• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.12 no.3
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• pp.227-234
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• 2000

An experimental study was performed for understanding the limiting power and heat transfer characteristics of an MHP having the diameter of 3 or 4 mm which could be applied to cooling of miniature electronic equipment such as the notebook PC CPU etc. The experimental parameters which are inclination, structure of the wick, the length of the condenser and the total heat pipe were considered. The MHP with a woven-wired wick has the advantages of the improvement in capillary limit, the effective attachment tightly toward wall and the convenience in construction of wick. Cooling performance of the present MHP was compared with that of MHP with grooved, fine fiber and sintered type wick which were applied by existing enterprises. With respect to the inclination of$ -5^{\circ}$ , an MHP having the diameter of 3 or 4 mm shows the limiting power of 6~14 W. Therefore, it is expected that the MHP of the present study has sufficient applicability of cooling of notebook PC of which the amount of heat generated is about 12 W.

• The Transactions of the Korean Institute of Power Electronics
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• v.6 no.6
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• pp.572-581
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• 2001

A heat pipe heat sink device which is to evacuate maximum heat of about 1800W from a powersemiconductor was designed and manufactured One set of cooling device os composed of an Aluminum block (130${\times}$160${\times}$35mm) 4 PFC heat pipes $(d_0 22.23mm)$ and 126 Aluminium fins (250${\times}$58${\times}$0.8mm) Experimental data obtained at a power of 1~2kW revealed that the total thermal resistance of the device varied 0.02~0.018$^{\circ}C$/W along with increasing air velocity from 2m/s to 3 m/s. The result represented a good satisfaction of requirement condition to maintain temperature rise of semiconductor lowe that $40^{\circ}C$ at 1800W and air velocity of 3 m/s Some important resistance such as convective resistances at both fins and heat pipes showed good agreement between mathematical predictions and measurement data.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.3
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• pp.391-400
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• 1999

The efficiency and capacity of an air source heat pump system decrease as the ambient temperature drops. One strategy of avoiding the decrease of the efficiency and capacity in air source heat pump system is to switch to another thermal energy source. Water can be a good candidate for the heat source. This paper presents the results of the performance analysis of heat pump system with a single unit dual source(SUDS) evaporator The heat exchanger combines two separated evaporators into a single evaporator and the object of the SUDS evaporator is to recover energy from dual heat sources, i.e. air and water. Simulation program is developed for the dual source heat pump system with a SUDS evaporator and experimental data are obtained and compared with the simulation results. Differences in heating capacity and COP are 7% and 8% respectively. Simulation results are in good agreement with the test results. Therefore, the developed program is effectively used for the design and performance prediction of the dual source heat pump system with a SUDS evaporator.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.3
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• pp.415-421
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• 2021

This study analyzed the effect on the cooling performance of the channel shape of a heat sink for an insulated gate bipolar transistor (IGBT). A serpentine channel was used for this analysis, and the parameter for the analysis was the number of curves. The analysis was conducted using computational fluid dynamics with the commercial software ANSYS fluent. One curve in the channel improved the heat dissipation performance of the heat sink by up to 8% compared to a straight-channel heat sink. However, two curves in the channel could not improve the heat discharge performance further. Instead, the two curves caused a higher pressure drop, which induces parasitic loss for the pumping of coolant. The pressure drop of the two-curve channel case was 2.48-2.55 times larger than that of a one-curve channel. This higher pressure drop decreased the heat discharge efficiency of the heat sink with two curves. The discharge heat per unit pressure drop was calculated, and the result of the straight heat sink was highest among the analyzed cases. This means that the heat discharge efficiency of the straight heat sink is the highest.

• Proceedings of the SAREK Conference
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• 2006.11a
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• pp.42-42
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• 2006

• Journal of Practical Engineering Education
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• v.7 no.1
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• pp.11-16
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• 2015

Learners acquire knowledge through many years of majors and educated classes. They convergence of engineering problem solving that combine a variety of subjects are difficult. In this paper, we suggest practical engineering problem solving model combined major educational courses for example optimization problem of heat sink temperature reduction.

• Proceedings of the KAIS Fall Conference
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• 2009.12a
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• pp.267-270
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• 2009

오늘날 전자 장비는 매우 다양한 기능의 채용으로 많은 양의 부품을 필요로 하고 그에 따른 전체 시스템의 무게와 크기를 줄이기 위해 소형화와 슬림화가 필수적이다. 따라서 다수의 부품 사용과 고성능화로 인한 열 발생 밀도도 크게 증가하여 열로 인한 온도 상승이 부품의 성능에 매우 중요한 요소로 작용하고 있다. 기기에서의 지속적인 열 발생은 기기를 탑재하고 있는 전체 시스템의 성능에도 큰 영향을 미치며, 특히 고온의 외기에 장시간 노출된 디지털전광판의 시효문제는 시급히 해결해야 할 당면 과제이기도 하다. 본 연구에서는 이와 같은 LCD 패널의 발열로 인한 기기의 성능 저하와 다운 현상을 예방할 수 있도록 열전소자를 이용한 알루미늄 압출형 히트싱크에 대한 열 저항기술을 개발하고, 냉각모듈에 대한 설계기술을 확보하여 LCD 패널용 고효율의 냉각시스템의 개발 과제를 수행했다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.3
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• pp.54-60
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• 2013

Numerical analysis of the radiant heat characteristic around heatsink according to arrangement and shape of fin on 60W-LED lamp is conducted in this study. In the case of top blow blowing from upper side on LED lamp, there is just little difference in cooling characteristics according to the height of fin. On the other hand, the fin arranged side by side has the advantage of heat transfer enhancement by comparing with zig-zag type because it leads to more loss of flow. In case of making fin round to increase the amount of heat transfer, designing arrangement with the minimized loss of flow has the advantage of characteristic.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.13 no.4
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• pp.271-287
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• 2001

This paper has been made to investigate the thermal performance characteristics for the several types of layered aluminum heat sinks with offset-strip fin. Heat sinks with different fin height, fin length, number of fin layer and slanted fin are prepared and tested for natural convection as well as forced convection. The experimental results for layered heat sink(LHS) are compared to those for advanced pin fin heat sink (PHS) so that the appropriate heat sink can be designed or chosen according to the heating conditions. The overall heat transfer performances for LHS are almost comparable to those of PHS under natural convection, and become 1.2∼1.5 times as high as those of PHS under forced convection situation. This study shows that fin height and number of fin layer re important parameters, which have a serious influence on thermal performance for layered heat sinks.

• Design & Manufacturing
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• v.12 no.1
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• pp.31-35
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• 2018

The peltier thermoelectric module are used to cool the heat generated by electronic equipment. In order to increase the efficiency of the peltier thermoelectric module, the heat must be released to the outside. A heat sink is used to discharge such heat to the outside. in this paper, two types of heat sinks with internal tunnels were designed. And the heating and cooling performance of the heat sink with internal tunnel structure was compared and analyzed through ANSYS. The heat sink of the A type had better heat transfer than the heat sink of the B type. Which is about 70% improved.