• Title/Summary/Keyword: 13.56 Mhz

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대면적 Transformer coupled Plasma Source에서 파워결합에 관한 실험적 연구

  • 김희준;손명근;황용석
    • Proceedings of the Korean Vacuum Society Conference
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    • 1998.02a
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    • pp.166-166
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    • 1998
  • 반도체 공정에서 기존보다 큰 30cm 웨이퍼훌 이용하기 위해서 기존의 ECR, Helicon, ICP, 등 공정용 고 밀도 플라즈마 원들의 대면적화에 대한 연구가 세계적으로 진행되고 있다 현 상황에서는 평판형 안테 나룰 이용한 TCP가 대면적용 폴라즈마 원의 가장 유력한 후보로 여겨지고 있다 TCP롤 대면적화 하는 데 있어서 중요한 문제점으로는 대면적에서의 큰 안테나 인되턴스로 인한 임피던스 정합과 대면적에서 의 유전울질의 기계적 강도이다. 앓은 유전물질올 사용힐 수 있도록 대면적 TCP 플라즈마 원올 실계 저l작하였고 이차원 가열이론올 이용한 TCPRP code 률 이용하여 안테나의 반경옳 결정하였디 안테나의 인덕턴스 값올 줄이기 위해서는 주m수는 13.56MHz 보다 낮은 4-5MHz 부근에서 작동하는 RF 파워룰 선택하였다 이 파워 서플라이는 보통 사용되는 50n 흩력 입묘$\mid$던스훌 갖는 형태가 Of니라 LC 공진현상 올 이용하여 부하에 파워률 전달하는 형태이다 .. TCP 장치에 사용할 수 있도록 파워 서플라이 흩력 단에 안테나와 직혈로 가변 콘덴서를 달아서 임11I던스 정합올 힐 수 있게 하였다 안테나에 직훌로 달Of줌으 로써 안테니의 인덕턴스훌 훌여주는 효과훌 얻올 수 있다 안테나에 흐르는 전류룰 측정하기 위해서 사 각형 루프로 전류 픽업 코일을 만들었고 진공상태에서 RF 파워률 인가하고 안테나의 전류와 전압을 측정하여 픽업 코일걸과훌 조정하였다. 발생기체로는 헬륨올 사용하였고 1-100mTorr 의 압력범위에서 실험을 하였다 플라즈마롤 빌샘시키고 파워를 증가 시킴에 따라 E-H mode transition 현상이 관찰되었고 그 때의 임계 전류 값을 측정하였다. 압력이 낮올수록 모드 변화가 일어나는 전류의 값이 작았다 임계 전류는 압력에 대해서 선형적인 특성을 보였다 이는 압력이 낮을수록 유도걸힘이 더 잘 된다는 것을 의미한다 1 1 mTorr에서는 H-mode에서 안테나의 전류가 파워훌 증가시킴에 따라 계속 증가하였으니, 압력이 올라 갈수록 조금씩 증가하는 정도가 줄어들고. 100mTorr에서는 포화된 값을 나타냈다 H-mode로 넘어간 후 에는 파워가 증가황에 따라 안테나의 임피던스 값이 모든 압력영역에서 줄어드는 경황을 보였고, 이는 플라즈마의 인덕턴스에 의해서 안테나의 인덕턴스 기 감소되기 때문이다, 파워가 증가할수록 안테U오} 플라즈마 루프사이의 상호걸합이 증가하는 걸로 해석힐 수 있다 안테나의 인되턴스 변화보다는 저항.성 분의 변화가 컸다 하지만 전체 임피던스로 볼 때 저항성분이 상대적으로 작기 때문에 인덕턴스의 감소 가 더 큰 영향을 미치는 걸로 볼 수 있다. 하지만 플라즈마로의 파워 전달에는 저항성분만이 영향올 미 치므로 저항성분의 큰 변화는 파워가 많이 전달될올 의미한다 피워전달 효율을 계산해 본 결과 수 r mTorr 부근이 80-90% 정도의 높은 효율올 보였고 5mTorr 일 때가 가장 좋았다.

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Dual-frequency Capacitively Coupled Plasma-enhanced Chemical Vapor Deposition System for Solar Cell Manufacturing

  • Gwon, Hyeong-Cheol;Won, Im-Hui;Sin, Hyeon-Guk;Rehman, Aman-Ur;Lee, Jae-Gu
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.310-311
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    • 2011
  • Dual-frequency (DF) capacitively coupled plasmas (CCP) are used to separately control the mean ion energy and flux at the electrodes [1]. This separate control in capacitively coupled radio frequency discharges is one of the most important issues for various applications of plasma processing. For instance, in the Plasma Enhanced Chemical Vapor Deposition processes such as used for solar cell manufacturing, this separate control is most relevant. It principally allows to increase the ion flux for high deposition rates, while the mean ion energy is kept constant at low values to prevent highly energetic ion bombardment of the substrate to avoid unwanted damage of the surface structure. DF CCP can be analyzed in a fashion similar to single-frequency (SF) driven with effective parameters [2]. It means that DF CCP can be converted into SF CCP with effective parameters such as effective frequency and effective current density. In this study, comparison of DF CCP and its converted effective SF CCP is carried out through particle-in-cell/Monte Carlo (PIC-MCC) simulations. The PIC-MCC simulation shows that DF CCP and its converted effective SF CCP have almost the same plasma characteristics. In DF CCP, the negative resistance arises from the competition of the effective current and the effective frequency [2]. As the high-frequency current increases, the square of the effective frequency increases more than the effective current does. As a result, the effective voltage decreases with the effective current and it leads to an increase of the ion flux and a decrease of the mean ion energy. Because of that, the negative resistance regime can be called the preferable regime for solar cell manufacturing. In this preferable regime, comparison of DF (13.56+100 or 200 MHz) CCP and SF (60 MHz) CCP with the same effective current density is carried out. At the lower effective current density (or at the lower plasma density), the mean ion energy of SF CCP is lower than that of DF CCP. At the higher effective current density (or at the higher plasma density), however, the mean ion energy is lower than that of SF CCP. In this case, using DF CCP is better than SF CCP for solar cell manufacturing processes.

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Complex Permeability of 0-3 Polymer Magnetic Composites for Near-Field Communication (근역장 통신용 0-3형 고분자 자성 복합소재의 복소투자율 변화)

  • Nam, Joong-Hee;Lim, Choong Hyuck;Yun, Ji Sun;Jeong, Young-Hun;Cho, Jeong-Ho;Paik, Jong Hoo;Kim, Hyo Tae;Kim, Jong-Hee
    • Journal of the Korean Magnetics Society
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    • v.22 no.6
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    • pp.216-220
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    • 2012
  • Magnetic properties of composite materials consisting of polymer filled with ferromagnetic powders (MnZn ferrite, Fe-Si alloy) were investigated in this study. The volume fraction of magnetic powders as fillers was varied from 70 % to 95 %. This paper presents the fabrication method of polymer magnetic composites in an effort to produce the 0-3 types of MnZn ferrite and FeSi as fillers with a proper complex permeability through the optimization of some experimental parameters. The polymer matrix composites were prepared by mixing the crushed ferrites and flaky FeSi powders homogenously with low-density resins (EPDM, epoxy). The relationships among the manufacturing technology of these materials, their filler volume fraction, as well as their complex permeability were measured and analyzed.

Study of Low Reflectance and RF Frequency by Rie Surface Texture Process in Multi Crystall Silicon Solar Cells (공정가스와 RF 주파수에 따른 웨이퍼 표면 텍스쳐 처리 공정에서 저반사율에 관한 연구)

  • Yun, Myoung-Soo;Hyun, Deoc-Hwan;Jin, Beop-Jong;Choi, Jong-Young;Kim, Joung-Sik;Kang, Hyoung-Dong;Yi, Jun-Sin;Kwon, Gi-Chung
    • Journal of the Korean Vacuum Society
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    • v.19 no.2
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    • pp.114-120
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    • 2010
  • Conventional surface texturing in crystalline silicon solar cell have been use wet texturing by Alkali or Acid solution. But conventional wet texturing has the serious issue of wafer breakage by large consumption of wafer in wet solution and can not obtain the reflectance below 10% in multi crystalline silicon. Therefore it is focusing on RIE texturing, one method of dry etching. We developed large scale plasma RIE (Reactive Ion Etching) equipment which can accommodate 144 wafers (125 mm) in tray in order to provide surface texturing on the silicon wafer surface. Reflectance was controllable from 3% to 20% in crystalline silicon depending on the texture shape and height. We have achieved excellent reflectance below 4% on the weighted average (300~1,100 nm) in multi crystalline silicon using plasma texturing with gas mixture ratio such as $SF_6$, $Cl_2$, and $O_2$. The texture shape and height on the silicon wafer surface have an effect on gas chemistry, etching time, RF frequency, and so on. Excellent conversion efficiency of 16.1% is obtained in multi crystalline silicon by RIE process. In order to know the influence of RF frequency with 2 MHz and 13.56 MHz, texturing shape and conversion efficiency are compared and discussed mutually using RIE technology.

Effect of RTA Treatment on $LiNbO_3$ MFS Memory Capacitors

  • Park, Seok-Won;Park, Yu-Shin;Lim, Dong-Gun;Moon, Sang-Il;Kim, Sung-Hoon;Jang, Bum-Sik;Junsin Yi
    • The Korean Journal of Ceramics
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    • v.6 no.2
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    • pp.138-142
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    • 2000
  • Thin film $LiNbO_3$MFS (metal-ferroelectric-semiconductor) capacitor showed improved characteristics such as low interface trap density, low interaction with Si substrate, and large remanent polarization. This paper reports ferroelectric $LiNbO_3$thin films grown directly on p-type Si (100) substrates by 13.56 MHz RF magnetron sputtering system for FRAM (ferroelectric random access memory) applications. RTA (rapid thermal anneal) treatment was performed for as-deposited films in an oxygen atmosphere at $600^{\circ}C$ for 60sec. We learned from X-ray diffraction that the RTA treated films were changed from amorphous to poly-crystalline $LiNbO_3$which exhibited (012), (015), (022), and (023) plane. Low temperature film growth and post RTA treatments improved the leakage current of $LiNbO_3$films while keeping other properties almost as same as high substrate temperature grown samples. The leakage current density of $LiNbO_3$films decreased from $10^{-5}$ to $10^{-7}$A/$\textrm{cm}^2$ after RTA treatment. Breakdown electric field of the films exhibited higher than 500 kV/cm. C-V curves showed the clockwise hysteresis which represents ferroelectric switching characteristics. Calculated dielectric constant of thin film $LiNbO_3$illustrated as high as 27.9. From ferroelectric measurement, the remanent polarization and coercive field were achieved as 1.37 $\muC/\textrm{cm}^2$ and 170 kV/cm, respectively.

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The Properties of Boron-doped Zinc Oxide Film Deposited according to Oxygen Flow Rate

  • Kim, Dong-Hae;Son, Chan-Hee;Yun, Myoung-Soo;Lee, Jin-Young;Jo, Tae-Hoon;Seo, Il-Won;Jo, I-Hyun;Roh, Jun-Hyung;Choi, Eun-Ha;Uhm, Han-Sup;Kwon, Gi-Chung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.358-358
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    • 2012
  • The application of BZO (Boron-doped Zinc Oxide) films use as the TCO(Transparent Conductive Oxide) material for display and solar cell industries, where the conductivity of the BZO films plays a critical role for improvement of cell performance. Thin BZO films are deposited on glass substrates by using RF sputter system. Then charging flow rates of O2 gas from zero to 10 sccm, thereby controlling the impurity concentration of BZO. BZO deposited on soda lime glass and RF power was 300 W, frequency was 13.56 MHz, and working pressure was $5.0{\times}10-6$ Torr. The Substrate and glass between distance 200 mm. We measured resistivity, conductivity, mobility by hall measurement system. Optical properties measured by photo voltaic device analysis system. We measured surface build according to oxygen flow rate from XPS (X-ray Photoelectron Spectroscopy) system. The profile of the energy distribution of the electrons emitted from BZO films by the Auger neutralization is measured and rescaled so that Auger self-convolution arises, revealing the detail structure of the valence band. It may be observed coefficient ${\gamma}$ of the secondary electron emission from BZO by using ${\gamma}$-FIB (Gamma-Focused Ion Beam) system. We observed the change in electrical conductivity by correlation of the valence band structure. Therefore one of the key issues in BZO films may be the valence band that detail structure dominates performance of solar cell devices. Demonstrating the secondary electron emission by the Auger neutralization of ions is useful for the determination of the characteristics of BZO films for solar cell and display developments.

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Fluctuation in Plasma Nanofabrication

  • Shiratani, Masaharu
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.96-96
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    • 2016
  • Nanotechnology mostly employs nano-materials and nano-structures with distinctive properties based on their size, structure, and composition. It is quite difficult to produce nano-materials and nano-structures with identical sizes, structures, and compositions in large quantities, because of spatiotemporal fluctuation of production processes. In other words, fluctuation is the bottleneck in nanotechnology. We propose three strategies to suppress such fluctuations: employing 1) difference between linear and nonlinear phenomena, 2) difference in time constants, and 3) nucleation as a bottleneck phenomenon. We are also developing nano- and micro-scale guided assembly using plasmas as a plasma nanofabrication.1-5) We manipulate nano- and micro-objects using electrostatic, electromagnetic, ion drag, neutral drag, and optical forces. The accuracy of positioning the objects depends on fluctuation of position and energy of an object in plasmas. Here we evaluate such fluctuations and discuss the mechanism behind them. We conducted in-situ evaluation of local plasma potential fluctuation using tracking analysis of fine particles (=objects) in plasmas. Experiments were carried out with a radio frequency low-pressure plasma reactor, where we set two quartz windows at the top and bottom of the reactor. Ar plasmas were generated at 200 Pa by applying 13.56MHz, 450V peak-to-peak voltage. The injected fine particles were monodisperse methyl methacrylate-polymer spheres of $10{\mu}m$ in diameter. Fine particles were injected into the reactor and were suspended around the plasma/sheath boundary near the powered electrode. We observed binary collision of fine particles with a high-speed camera. The frame rate was 1000-10000 fps. Time evolution of their distance from the center of mass was measured by tracking analysis of the two particles. Kinetic energy during the collision was obtained from the result. Potential energy formed between the two particles was deduced by assuming the potential energy plus the kinetic energy is constant. The interaction potential is fluctuated during the collision. Maximum amplitude of the fluctuation is 25eV, and the average is 8eV. The fluctuation can be caused by neutral molecule collisions, ion collisions, and fluctuation of electrostatic force. Among theses possible causes, fluctuation of electrostatic force may be main one, because the fine particle has a large negative charge of -17000e and the corresponding electrostatic force is large compared to other forces.

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Tetrakis(trimethylsilyloxy)silane와 cyclohexane 혼합 전구체를 사용한 플라즈마중합박막에서의 mouse embryonic fibroblast cell과 bovine aortic endothelial cell의 동향

  • Gwon, Seong-Ryul;Ban, Won-Jin;Nam, Jae-Hyeon;Lee, Ye-Ji;Jeong, Dong-Geun;Seo, Yeong-Sik;Park, Hyeon-Yong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.227.2-227.2
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    • 2015
  • 세포를 부착하는 기술은 세포를 배양하기 위한 가장 기초적이며 중요한 기술이다. 세포 부착기술은 대상물과 세포 간의 다양한 생물학적, 물리화학적 연관 관계가 있으나 세포와 부착 대상물 간의 복잡한 상호작용 때문에 완벽히 예측하기는 어렵다. 우리는 이 연구에서 siloxane 성분을 포함하고 있는 전구체인 tetrakis(trimethylsilyloxy)silane과 hydro-carbon을 포함하고 있는 전구체인 cyclohexane을 혼합하여 플라즈마 중합 박막을 만들고 그 박막에서의 mouse embryonic fibroblast cells과 bovine aortic endothelial cell 부착의 정도를 확인하였다. 플라즈마 중합 박막을 제작하기 위해 capacitively coupled plasma chemical vapor deposition system을 사용하였고 carrier gas로는 Ar을 사용하였다. Plasma RF power는 13.56MHz 70W를 사용하였다. Bubbler에서 기화된 전구체를 포함하고 있는 Ar carrier gas가 process chamber에서 혼합되고 두 전구체의 비율을 조절하기 위해 carrier gas를 0 에서 150sccm으로 변화시켜 플라즈마 중합 박막을 제작하였다. 플라즈마 중합 박막의 화학적 조성은 Fourier transform infrared absorption spectroscopy와 X-ray photoelectron spectroscopy를 이용하여 측정하였고, 생물학적 세포 부착 정도는 현미경을 통해 관찰하였다. 또한, 물과 박막의 접촉각(Water contact angle)을 측정함으로써 본 박막과 세포 부착에서의 친, 소수성의 연관성을 확인하였다. Tetrakis(trimethylsilyloxy)silane를 전구체를 사용한 박막에서 세포 부착 억제 표면특성이 관찰되었고, 주입되는 cyclohexane 비율이 늘어날수록 세포부착 가능한 표면 특성을 보였다. 결과적으로, 전구체인 tetrakis(trimethylsilyloxy)silane와 cyclohexane의 비율을 조절함으로써 세포의 부착정도를 제어할 수 있음을 확인하였다.

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Contact block copolymer technique을 이용한 실리콘 나노-필라 구조체 제작방법

  • Kim, Du-San;Kim, Hwa-Seong;Park, Jin-U;Yun, Deok-Hyeon;Yeom, Geun-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.189-189
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    • 2015
  • Plasmonics, sensor, field effect transistors, solar cells 등 다양한 적용분야를 가지는 실리콘 구조체는 제작공정에 의해 전기적 및 광학적 특성이 달라지기 때문에 적합한 나노구조 제작방법이 요구되고 있다. 나노구조체 제작방법으로는 Photo lithography, Extreme ultraviolet lithography (EUV), Nano imprinting lithography (NIL), Block copolymer (BCP) 방식의 방법들이 연구되고 있으며, 특히 BCP는 direct self-assembly 특성을 가지고 있으며 가격적인 면에서도 큰 장점을 가진다. 하지만 BCP를 mask로 사용하여 식각공정을 진행할 경우 BCP가 버티지 못하고 변형되어 mask로서의 역할을 하지 못한다. 이러한 문제를 해결하기 위하여 본 논문에서는 BCP와 질화막을 이용한 double mask 방법을 사용하였다. 기판 위에 BCP를 self-assembly 시키고 mask로 사용하여 hole 부분으로 노출된 기판을 Ion gun을 통해 질화 시킨 후에 BCP를 제거한다. 기판 위에 hole 모양의 질화막 표면은 BCP와 다르게 etching 공정 중 변형되지 않는다. 이러한 질화막 표면을 mask로 사용하여 pillar pattern의 실리콘 나노구조체를 제작하였다. 질화막 mask로 사용되는 template은 PS와 PMMA로 구성된 BCP를 사용하였다. 140kg/mol의 polystyrene과 65kg/mol의 PMMA를 톨루엔으로 용해시키고 실리콘 표면 위에 spin coating으로 도포하였다. Spin coat 후 230도에서 40시간 동안 열처리를 진행하여 40nm의 직경을 가진 PS-b-PMMA self-assembled hole morphology를 형성하였다. 질화막 형성 및 etching을 위한 장비로 low-energy Ion beam system을 사용하였다. Reactive Ion beam은 ICP와 3-grid system으로 구성된 Ion gun으로부터 형성된다. Ion gun에 13.56 MHz의 frequency를 갖는 200W 전력을 인가하였다. Plasma로부터 나오는 Ion은 $2{\Phi}$의 직경의 hole을 가지는 3-grid hole로 추출된다. 10~70 voltage 범위의 전위를 plasma source 바로 아래의 1st gird에 인가하고, 플럭스 조절을 위해 -150V의 전위를 2nd grid에 인가한다. 그리고 3rd grid는 접지를 시켰다. chamber내의 질화 및 식각가스 공급은 2mTorr로 유지시켰다. 그리고 기판의 온도는 냉각칠러를 이용하여 -20도로 냉각을 진행하였다. 이와 같은 공정 결과로 100 nm 이상의 높이를 갖는 40 nm직경의 균일한 Silicon pillar pattern을 형성 할 수 있었다.

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Wear Resistance of c-BN Surface Modified 316L Austenitic Stainless Steel by R.F. Sputtering (R.F. sputtering 방법에 의해 c-BN 표면처리된 316L 오스테나이트계 스테인리스 강의 내마모특성 향상)

  • Lee, Kwang-Min;Jeong, Se-Hoon;Park, Sung-Tae
    • Korean Journal of Materials Research
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    • v.20 no.4
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    • pp.194-198
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    • 2010
  • Cubic boron nitride (c-BN) is a promising material for use in many potential applications because of its outstanding physical properties such as high thermal stability, high abrasive wear resistance, and super hardness. Even though 316L austenitic stainless steel (STS) has poor wear resistance causing it to be toxic in the body due to wear and material chips, 316L STS has been used for implant biomaterials in orthopedics due to its good corrosion resistance and mechanical properties. Therefore, in the present study, c-BN films with a $B_4C$ layer were applied to a 316L STS specimen in order to improve its wear resistance. The deposition of the c-BN films was performed using an r.f. (13.56 MHz) magnetron sputtering system with a $B_4C$ target. The coating layers were characterized using XPS and SEM, and the mechanical properties were investigated using a nanoindenter. The friction coefficient of the c-BN coated 316L STS steel was obtained using a pin-on-disk according to the ASTM G163-99. The thickness of the obtained c-BN and $B_4C$ were about 220 nm and 630 nm, respectively. The high resolution XPS spectra analysis of B1s and N1s revealed that the c-BN film was mainly composed of $sp^3$ BN bonds. The hardness and elastic modulus of the c-BN measured by the nanoindenter were 46.8 GPa and 345.7 GPa, respectively. The friction coefficient of the c-BN coated 316L STS was decreased from 3.5 to 1.6. The wear property of the c-BN coated 316L STS was enhanced by a factor of two.