values. This two-step annealing procedure minimized the extent of oxidative decomposition. However, even with the two-step annealing procedure, the oxidative decomposition of P $b_2$S $r_2$( $Y_{1-x}$ C $a_{x}$)C $u_3$ $O_{8+}$$\delta$/ cannot be completely suppressed if $\delta$ is to be reduced to maximize $T_{c}$. Electrical resistivity data show that $T_{c}$(onset) is a function of hole concentration in the Cu $O_2$layer, and the optimum hole concentration for the maximum $T_{c}$ is achieved when $Ca^{2+}$is substituted for $Y^{3+}$between 0.5 and 0.6 A $T_{c}$(onset)=80K has been observed for one such sample, and this is the highest $T_{c}$(onset) yet reported for this compound.ed for this compound.nd.

• 한국초전도학회:학술대회논문집
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• v.9
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• pp.87-90
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• 1999

We have studied the annealing effects of 570 (SrTiO$_3$) single crystal substrate and the I-V properties of step-edge junctions after Ar ion milling. YBa$_2Cu_3O_7$ (YBCO) thin films are fabricated on the substrates by using pulsed laser deposition (PLD) and photolithography. The surface of Ar ion milled substrate was characterized with atomic force microscope (AFM) and scanning electron microscope (SEM) images. After the substrate was damaged by milling, the critical current density of YBCO thin films deposited on the substrate was lowered. The annealing of the damaged substrate at about 1000 $^{\circ}C$ recovered the critical current density to that before the milling. Futhermore the annealing helped junction formation due to high quality film and increased the yield rate for the fabrication of high quality step-edge junction.