• Title/Summary/Keyword: 2-sphere

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Study on the Breakdown of the Transformer Insulating Oil in Nonuniform Electric Field (불평등 전계에서 변압기 절연유 절연파괴 연구)

  • Ha-Young Cho;Soon-Hyung Lee;Mi-Yong Hwang;Yong-Sung Choi
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.36 no.3
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    • pp.280-285
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    • 2023
  • A breakdown voltage and breakdown electric field of the transformer insulating oil of liquid dielectric were studied in uniform electric field and non-uniform electric field and the transformer insulating oil was observed by the process reached breakdown. Insulation performance evaluation of the liquid dielectric was evaluated at the electrode spacing of 2.5 mm under the conditions of domestic and international standards (KS C IEC 60156), so a comparative review was conducted at the electrode spacing of 2.5 mm. When the electrode spacing is 2.5 mm, the average breakdown voltage is 38.5 kV for sphere-sphere electrodes, 26.6 kV for plate-plate electrodes, 22.9 kV for needle-needle electrodes, and 24.3 kV for sphere-needle electrodes. 23.7 kV for the sphere-plate electrode, and 20.7 kV for the needle-plate electrode. From these results, it can be seen that the average value of the breakdown voltage at the electrode spacing of 2.5 mm, in ascending order, is sphere-sphere, plate-plate, sphere-needle, sphere-plate, needle-needle and needle-plate. It was found that the breakdown voltage of the unequal field was lower than that of the equal field.

Sparkover Voltage Estimation of Standard Sphere Gaps for Negative Polarity by Calculation of Ionization Index

  • Nishikori, Yasuo;Kojima, Soji;Kouno, Teruya
    • KIEE International Transactions on Electrophysics and Applications
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    • v.4C no.2
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    • pp.45-50
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    • 2004
  • The field utilization factor (equation omitted) (the mean electric field / the maximum electric field) of standard sphere gaps was calculated by the charge simulation method, taking into account the ground plane and shanks. n changes mainly with g/r and slightly with 1$_1$, 1$_2$ and 1, where D=2r is the sphere diameter, g is the gap length, 1$_1$ and 1$_2$, respectively, are the lengths of the upper and lower shank, and t is the shank diameter. Generally, (equation omitted) increases as 1$_1$,1$_2$ and t each becomes larger. IEC standard 60052(2002) limits t$\leq$0.2D 1$_1$$\geq$1D and prescribes A=1$_2$+D+g where A is the height of the spark point on the upper sphere. Therefore, (equation omitted) is the largest when A=9D and the smallest when A=3D. The simple equation of a straight line, (equation omitted)=1- (g/3r), can generally be used as a representative value of (equation omitted) for a wide variety of sphere diameters that are permitted by the IEC standard. The maximum electric field E$_{m}$ at sparkover of standard air gaps has also been calculated by the relation E$_{m}$=V/(equation omitted)g). E$_{m}$ describes a U-curve for g/r, up to the sphere diameter of 1 m. Moreover, for 1.5-m and 2-m diameters and especially .for negative polarity, sparkover voltages have been calculated by integration of the ionization index.index.

Formation of CdSe Hollow Sphere by In-Situ-Template-Interface Reaction (ISTIR) Method (In-Situ-Template-Interface Reaction (ISTIR)법에 의한 CdSe 중공 입자의 형성)

  • Choi Moon-Hee;Lee Yoon-Bok;Kim Hyong-Kuk;Rhyim Young-Mok;Kim Jin-Chun;Kim Young-Seok;Kim Yang-Do
    • Journal of Powder Materials
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    • v.12 no.4 s.51
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    • pp.291-295
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    • 2005
  • CdSe hollow sphere with average size of about 30-50 nm was synthesized from the mixed solution of cadmium chloride $(CdCl_2)$, sodium selenosulfate $(Na_2SeSO_3)$ and ethylenediamine(EDA, $H_2NCH_2CH_2NH_2$) at room temperature. The molar ratio of EDA to $Cd^{2+}$ showed the most significant effect on the morphology of CdSe hollow sphere. This paper will present and discuss the possible formation mechanism of CdSe hollow sphere based on the observation of morphological changes.

HYPERSURFACES IN A 6-DIMENSIONAL SPHERE

  • Hashimoto, Hideya;Funabashi, Shoichi
    • Journal of the Korean Mathematical Society
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    • v.34 no.1
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    • pp.23-42
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    • 1997
  • A 6-dimensional sphere considered as a homogeneous space $G_2/SU(3)$ where $G_2$ is the group of automorphism of the octonians O. From this representation, we can define an almost comlex structure on a 6-dimensional sphere by making use of the vector cross product of the octonians. Also it is known that a homogeneous space $G_2/U(2)$ coincides with the Grassmann manifold of oriented 2-planes of a 7-dimensional Euclidean space.

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The solid angle estimation of acetabular coverage of the femoral head (입체각을 이용한 관골구와 대퇴골두의 접촉영역 측정)

  • 최교환;임제택;김선일
    • Journal of the Korean Institute of Telematics and Electronics S
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    • v.35S no.2
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    • pp.79-88
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    • 1998
  • We developed a method for the solid angle estimation of acetabular coverage of the femoral head in 3D space. The superior half of the femoral head is modeled as part of a sphere. And the tangent lines connecting from a set of points of the acetabular outline to the center of the fitted sphere are obtained. The lines passthrough the unit sphere whose center is the same as that of the femoral head. The interesecting points form a boundary on the unit sphere. With the points on the unit sphere, we calculate the covered area of the femoral headand estimate the solid angle. Solid angle is defined asthe suface area within the boundary on the unit sphere. In this measurements, the solid angle of normal subjects is on an average 4.3(rad) and the corresponding acetabular coverage is 68%. Unlinke the conventional methods, this solid angle estimation shows real 3D acetabular coverage.

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Numerical Simulation of Acoustic Field Interacting between a Vortex Ring and a Rigid Sphere (원형 고리와와 강체구의 상호작용에 의한 음향장 수치해석)

  • 유기완;이덕주
    • Journal of KSNVE
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    • v.7 no.2
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    • pp.215-222
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    • 1997
  • The flow and acoustic fields due to a vortex ring interaction with a rigid sphere are simulated numerically. The flow field is regarded as three-dimensional inviscid and incompressible. The vorticity is assumed to be concentrated inside the finite core of vortex filament. The vortex filament curve, described by parabolic blending curve function, is used to effectively solve the modified Biot-Savart equation. The interaction between a vortex ring and a rigid sphere using the parabolic blending curve is calculated. The trajectory of the vortex ring is obtained with several different initial positions between the ring and the sphere. The force variations acting on the sphere are calculated by using the boundary integral method. Finally, we can also obtain the acoustic signals at the far field observation positions from the force variations acting on the rigid surface. We can find that the dipole axis of the directivity patterns are rotated during the interacting phenomena.

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Study on the thermal and flow characteristics around a sphere submerged in the fluid (유체속에 잠긴 구주위에서의 열 및 유동특성에 관한 연구)

  • ;;Lim, Kyung Bin
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.5 no.3
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    • pp.238-243
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    • 1981
  • An empirical formula for the mass flow rate in natural convection flume above a spherical heated body which is submerged in a finite fluid contained in a tank was determined. The ratio of depth of submergence to diameter of the sphere for which the sphere sensed as infinite medium was found to be bigger than 7. A dimensionless heat transfer correlation for the natural convection from a sphere was determined for Gr.Prq etween 7x10$\^$7/ and 2x10$\^$8/ also.

Sorption of $UO^{2+}_2$ onto Goethite and Kaolinite: Mechanistic Modeling Approach

  • Jinho Jung;Lee, Jae-Kwang;Cho, Young-Hwan;Keum, Dong-Kwon;Hahn, Pil-Soo
    • Nuclear Engineering and Technology
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    • v.31 no.2
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    • pp.182-191
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    • 1999
  • The sorption of UO$_{2}$$^{2+}$ onto goethite and kaolinite under various experimental conditions was successfully interpreted using surface complexation modeling (SCM). The SCM approach used in this work is the triple-layer model (TLM) in which weakly bonded ions are modeled as outer-sphere (ion-pair) complexes and strongly bonded ions as inner-sphere (surface coordination) complexes. The change of ionic strength did not affect the U(VI) sorption onto goethite, thus the formation of inner-sphere surface complexes, (FeO)$_2$UO$_2$ and (FeO)$_2$(UO$_2$)$_3$OH$_{5}$ was assumed to simulate the effects of ionic strength and goethite concentration. On the other hand, the U(VI) sorption onto kaolinite showed ionic strength dependence, thus the formation of AlO-UO$_{2}$$^{2+}$(outer-sphere complex) and SiO(UO$_2$)$_3$OH$_{5}$ (inner-sphere complex) was assumed to simulate the experimental data. In the presence of carbonates, the sorption of U(VI) onto kaolinite decreased in the weakly alkaline pH range. This was well simulated assuming the formation of a outer-sphere surface complex, A1OH$^{2+}$- (UO$_2$)$_2$CO$_3$OH$_3$. Since SCM approach uses thermodynamic data such as surface complexation constants, it is more predictive than empirical modeling approach in which conditional values such as partition coefficient are used. used.

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Optimized O2 Plasma Surface Treatment for Uniform Sphere Lithography on Hydrophobic Photoresist Surfaces

  • Yebin Ahn;Jongchul Lee;Hanseok Kwon;Jungbin Hong;Han-Don Um
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.37 no.2
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    • pp.188-194
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    • 2024
  • This paper introduces an optimized oxygen (O2) plasma surface treatment technique to enhance sphere lithography on hydrophobic photoresist surfaces. The focus is on semiconductor manufacturing, particularly the creation of finer structures beyond the capabilities of traditional photolithography. The key breakthrough is a method that makes substrate surfaces hydrophilic without altering photoresist patterns. This is achieved by meticulously controlling the O2 plasma treatment duration. The result is the consistent formation of nano and microscale patterns across large areas. From an academic perspective, the study deepens our understanding of surface treatments in pattern formation. Industrially, it heralds significant progress in semiconductor and precision manufacturing sectors, promising enhanced capabilities and efficiency.