• Proceedings of the IEEK Conference
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• 1999.11a
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• pp.113-116
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• 1999

This paper presents a hardware architecture of AAL(ATM Adaptation Layer) type 2 switch. The proposed architecture can assign and configure maximum AAL2 CID limit. AAL2 is the protocol which has been recommended by ITU-T and ATM-Forum for low bit rate delay sensitive services. The architecture assumes 155 Mbps STM-1/STS-3c physical interface, maximum VCC can be 64K connections. It can support maximum 16,384M AAL2 connections. For efficient use of peripheral memory, a concept of segment address was proposed. The proposed AAL2 switch hardware architecture can be used in ATM network as a standalone server or embedded module in a ATM switching system.

• Journal of Advanced Marine Engineering and Technology
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• v.22 no.5
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• pp.617-625
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• 1998

A passive energy recovery snubber for high-power-factor boost rectifier, in which the main switch is implemented with a MOSFET, is described in terms of the equivalent circuits that are operational during turn-on and turn-off sequences. These equivalent circuits are analyzed so that the overshoot voltage across the main switch, the snubber current, and the turn-off transition time can be predicted analytically. From these results, the normalized overshoot voltage is reduced to 1 as $_W2T_on$ varies from zero to $\pi$/2, and then it is fIxed at 1 for $_W2T_on$> $\pi$/2. The peak snubber inductor current is directly proportional to the input current. The turn-offtransition time wltoffvaries from 0 to 2.57, depending on $_W2T_on$. The main switch combined with proposed snubber can be turned on with zero current and turned off at limited voltage stress. The high-power-factor boost rectifier with proposed snubber is implemented, and the experimental results are presented to confirm the validity of proposed snubber.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.4 no.1
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• pp.31-35
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• 2003

Switch box is metal box and used for electric wire pipe in building. In manufacturing switch box, we need 5∼6 press machines, 5∼6 dies, 1 tapping machine. and 7∼8 operators. What matters is rise of manufacturing cost and operators' reluctance of working. To solve this problem, we modified the pre-existing die and developed handling mechanism, which leads to improve the manufacturing process. After the research and development, we could reduce the number of machines and workers needed in the process; 2 press machines, 2 dies, 1 tapping machine, and 1 operator. That means we can save labor and the number of operators needed, reduce manufacturing cost, and get the effect of import replacement.

• The Transactions of the Korean Institute of Power Electronics
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• v.11 no.4
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• pp.361-370
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• 2006

A single-stage single-switch flyback converter with synchronous rectifier is proposed. The proposed single-stage single-switch technique meets the IEC 61000-3-2 harmonic requirements. The proposed SR is the voltage driven synchronous rectifier (VDSR) which operates depending on the voltage drop across the drain and source of the MOSFET. Experimental results for the 85W (12V /7.1A) proposed converter are shown.

• Current Optics and Photonics
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• v.2 no.1
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• pp.34-38
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• 2018

An X-band microwave photonic (MWP) filter using switch-based fiber-optic delay lines has been proposed and experimentally demonstrated. It is composed of two electro-optic modulators (EOMs) and $2{\times}2$ optical MEMS-switch-based fiber-optic delay lines. By changing time-delay difference and coefficients of each wavelength signal by using fiber-optic delay lines and an electro-optic modulator, respectively, a bandpass filter or a notch filter can be implemented. For an X-band MWP filter with four channel elements, fiber-optic delay lines with the unit time-delay of 50 ps have been experimentally realized and the frequency responses corresponding to the time-delays has been measured. The measured frequency response error at center frequency and the time-delay difference error were 180 MHz at 10 GHz and 3.2 ps, respectively, when the fiber-optic delay line has the time-delay difference of 50 ps.

• Proceedings of the KIEE Conference
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• 1989.07a
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• pp.637-641
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• 1989

We have developed 3-stage of Magnetic Switch System based on the nonlinearities of ferromagnetic material used in the saturable inductor, and made experiment of parameter optimization and output stabilization of Magnetic Switch System. The cross-section and conductor burns of each satarable inductor were optimized 30 $cm^2$ 19.25 $cm^2$ 5, and 25 $cm^2$ 2, respectively. With this condition, 6.2 us [FWHM], 96 A pulse at first stage was compressed into 0.4 us[FWHM], 1.61 kA pulse at last stage. The current gain and compression ratio were 16.8, 17, respectively. ln addition, System output was stabilized with reset current of 6 A, 200 us.

• Journal of Chest Surgery
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• v.30 no.11
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• pp.1121-1124
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• 1997

This is a report of a successful, rapid two-stage arterial switch operation in an infant with dextrotransposition of great arteries with an intact ventricular septum beyond the appropriate time for arterial switch operation.'A 4-month-old female infant was admitted due to severe cyanosis, respiratory insufficiency, and frequent dia rhea secondary to ischemic colitis. Echocardiographic examination presented marked leftward deviation of the interventricular septum, and left and right ventricular pressures as measured by cardiac catheterization were 40/4 mmHg and 85/2 mmHg, respectively. Fifteen days after a preparatory operation (pulmonary artery band with modified right Blalock-Taussig shunt), left ventricular-right ventricular systolic pressure ratio increased to 105/90. Arterial switch operation associated with the division of the right Blalock-Taussig shunt and the removal of pulmonary artery band was performed. A(leer the operation, the infant showed normal cardiac function with no postoperative complication.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.48 no.7
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• pp.523-528
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• 2020

A lateral type MEMS inertial switch was designed on the same principle as spring-mass system. The MEMS switch is used for arming mechanism of the arm-fire device by sensing the applied acceleration. We analyzed the switching capability of the MEMS switch under various acceleration conditions via performance model. Simulation results showed that the MEMS switch works very well at 10 g when the applied acceleration slope does not exceed 10 g/msec. On the other hand, the threshold operating acceleration level simulation exceeded the requirement (10±2 g) due to the width and length of the spring by considering 10% tolerance of the design values. Design modification of doubling the width of the spring, which is difficult to reduce less than 10% tolerance in fabrication process, was proposed after confirming the simulation results comply the requirement.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.1
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• pp.180-184
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• 2013

In this paper, a low power antenna switch controller IC is designed using a silicon-on-insulator (SOI) CMOS technology. To improve power handling capability and harmonic distortion performance of the antenna switch, the proposed antenna switch controller provides 3-state logic level such as +VDD, GND, and -VDD for the gate and body of switch of FETs according to decoder signal. By employing input-coupled current ring oscillator and hardware efficient level shifter, the proposed controller greatly reduces power consumption and hardware complexity. It consumes 135 ${\mu}A$ at a 2.5 V supply voltage in active mode, and occupies $1.3mm{\times}0.5mm$ in area. In addition, it shows fast start-up time of 10 ${\mu}s$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.11
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• pp.3280-3286
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• 2009

In this paper, we designed and manufactured HD Switch Panel parts with micro-etched pattern. By using CAE analysis, we could predict weld-line positions and the amount of shrinkage during injection molding process. We measured the temperature distribution of the mold surface so that we could optimize the processing conditions such as mold temperature. In order to increase the transcription of micro-etched pattern, we applied the E-Mold technology and evaluated the effect of mold temperature on the surface quality. We concluded that the etched pattern was improved(more than 2.5$\to$1.5~1.7) through the measurement of surface gloss and the observation of both SEM and SPM images.