• 대한기계학회논문집B
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• 제31권3호
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• pp.256-263
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• 2007

The purpose of this study is to investigate the cooling performance of heat sinks for an electronic telecommunication system by adequate natural convection. Heat generation rates of electronic components and the temperature distributions of heat sinks and surrounding air are analyzed experimentally and numerically. In order to perform the heat transfer analysis for the thermal design of telecommunication system a program is developed. The program used the graphic user interface environment to determine the arrangement of heat sources, interior fan capacity, and heat sink configuration. The simulation results showed that the heat sinks were able to achieve a cooling capacity of up to 230W at the maximum temperature difference of $19^{\circ}C$. To verify the results from the numerical simulation, an experiment was conducted under the same condition as the numerical simulation, and their results were compared. The design program gave good prediction of the effects of various parameters involved in the design of a heat sinks for an electronic telecommunication system.

• 한국전산유체공학회지
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• 제21권3호
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• pp.98-109
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• 2016

The flow and heat transfer characteristics of a heat exchanger having rectangular pin-fin in the flow direction have been investigated numerically. On the bottom plate, the convective boundary conditions for the hot side was given, and the fins were arranged in a channel-type geometric model using the periodic boundary condition in the span-wise direction. Three-dimensional numerical calculations for the flow and conjugate heat transfer problem were conducted using SIMPLE algorithm and $k-{\varepsilon}$ turbulence model. For the slanted pin-fin models, it was found that the downward cooling flow is generated due to the downward pressure gradient component, which can enhance the heat transfer performance near the bottom surface and the fin stem region. Four different inclined angles were considered in the Reynolds number range of 13,500-55,000. The aero-thermal performance of the slanted pin-fin heat exchangers, such as the volume and area goodness factors, were summarized and compared with the baseline plate-fin type heat exchanger quantitatively.

• 설비공학논문집
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• 제18권12호
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• pp.1007-1016
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• 2006

Although the advance in electronic technology enables a large number of circuity to be packed in a small volume, it is simultaneously required to remove the high heat load produced by them. In this study, the heat transfer and pressure drop characteristics of a mini-channel heat exchanger, which is designed for liquid cooling of electronic components, are investigated by varying operating conditions. Water and FC-72 were used as working fluids. The mini-channel heat exchanger was made with circular shape channels having din-meters of 2, 3, and 4 mm in regular intervals, and the channel length was 100 mm. The header and inlet guide pathway to provide uniform inflow were attached at the inlet of the test section. Copper block including the heaters was attached at the sidewall of the test section as a heat source, which provided the heat flux from 5 to $15W/cm^2$. The entrance effects enhanced the heat transfer coefficient in the mini-channel significantly. In addition, the single-phase pressure drop in the mini-channel was very similar to that predicted by the laminar flow correlation except that the transition Re decreased due to flow instability in the entrance region.