• 제목/요약/키워드: 1) process

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반응소결법 및 통전가압소결법에 의한 $Ti_5Si_3$계 금속간화합물의 합성 및 치밀화 (Synthesis and Densification of $Ti_5Si_3$-base Intermetallic Compounds by Reactive Sintering and Electro-Pressure Sintering)

  • 유호준
    • 한국분말재료학회지
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    • 제4권4호
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    • pp.283-290
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    • 1997
  • $Ti_5Si_3$ intermetallics containing 0-6 wt% of Cu were made by reactive sintering (RS) under vacuum using elemental powder mixtures (Process 1), electro-pressure sintering (EPS) using RS'ed materials (Process2), and EPS using elemental powder mixtures (Process 3). Relatively low dense titanium silicides were gained by process 1, in which porosity decreased with increasing Cu content. For example, porosity changed from 42 to 19.4% with the increase in Cu content from 0 to 6 wt%, indicating that Cu is a useful sintering aid. The titanium silicides fabricated by Process 2 had a higher density than those by Process 1 at given composition, and porosity decreased with increasing Cu content. For example, porosity decreased from 38 to 6.8% with the change in Cu content from 0 to 6 wt%. A high dense titanium silicides were obtained by Process 3. In this Process, porosity decreased a little by Cu addition, and was almost insensitive to Cu content. Namely, about 9 or 7% of porosity was shown in 0 or 1-6 wt% Cu containing silicides, respectively. The hardeness increased by Cu addition, and was not changed markedly with Cu content for the silicides fabricated by Process 3. This tendency was considered to be resulted from porosity, hardening of grain interior by Cu addition, and softening of grain boundary by Cu-base segregates. All these results suggested that EPS using elemental powder mixtures (Process 3) is an effective processing method to achieve satisfactorily dense titanium silicides.

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A Combined Process Control Procedure by Monitoring and Repeated Adjustment

  • Park, Changsoon
    • Communications for Statistical Applications and Methods
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    • 제7권3호
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    • pp.773-788
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    • 2000
  • Statistical process control (SPC) and engineering process control (EPC) are based on different strategies for processes quality improvement. SPC reduces process variability by detecting and eliminating special causes of process variation. while EPC reduces process variability by adjusting compensatory variables to keep the quality variable close to target. Recently there has been needs for a process control proceduce which combines the tow strategies. This paper considers a combined scheme which simultaneously applies SPC and EPC techniques to reduce the variation of a process. The process model under consideration is an integrated moving average(IMA) process with a step shift. The EPC part of the scheme adjusts the process back to target at every fixed monitoring intervals, which is referred to a repeated adjustment scheme. The SPC part of the scheme uses an exponentially weighted moving average(EWMA) of observed deviation from target to detect special causes. A Markov chain model is developed to relate the scheme's expected cost per unit time to the design parameters of he combined control scheme. The expected cost per unit time is composed of off-target cost, adjustment cost, monitoring cost, and false alarm cost.

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Model Based Design Process에 따른 embedded System의 개발 (Embedded System Development based on the Model Based Design Process)

  • 김민욱;최재훈;박인철;황호성
    • 시스템엔지니어링학술지
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    • 제5권2호
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    • pp.57-62
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    • 2009
  • An embedded system is a computer system designed to perform one or a few dedicated functions often with real-time computing constraints. A traditional design process of embedded systems is the development of document-centric approach, and it is difficult to develop an embedded system efficiently because communication between teams or steps is not smooth. So the Model Based Design Process are applied to the development of embedded systems. This paper will compare the Model Based Design Process and the traditional design process, and introduce example of development of vehicle device applied the Model Based Design Process.

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CAPP에서 공정계획 선정을 위한 유전 알고리즘 접근 (A Genetic Algorithm A, pp.oach for Process Plan Selection on the CAPP)

  • 문치웅;김형수;이상준
    • 지능정보연구
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    • 제4권1호
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    • pp.1-10
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    • 1998
  • Process planning is a very complex task and requires the dynamic informatioon of shop foor and market situations. Process plan selection is one of the main problems in the process planning. In this paper, we propose a new process plan selection model considering operation flexibility for the computer aided process planing. The model is formulated as a 0-1 integer programming considering realistic shop factors such as production volume, machining time, machine capacity, transportation time and capacity of tractors such as production volume, machining time, machine capacity, transportation time capacity of transfer device. The objective of the model is to minimize the sum of the processing and transportation time for all parts. A genetic algorithm a, pp.oach is developed to solve the model. The efficiency of the proposed a, pp.oach is verified with numerical examples.

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An Economic Design of the Integrated Process Control Procedure with Repeated Adjustments and EWMA Monitoring

  • Park Changsoon;Jeong Yoonjoon
    • 한국통계학회:학술대회논문집
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    • 한국통계학회 2004년도 학술발표논문집
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    • pp.179-184
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    • 2004
  • Statistical process control (SPC) and engineering process control (EPC) are based on different strategies for process quality improvement. SPC reduces process variability by detecting and eliminating special causes of process variation, while EPC reduces process variability by adjusting compensatory variables to keep the quality variable close to target. Recently there has been need for an integrated process control (IPC) procedure which combines the two strategies. This article considers a scheme that simultaneously applies SPC and EPC techniques to reduce the variation of a process. The process disturbance model under consideration is an IMA(1,1) model with a location shift. The EPC part of the scheme adjusts the process, while the SPC part of the scheme detects the occurrence of a special cause. For adjusting the process repeated adjustment is applied by compensating the predicted deviation from target. For detecting special causes the two kinds of exponentially weighted moving average (EWMA) control chart are applied to the observed deviations: One for detecting location shift and the other for detecting increment of variability. It was assumed that the adjustment of the process under the presence of a special cause may change any of the process parameters as well as the system gain. The effectiveness of the IPC scheme is evaluated in the context of the average cost per unit time (ACU) during the operation of the scheme. One major objective of this article is to investigate the effects of the process parameters to the ACU. Another major objective is to give a practical guide for the efficient selection of the parameters of the two EWMA control charts.

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낮은 C/N 비에서 운영되는 SBR 유형의 Two-Sludge 공정의 질소 제거 특성 (Nitrogen Removal Characteristics in Two-Sludge System of SBR Type Using Sewage Wastewater of Low C/N Ratio)

  • 류홍덕;김학인;이상일
    • 대한환경공학회지
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    • 제28권1호
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    • pp.7-14
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    • 2006
  • 본 연구에서는 도시하수를 이용하여 two-sludge 시스템방식의 SBR3 공정의 질소제거 효율 향상능을 평가하기 위해 기존 재래식 SBR 공정(SBR1) 및 분할주입(step-feeding)을 통해 탈질효율 향상을 도모한 SBR2 공정과의 비교 연구를 수행하였다. 도시하수를 대상으로 한 연구결과 two-sludge 시스템 방식으로 질산화 반응이 별도의 반응조에서 진행되며(external nitrification), 질산화된 질산염은 생흡착된 유기물을 이용하여 효과적으로 탈질되는 SBR3 공정이 SBR1 및 SBR2 반응조에 비해 T-N 제거효율면에서 우수함이 관찰되었다. SBR3 공정과 SBR1 및 SBR2 공정의 T-N 제거효율 차이는 낮은 C/N 비에서 더 크게 관찰되었으며 이는 생흡착 기작을 이용하는 SBR3 공정이 SBR1 및 SBR2 공정에 비해 탈질시 유기물 이용을 효율적으로 함을 의미한다. SBR3 공정은 T-N 유입 부하율에 따른 T-N 제거효율 관계에서도 SBR1 및 SBR2 공정에 비해 성능이 우수함을 관찰할 수 있었다. SBR3 공정이 SBR1 및 SBR2 공정에 비해 높은 T-N 부하율에서도 질소제거효율이 높은 원인은 SBR3 공정이 two-sludge 시스템 방식으로 운영됨에 따라 질화박테리아가 독립된 반응조에서 질산화를 수행하므로(external nitrification) 질산화 반응시 소요되는 수리학적 체류시간을 단축시킬 수 있기 때문이다.

인쇄전자 기술을 이용한 유기 태양전지 기술 개발 (Development of the Organic Solar Cell Technology using Printed Electronics)

  • 김정수;유종수;윤성만;조정대;김동수
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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    • pp.113.1-113.1
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    • 2011
  • PEMS (printed electro-mechanical system) is fabricated by means of various printing technologies. Passive and active compo-nents in 2D or 3D such as conducting lines, resistors, capacitors, inductors and TFT(Thin Film Transistor), which are printed withfunctional materials, can be classified in this category. And the issue of PEMS is applied to a R2R process in the manu-facturing process. In many electro-devices, the vacuum process is used as the manufacturing process. However, the vacuum process has a problem, it is difficult to apply to a continuous process such as a R2R(roll to roll) printing process. In this paper, we propose an ESD (electro static deposition) printing process has been used to apply an organic solar cell of thin film forming. ESD is a method of liquid atomization by electrical forces, an electrostatic atomizer sprays micro-drops from the solution injected into the capillary with electrostatic force generated by electric potential of about several tens kV. ESD method is usable in the thin film coating process of organic materials and continuous process as a R2R manufacturing process. Therefore, we experiment the thin films forming of PEDOT:PSS layer and active layer which consist of the P3HT:PCBM. The organic solar cell based on a P3HT/PCBM active layer and a PEDOT:PSS electron blocking layer prepared from ESD method shows solar-to-electrical conversion efficiency of 1.42% at AM 1.5G 1sun light illumination, while 1.86% efficiency is observed when the ESD deposition of P3HT/PCBM is performed on a spin-coated PEDOT:PSS layer.

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Statistical Process Control Procedure for Integral-Controlled Processes

  • Lee, Jaeheon;Park, Cangsoon
    • Communications for Statistical Applications and Methods
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    • 제7권2호
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    • pp.435-446
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    • 2000
  • Statistical process control(SPC) and engineering process control(EPC) are two strategies for quality improvement that have been developed independently. EPC seeks to minimize variability by adjusting compensatory variables in order to make the process level close to the target, while SPC seeks to reduce variability by monitoring and eliminating causes of variation. One purpose of this paper is to propose the IMA(0,1,1) model as the in-control process model. For the out-of-control process model we consider two cases; one is the case with a step shift in the level, and the other is the case with a change in the nonstationarity. Another purpose is to suggest the use of an integrated process control procedure with adjustment and monitoring, which can consider the proposed process model effectively. An integrated control procedure will improve the process control activity significantly for cases of the proposed model, when compared to the procedure of using either EPC or SPC, since EPC will keep the process close to the target and SPC will eliminate special causes.

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영지 (G. lucidum)의 액체배양에 의한 β-1,3-Glucan 생산에 미치는 서로 다른 pH Process의 영향 (Effect of Different pH Processes on Branched β-1,3-Glucan Production from Submerged Culture of Ganoderma lucidum)

  • 이신영;이규민
    • 산업기술연구
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    • 제20권A호
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    • pp.45-50
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    • 2000
  • A submerged cultivation of Ganoderma lucidum was carried out in an air-lift fermenter system, and the effects of different pH processes on extracellular branched ${\beta}$-1,3-glucan(EPS) production and mycelial growth(MDW) were investigated. The controlled pH process improved the production of branched ${\beta}$-1,3-glucan and biomass in comparison to the uncontrolled pH process. However, the maximum production of branched ${\beta}$-1,3-glucan were obtained by the bi-staged pH process. From these results, we confirmed that the bi-staged pH process was the most effective for improving the production of branched ${\beta}$-1,3-glucan from submerged culture of G. lucidum.

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모델기반 시스템 엔지니어링(MBSE)을 적용한 요구사항개발 프로세스 연구 (A Study on Requirements Development Process Using Model Based Systems Engineering Approach)

  • 양환석;장재덕;정호;최상욱;이혜진;이수용
    • 시스템엔지니어링학술지
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    • 제13권1호
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    • pp.51-56
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    • 2017
  • This paper presents a requirement development process using the model based systems engineering design process to the developments of the missile Seeker. SysML Model and requirement analysis templates were used as the specific execution method for applying the system engineering process. This paper will present a process for deriving the technical requirements and derived requirements using them.