• Title/Summary/Keyword: 100nm Nickel Stamper

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Fabrication of High Aspect Ratio 100nm-Scale Nickel Stamper Using E-Beam Writing based on Chrome/Quartz Mask Without Anti-Reflection Layer for Injection Molding of Optical Grating Patterns (광학 그레이팅의 사출성형제작을 위한 전자빔과 무반사 코팅층이 없는 크롬/퀄츠 마스크를 이용한 고종횡비 100nm 급 니켈 스탬퍼의 제작)

  • Seo, Young-Ho;Choi, Doo-Sun;Lee, Joon-Hyoung;Je, Tae-Jin;Whang, Kyung-Hyun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.11
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    • pp.1794-1798
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    • 2004
  • We present a fabrication method of high aspect ratio 100nm-scale nickel stamper using e-beam writing for the injection molding of optical grating patterns. Conventional nickel stamper is fabricated by nickel electroplating process which is followed by seed layer deposition. In this paper, we have used chrome coated blank mask without anti-reflection layer of CrON in order to simplified electroplating process. In experimental study, we have optimized electron-beam dosage for 100nm-scale optical grating patterns with 2.5-aspect ratio, and fabricated nickel stamper using above grating patterns as PR mold. Fabricated nickel stamper have showed height of 240$\pm$20nm and width of 116$\pm$6nm.

Fabrication of High Aspect Ratio 100nm-scale Nickel Stamper Using E-beam Lithography for the Injection molding of Nano Grating Patterns (전자빔과 무반사층이 없는 크롬 마스크를 이용한 나노그레이팅 사출성형용 고종횡비 100nm 급 니켈 스템퍼의 제작)

  • Seo, Young-Ho;Choi, Doo-Sun;Lee, Joon-Hyoung;Je, Tae-Jin;Whang, Kyung-Hyun
    • Proceedings of the KSME Conference
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    • 2004.04a
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    • pp.978-982
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    • 2004
  • We present high aspect ratio 100nm-scale nickel stamper using e-beam lithography process and Cr/Qz mask for the injection molding process of nano grating patterns. Conventional photolithography blank mask (CrON/Cr/Qz) consists of quartz substrate, Cr layer of UV protection and CrON of anti-reflection layer. We have used Cr/Qz blank mask without anti-reflection layer of CrON which is non-conductive material and ebeam lithography process in order to simplify the nickel electroplating process. In nickel electroplating process, we have used Cr layer of UV protection as seed layer of nickel electroplating. Fabrication conditions of photolithography mask using e-beam lithography are optimized with respect to CrON/Cr/Qz blank mask. In this paper, we have optimized e-beam lithography process using Cr/Qz blank mask and fabricated nickel stamper using Cr seed layer. CrON/Cr/Qz blank mask and Cr/Qz blank mask require optimal e-beam dosage of $10.0{\mu}C/cm^2$ and $8.5{\mu}C/cm^2$, respectively. Finally, we have fabricated $116nm{\pm}6nm-width$ and $240nm{\pm}20nm-height$ nickel grating stamper for the injection molding pattern.

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Fabrication of nano pattern using the injection molding (사출성형을 이용한 미세 패턴 성형)

  • Lee, Kwan-Hee;Yoo, Yeong-Eun;Kim, Sun-Kyoung;Kim, Tae-Hoon;Je, Tae-Jin;Choi, Doo-Sun
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1532-1536
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    • 2007
  • A plastic substrate with tiny rectangular pillars less than 100nm is injection molded to study pattern replication in injection molding. The size of the substrate is 50mm ${\times}$ 50mm and 1mm thick. The substrate has 9 patterned areas of which size is 2mm ${\times}$ 2mm respectively. The lengths of the pillars are 50nm, 100nm, 150nm and 200nm and the width and height are 50nm and about 100nm respectively. A pattern master is fabricated by e-beam writing using positive PR(photo resist) and then a nickel stamper replicated from the PR master by nickel electro-plating. Cr is deposited on the PR pattern master before nickel electro-plating as a conducting layer. Using this nickel stamper, several injection molding experiments are done to investigate effects of the injection molding parameters such as mold temperature, injection rate, packing pressure or pattern location on the replication of the patterns under 100nm.

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Fabrication of Nanoscale Reusable Quartz Master for Nano Injection Molding Process (재사용 가능한 100nm급 패턴의 퀄츠 마스터 제작 및 퀄츠 마스터를 사용한 사출성형실험)

  • Choi Doo-Sun;Lee Joon-Hyoung;Yoo Yeong-Eun;Je Tae-Jin;Whang Kyung-Hyun;Seo Young Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.29 no.2 s.233
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    • pp.228-231
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    • 2005
  • In this paper, we present reusable quartz master fabricated by electron-beam lithography and dry etching process of quartz, and results of injection molding based on the reusable quartz master for the manufacturing of nano-scale information media. Since patterned structures of photoresist can be easily damaged by separation (demolding) process of nickel stamper and master, a master with photoresist cannot be reused in stamper fabrication process. In this work, we have made it possible of the repeated use of master by directly patterning on quart in nickel stamper fabrication process. We have designed and fabricated four different specimens including 100nm, 140nm 200nm and 400nm pit patterns. In addition, both intaglio and embossed carving patterns are fabricated for each specimen. In the preliminary test of injection molding, we have fabricated polycarbonate patterns with varying mold temperature. We have experimentally verified the fabrication process of the reusable quart master and possibility of quartz master as direct stamper.

Electron beam lithography patterning research for stamper fabrication using nano-injection molding (나노사출성형용 스탬퍼 제작을 위한 Electron beam lithography 패터닝 연구)

  • Uhm S.J.;Seo Y.H.;Yoo Y.E.;Choi D.S.;Je T.J.;Whang K.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.698-701
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    • 2005
  • We have investigated experimentally a nano patterning using electron beam lithography for the nickel stamper fabrication. Recently, DVD and Blu-ray disk(BD) have nano-scale patterns in order to increase the storage density. Specially, BD has 100nm-scale patterns which are generally fabricated by electron beam lithography. In this paper, we found optimum condition of electron-beam lithography for 100nm-scale patterning. We controlled various conditions of EHP(acceleration voltage), beam current, dose and aperture size in order to obtain optimum conditions. We used 100nm-thick PMMA layer on a silicon wafer as photoresist. We found that EHP was the most dominant factor in electron-beam lithography.

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