• Proceedings of the KAIS Fall Conference
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• 2010.11b
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• pp.941-943
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• 2010

근래 LED 조명기기 연구는 출력이 낮은 조명기기에서 고출력 전원을 이용한 고휘도 제품 개발로 바뀌는 추세이다. 고출력을 이용할 경우 단순히 히트싱크 형상, PCB 배치 및 물성 변경을 통한 방열문제 해결 방법으로는 LED 조명기기의 수명감소 문제를 해결하는데 한계가 있다. 따라서 방열능력을 더욱 향상시킬 수 있는 히트파이프(heat pipe)의 필요성이 대두되었다. 본 연구에서는 히트파이프를 이용해 고출력 LED 조명기기 개발을 위한 연구를 수행하였다.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.12
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• pp.1711-1720
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• 2001

In this study, the heat transfer characteristics of a U-shape heat pipes were investigated. Heat is supplied to the U heat pipe through its middle zone(evaporator), and is released to the environment through its both arms(condensers). Both heat transfer coefficients and heat transport limitations were measured and compared with correlations previously developed for straight type heat pipes. Special concerns were focused to the cases, when each of condensers were submitted to a different cooling conditions, relatively. As a result. the heat transfer limitation of a U-shape heat pipe was found out to be 10∼15% less than the value for a straight heat pipe with an equivalent size.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.14 no.11
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• pp.871-879
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• 2002

The characteristics of flow and heat transfer in the heat exchanger of heat pipes with fins have been studied numerically for cooling enhancement of electronic components of KTX (Korea Train eXpress). Numerical analysis and methodology have been conformed by comparing the experimental results for inlined array of heat pipes. The staggered arrangement of heat pipes has been proposed in order to achieve heat transfer enhancement. As results, the geometry change to the staggered array is conformed to increase the heat transfer of the system accompanied by an increase of pressure drop. The current results of friction factor and Colburn j factor are presented in terms of Reynolds number and staggered distance, and are expected to use for design and manufacture of such a system.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1506-1511
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• 2003

The present study proposes a new structure for a flat plate heat pipe which could embody a thin thickness, any shapes and high heat density a unit area. It is on the structure for the formation of vapor passages and the support of the case of the flat plate heat pipe. A screen mesh is used as the one. To verify the validity of the one, the flat plate heat pipe of 1.08mm thickness was made with a layer of the screen mesh with 14 and 100 mesh number respectively and tested. Here the screen mesh with 14 mesh number plays a role of the vapor passage and the support of the case and the screen mesh with 100 mesh number functions as the wick structure. T he results show that the screen mesh excellently carries out the function of the vapor passage and the support of the case.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.2
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• pp.96-102
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• 2003

The thermal design of MGSE(Mechanical Ground Support Equipment) panel is performed for thermal vacum thest of Ka-band EQM(Engineering Qualification Model) payload of communications and broadcasting satellite. The thermal environments are predicted to evaluate the performance of transponder equipments in the thermal vacum chamber. SINDA is used to verify the thermal design of the heat pipe layout. Embedded 16 heat pipes in the EQM payload developed for Ka-band trasponder equipments are designded properly. The heat fluz loaded on the external facesheet is 265W/㎡ for the hot platear function test of the traspinder equipments, and the zero heat flux for the cold plateau case. The maxium predicted heat transport capability is 2723 W-cm.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.6
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• pp.569-575
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• 2011

Since the high heat generation of LED chips can cause a reduction in lifetime, degradation of luminous efficiency, and variation of color temperature, studies have been carried out on the optimization of LED packaging and heat sinks. Recently, LED packages have been applied to high-power lights such as car headlamps or street lights, and it is known that cooling using only free convection is not at all efficient. Thus, in this study, a heat pipe with forced convection was examined for the optimization of the cooling performance in high-power LED lights. In addition, optimal on-off control of a fan was adopted to increase the fan lifetime, since the lifetime of the fan is generally shorter than that of the LEDs.

• Journal of Advanced Marine Engineering and Technology
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• v.35 no.8
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• pp.1016-1021
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• 2011

The enhancement for cooling performance of heat sink is surely necessary to guarantee the performance of electronic products. So in this paper, the cooling performances of the aluminum heat sink with pulsating heat pipe(PHP) were investigated experimentally and numerically. The pulsating heat pipe was used as a heat spreader. Working fluid of PHP was R-22. Heat inputs were 30W, 60W, 80W and 100W, respectively. Heat sink was tested for forced convection conditions with air velocity of 1 ~ 4m/s. And CFD simulations were conducted for two different heat sinks. The results showed that the cooling performance of heat sink with pulsating heat pipe was higher than that of conventional heat sink. Therefore, the pulsating heat pipe can be a good tool to improve cooling performance of heat sink.

• Journal of Energy Engineering
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• v.7 no.1
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• pp.44-56
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• 1998

Separate heat pipe exchanger is considered as the high thermal transportation equipment, because evaporator and condenser are separately positioned in the long distance. Its characteristics are that the working fluid is circulated naturally by the position height of two exchangers. But the operating characteristics are restricted by the temperature of hot and cold fluid, flow pattern and diameter of vapor line, etc. in this study, the vapor pressure and the minimum height of two exchangers are studied about the factors restricting the operating characteristics.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2124-2129
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• 2007

A VCHP was fabricated and tested for its thermal performance. The container was made of copper, and the working fluid was water. STS-316 screen of mesh number 100 was inserted as a capillary structure. As a baseline performance, a normal heat pipe of the same dimensions was tested in advance to compare with VCHP, where an inert gas container was attached. The outer diameter of the heat pipe was 12.8 mm and the total length was 600 mm. The evaporator and the condenser lengths were both 200 mm. The thermal load ranged from 20 to 300W. Typical result revealed that the operating temperature of the VCHP stayed almost constant, while that of the normal heat pipe varied as much as 40$^{\circ}C$. Therefore, it was demonstrated that the VCHP is very effective for temperature control of heat-dissipating devices.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.360-364
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• 2001

Numerical Aanlysis is made on the thermal performance of micro heat pipe in a axial flat grooved channel. The flow of liquid and vapor is investigated in trapezoidal grooves and the effect of variable shear stress along the interface of the liquid and vapor considered. The results from this study are obtained in the axial variation of pressure difference between vapor and liquid, contact angle, velocity of liquid and vapor and so forth. In addition, maximum heat transport capacity of micro-heat pipe is provided by varying the operation temperature, and compared with that from Schneider and Devos's model in which the interfacial shear stress is neglected.