• 한국방사선학회논문지
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• 제16권5호
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• pp.585-594
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• 2022

현재 주로 사용되고 있는 디지털 방사선 검사용 검출기는 평면형의 구조를 가진 검출기로 이루어져 있어 곡률을 가진 검사 대상물의 디지털 방사선 검사 시 완전한 밀착이 불가능 하였다. 본 연구는 산업현장에서 배관 용접부를 대상으로 한 디지털 방사선 투과 검사 시 디지털 영상의 상질 개선을 위하여 곡률에 밀착이 가능한 커브드 형태의 검출기를 제작하였고, 공칭 두께가 각기 다른 6" 배관을 대상으로 평면형 검출기와 커브드 검출기를 사용한 디지털 방사선 영상을 획득하였다. 실험 결과, 평면형 검출기는 배관과 완전한 밀착이 되지 않아 배관 외곽부와 검출기 사이의 틈이 생기게 되고, 이로 인해 불선명도 차이가 생기면서 디지털 영상의 확산이 발생하는 것을 확인하였다. 반면, 커브드형 검출기는 배관 외곽부와 검출기 사이의 틈을 최소화 하여 평면형 검출기에 비해 디지털 영상의 확산이 적은 것을 확인하였다. 영상의 확신이 클수록 상질의 저하 및 판독의 오류가 발생할 수 있기 때문에 검사 대상물과 밀착이 가능한 검출기의 사용시 기존 평면형 검출기 보다 양질의 영상을 획득 가능할 것으로 사료된다.

• Journal of Welding and Joining
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• 제15권4호
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• pp.136-142
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• 1997

In this study, the amorphous foil filler, thickness of 20 - $20~30\mu\textrm{m}$ was made to develop Cu-7.5wt%Mn-7.5wt%Si insert alloy(melting point temperature : solidus line 1003K, liquidus line 1070K). Liquid phase diffusion bonding of 304 stainless steels (STS304), is carried out successfully by using developed Cu-7.5Mn-7.5Si insert alloy. Bonding conditions are taken from bonding pressure of 5MPa, bonding temperatures from 1073K to 1423K varied within 50K and brazing holding times of 0, 30, 60 and 240 minutes. As the results, the tensile strength in the liquid phase diffusion bonding is a little bit lower than that in the solid phase diffusion bonding. The authors find out that the liquid phase diffusion bonding needs lower bonding pressure than the others. Therefore, the liquid phase diffusion bonding had an excellent brazability in which the bonding process showed the typical mechanism of diffusion bonding. In corresponding, the new developed insert alloy of low melting pointed Cu-7.5Mn-7.5Si makes possible brazing between the STS304.

• Journal of Welding and Joining
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• 제11권4호
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• pp.70-78
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• 1993

An attempt was made to investigate the effect of brazing time on microstructure, microhardness, and corrosion of Zircaloy -4as well as the beryllium diffusion into its sheet. The sheets were coated with beryllium and brazed at $1020^{\circ}C$ for 20-40 minutes in $2{\times}10^{-5}$ torr vacuum atmosphere. 1. Microstructurally the brazed zone was largely divided into three regions: a region of continuous or partially formed of eutectic liquid films along grain boundaries; a region of precipitation in both grains and grain boundaries; a region of elongated wide structure of .alpha.-laths, which was not affected by beryllium. 2. Due to the precipitates, the beryllium-migrated region was hardened and the width of the hardened region increased with increasing brazing time. 3. Beryllium brazed Zircaloy -4 sheets showed a higher corrosion rate than those of as-received and heat-treated at a brazing temperature. 4. Diffusion coefficient of beryllium into Zircaloy -4 at $1020^{\circ}C$ for 30 minutes was $7.67{\times}10^{-7}cm^2/sec.$ It seemed that Be penetrated Zircaloy -4 by forming eutectic liquid films along grain boundaries in the proximity of Be/Zr interface and it, thereafter, diffused into Zircaloy mainly by interstitial solid solution.

• Journal of Welding and Joining
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• 제21권2호
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• pp.82-88
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• 2003

The bonding phenomenon and mechanism in the transient liquid phase bonding(TLP Bonding) of directionally solidified Ni base superalloy, GTD-111 was investigated. At the bonding temperature of 1403K, liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B and Si into the base metal and solids in the bonded interlayer grew epitaxially from mating base metal inward the insert metal. The number of grain boundaries formed at the bonded interlayer was corresponded with those of base metal. The liquation of grain boundary and dendrite boundary occurred at 1433K. At the bonding temperature of 1453K which is higher than liquation temperature of grain boundary, liquids of the Insert metal were connected with liquated grain boundaries and compositions in each region mixed mutually. In Joints held for various time at 1453t phases formed at liquated grain boundary far from the interface were similar to those of bonded interlayer. With prolonged holding time, liquid phases decreased gradually and liquids of continuous band shape divided many island shape. But liquid phases did not disappeared after holding for 7.2ks at 1453k. Isothermal solidification process at the bonding temperature which is higher than the liquation temperature of the grain boundary was controlled by diffusion of Ti to be result in liquation than B or Si. in insert metal. (Received January 15, 2003)

• Journal of Welding and Joining
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• 제14권2호
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• pp.1-9
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• 1996

철강재료에 대한 플라즈마질화법의 적용에는 지금까지 많은 연구결과가 나와 있는데, 탄소강이나 적합금강의 경우는 그 표면정도가 Hv400 - 900, 고합금강의 경우 는 Hv1000이상의 정도를 얻을 수 있으며, 내마모성도 향상한다고 알려져 있다. 그리 고 플라즈마질화처리에 의한 질화층의 형성기구나 화합물층 및 확산층의 생성에 관여 하는 처리조건의 영향, 질화층의 경도 및 깊이에 대한 합금원소의 영향등이 어느 정도 밝혀져 있다. 그리고 스테인레스강의 경우는 그 표면에 견고한 산화피막을 형성하기 때문에 염욕질화나나 가스질화법에 의한 처리가 일반적으로 곤란하다. 그러나 프라 즈마질화처리에 의하면, 분위기를 질소와 수소의 혼합가스로 함으로서 특별한 전처리 를 하지않고도 질화처리가 가능한 것으로 알려져 있다. 또한 철강재료 이외의 비철 금속에 대한 플라즈마질화처리의 적용이 검토되었으며, 질화물을 형성하기 쉬운 Ti 와 그 합금, Zr, Al 그리고 Va, AIa족원소의 경우는 Hv1000이상의 경도가 얻어진다는 것과 최적 질화조건등이 보고되어져 있다. 또한 질화물을 형성하지 않는 금속, 즉 Ni 나 Cu합금 등에 대하여도 Ti, Al 등의 질화물생성원소를 첨가하여 플라즈마질화법에 의한 표면경화특성도 검토되고 있다. 본 해설에서는, 탄소강, 탄소저합금강 등의 철강 재료를 중심으로하여 플라즈마질화처리한 경우의 표면경화특성에 대하여 서술하고자 한다.

• Journal of Welding and Joining
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• 제18권3호
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• pp.106-113
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• 2000

Single crystallization behavior ad high temperature tensile properties of TLP bonded joints of Ni-base single crystal superalloy, CMSX-2 were investigated using MBF-80 and F-24 insert metals. CMSX-2 was bonded at 1523~1548K for 1.5~1.8ks in vacuum. The (100) orientation of bonded specimen was aligned perpendicular to the joint interface. Crystallographic orientation analyzed points over the bonded region possessed the almost same orientation across the joint interface and misorientation $\Delta^{\theta}$ was negligibly small in as-bonded and post-bond heat-treated situations. It was confirmed that single crystallization could be readily achieved during TLP bonding. The tensile strengths of all joints at elevated temperatures were equal to or greater than those of base metal the range of testing temperature between 923K and 1173K. The elongation and reduction of area in values were almost the same as those of base metal. SEM observation of the fracture surfaces of joints after tensile test revealed that the fracture surface indicated the similar morphologies each other, and that the fracture of joints occurred in the base metal in any cases.

• Journal of Welding and Joining
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• 제13권3호
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• pp.147-156
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• 1995

The change of microstructure in the bonded interlayer and tensile properties of joints were studied for liquid phase diffusion bonding using STS-310 and Incoloy-825 as base metal and base metal+B alloy as insert inetal. Main experimental results obtained in this study are as follows. 1) The optimum amount of B addition into the insert metal was found to be about 4mass%. 2) When isothermal solidification was completed, the microstructure in the bonded interlayer was the same with that of the base metal because of the grain boundary migration in the bonded interlayer. 3) All of the tensile specimen fractured at base metal and joints bonded at optimum condition exhibited tensile properties in excess of base metal requirements. 4) It was determined that fine car-borides and bordes such as M$_{23}$(C,B)$_{6}$, Cr$_{2}$B, and CrB in STS-310S and TiB in Incoloy-825 exist at the grain boundary around bonded interlayer. These precipitates almost disappeared after homogenizing treatment at 1373K for 86.4ks.s.

• Journal of Welding and Joining
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• 제23권2호
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• pp.52-58
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• 2005

This study was carried out to investigate the effect of bonding temperature and heating rate on transient liquid phase diffusion bonding of Ni-base superalloy. The heating rate was varied by $0.1^{\circ}C$/sec, $1^{\circ}C$/sec, $10^{\circ}C$/sec to the bonding temperatures $1100^{\circ}C,\;1150^{\circ}C,\;1200^{\circ}C$ under vacuum. As bonding temperature increased, maximum dissolution width of base metal increased, but a dissolution finishing time decreased. The eutectic width of insert metal in the bonded interlayer decreased linearly in proportion to the square root of holding time during isothermal solidification stage. The bonding temperature was raised, isothermal solidification rate slightly increased. As the heating rate decreased and the bonding temperature increased, the completion time of dissolution after reaching bonding temperature decreased. When the heating rate was very slow, the solidification proceeded before reaching bonding temperature and the time required for the completion of isothermal solidification became reduced.

• Journal of Welding and Joining
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• 제19권3호
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• pp.311-316
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• 2001

This paper presents that the affecting factors to the solderability and initial reliability. It is the factor that the coefficient of thermal expansion between package and PCB(Printed Circuit Board), the quantity of solder paste and reflow condition, and Au thickness of the solder ball pad on polyimide tape. As the reflow soldering condition for 48 ${\mu}BGA$ is changed, it is estimated that the quantity of Au diffusion at eutectic Sn-Pb solder surface and initial bonding strength of eutectic Sn-Pb solder and lead free solder. It is the result that quantitative measurement of Au diffusion quantity is difficult, but the shear strength of eutectic Sn-Pb solder joint is 842 mN at first reflow and increases 879 mN at third reflow. The major failure mode in solder is judged solder fracture. So, Au diffusion quantity is more affected by reflow temperature than by the reflow times.

• Journal of Welding and Joining
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• 제20권5호
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• pp.93-98
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• 2002

The effect of bonding misfit on single crystallization of transient liquid phase (TLP) bonded joints of single crystal superalloy CMSX-2 was investigated using MBF-80 insert metal. The bonding misfit was defined by (100) twist angle (rotating angle) at bonded interface. TLP bonding of specimens was carried out at 1523K for 1.8ks in vacuum. The post-bond heat treatment consisted of the solution and sequential two step aging treatment was conducted in the Ar atmosphere. The crystallographic orientation analysis across the TLP bonded joints was conducted three dimensionally using the electron back scattering pattern (EBSP) method. EBSP analyses f3r the bonded and post bonded heat treated specimens were conducted. All bonded joints had misorientation centering around the bonded interface for as-bonded and post-bond heat treated specimens with rotating angle. The average misorientation angle between both solid phases in bonded interlayer was almost identical to the rotating angle at bonded interface. HRTEM observation revealed that the atom arrangement of both solid phases in bonded interlayer was quite different across the bonded interface. It followed that grain boundary was formed in bonded interface. It was confirmed that epitaxial growth of the solid phase occurred from the base metal substrates during TLP bonding and single crystallization could not be achieved in joints with rotating angle.