• Proceedings of the KSME Conference
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• 2007.05a
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• pp.360-365
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• 2007

This work is concerned with the topology optimization of three-dimensional cooling fins or heat sinks. Motivated by earlier success of the Internal Element Connectivity Method (I-ECP) method in two-dimensional problems, the extension of I-ECP to three-dimensional problems is carried out. The main efforts were made to maintain the numerical trouble-free characteristics of I-ECP for full three-dimensional problems; a serious numerical problem appearing in thermal topology optimization is erroneous temperature undershooting. The effectiveness of the present implementation was checked through the design optimization of three-dimensional fins.

• Journal of computational fluids engineering
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• v.18 no.2
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• pp.9-16
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• 2013

The heat transfer enhancement of heat sink with mist flow is studied numerically by solving the conservation equations for mass, momentum and energy in the continuous and dispersed phases. A Lagrangian method is used for tracing dispersed water droplets in the heat sink and an Eulerian species transport model for air and steam mixture. The continuous and dispersed phases are interacted with the drag and evaporation source terms. The computed results show that addition of evaporating mist droplets enhances the cooling performance of heat sink significantly.

• Journal of computational fluids engineering
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• v.14 no.1
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• pp.62-69
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• 2009

The cooling system for electric devices of hybrid vehicles is examined. The present system is composed of coolant paths, inlet diffuser and heat sinks whose shapes are diamond and circular. In this work, inlet duct and fin arrays are combined in proposed models and examined by numerical calculations. Nusselt number and Reynolds number are considered for heat transfer performance. Main focus lies on the looking for optimal model for the cooling system adopted to compact driving module of a hybrid vehicle. The optimal model shows uniform flow patterns in the inlet diffuser and secondary flows after the fins attached to heat source. It is found that the vortical flows around the heat sinks are effective for heat removal mechanism.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.67-72
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• 2015

A study on thermal properties for a single-layer metal and a 2-ply metal (clad metals) was investigated for the application of heat sink. For the single-layer metal, a stainless steel (STS) and an aluminum (Al) were selected. Also, a roll bonded clad metal with STS and Al was chosen for the 2-ply metal. The thermal conductivity of the sample was obtained from the thermal diffusivity measured by the light flash analysis (LFA), specific heat and density. Measured thermal property values were compared with the calculated values using the data from the references. For the single-layer metal, measured values for the thermal diffusivity and thermal conductivity were smaller than calculated values. Differences between measured and calculated values were about 6% and 18% for the STS and Al samples, respectively. For the clad metals, however, a large difference (55%) was observed. Here, a relatively small thermal conductivity measured by LFA was due to the existence of a interface between STS and Al in the clad metal. Such a interface reduces the moving velocity of free electrons and phonons in the clad metal. For the development of a high performance heat-issipation module with the multi-layer structure, the control of interface properties which determine thermal properties was confirmed to be important.

• Journal of computational fluids engineering
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• v.21 no.3
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• pp.98-109
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• 2016

The flow and heat transfer characteristics of a heat exchanger having rectangular pin-fin in the flow direction have been investigated numerically. On the bottom plate, the convective boundary conditions for the hot side was given, and the fins were arranged in a channel-type geometric model using the periodic boundary condition in the span-wise direction. Three-dimensional numerical calculations for the flow and conjugate heat transfer problem were conducted using SIMPLE algorithm and $k-{\varepsilon}$ turbulence model. For the slanted pin-fin models, it was found that the downward cooling flow is generated due to the downward pressure gradient component, which can enhance the heat transfer performance near the bottom surface and the fin stem region. Four different inclined angles were considered in the Reynolds number range of 13,500-55,000. The aero-thermal performance of the slanted pin-fin heat exchangers, such as the volume and area goodness factors, were summarized and compared with the baseline plate-fin type heat exchanger quantitatively.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.24 no.12
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• pp.1635-1643
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• 2000

The present work investigates a heat transfer phenomenon at the interface between a porous medium and an impermeable wall. In an effort to appropriately describe the heat transfer phenomenon at the interface, the heat transfer at the interface between the microchannel heat sink, which is an ideally organized porous medium, and the finite-thickness substrate is examined. From the examination, it is clarified that the he heat flux distribution at the interface is not uniform for the impermeable wall with finite thickness. On the other hand, the first approach, based on the energy balance for the representative elementary volume in the porous medium, is physically reason able. When the first approach is applied to the thermal boundary condition, and additional boundary condition based on the local thermal equilibrium assumption at the interface is used. This additional boundary condition is applicable except for the very th in impermeable wall. Hence, for practical situations, the first approach in combination with the local thermal equilibrium assumption at the interface is suggested as an appropriate thermal boundary condition. In order to confirm our suggestion, convective flows both in a microchannel heat sink and in a sintered porous channel subject to a constant heat flux condition are analyzed. The analytically obtained thermal resistance of the microchannel heat sink and the numerically obtained overall Nusselt number for the sintered porous channel are shown to be in close agreement with available experimental results when our suggestion for the thermal boundary conditions is applied.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.12
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• pp.1007-1016
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• 2006

Although the advance in electronic technology enables a large number of circuity to be packed in a small volume, it is simultaneously required to remove the high heat load produced by them. In this study, the heat transfer and pressure drop characteristics of a mini-channel heat exchanger, which is designed for liquid cooling of electronic components, are investigated by varying operating conditions. Water and FC-72 were used as working fluids. The mini-channel heat exchanger was made with circular shape channels having din-meters of 2, 3, and 4 mm in regular intervals, and the channel length was 100 mm. The header and inlet guide pathway to provide uniform inflow were attached at the inlet of the test section. Copper block including the heaters was attached at the sidewall of the test section as a heat source, which provided the heat flux from 5 to $15W/cm^2$. The entrance effects enhanced the heat transfer coefficient in the mini-channel significantly. In addition, the single-phase pressure drop in the mini-channel was very similar to that predicted by the laminar flow correlation except that the transition Re decreased due to flow instability in the entrance region.

• Journal of the Korean Institute of Intelligent Systems
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• v.25 no.2
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• pp.161-167
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• 2015

In this paper, a novel thermoelectric cooling system utilizing condensed water is introduced and its electrical equivalent circuit model is proposed. The introduced system can deals with the condensed water and improves efficiency by spraying the condensed water on heat sink. The electrical equivalent circuit model is derived by combining the circuit model of the classical thermoelectric cooling system with equation of heat exchange. Because the parameters of the model can be defined from not other experimental data but just the data sheet of the thermoelement, the model can be useful to design and develop the controller of the proposed system. We verify that the proposed model is valid and the introduced system is more efficient than the previous thermoelectric cooling system through simulations.

• Journal of the Korean Society of Industry Convergence
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• v.26 no.1
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• pp.183-191
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• 2023

This study was conducted experimentally to investigate the surface temperature of the heat sink, the air temperature in the flow channel and the sample temperature by changing the channel number of channel type heat sink and the air flow rate when heating and cooling the bio sample. The target temperature of the sample was 15℃ or less as the minimum value and 82℃ or more as the maximum value. In this study, the channel number of the heat sink(N = 1, 2, 4, 5, 10) and the air flow rate(Q=25, 42, 54m³/min) were varied. The bio sample was replaced with water, and the volume of water is 4mL. The size of the heat sink is 80x73x150mm and the material is aluminum. When cooling the sample, the surface temperature, the air temperature and the sample temperature were highly dependent on the number of channels and the flow rate. However, when the sample is heated, the surface temperature, air temperature and sample temperature do not depend on the number of channels and the flow rate. It was found that the conditions for satisfying the minimum temperature of 15℃ or less when cooling the sample were the number of channels N≥5 and the flow rate Q≥42m³/min. When heating the sample, the conditions to satisfy the maximum temperature of 82℃ or more are the number of channels N≤5 and the air flow rate Q≤42m³/min.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.33 no.12
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• pp.947-951
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• 2009

LED has the merits of high reliability, semi-permanent life, rapid-response and its small size for use as light source of head lamp. But the dependence of its performance and life on temperature affect on its practical use. Which dependence makes problem when the LED is heated up to a higher temperature level by self-generation of heat, due to "highly integration" to get enough quantity of light. To solve this problem, effective cooling system is needed that consider conduction, convection and radiation. This study points out the limits of natural convection cooling system and propose of forced convection with heat sink. Also, it describes a correlation between heat sink area and fluid velocity using numerical analysis to optimize the cooling system.