• 한국생산제조학회지
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• 제21권4호
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• pp.556-562
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• 2012

Micro electrical discharge machining (${\mu}EDM$) has been used for non-conventional material removal. One drawback of ${\mu}EDM$ is low productivity. In this study, we tried to find the optimal machining conditions to manufacture the micro hole with an optimal machining time without loss of accuracy. Taguchi method was used to figure out the relation between machining parameters and characteristics of the process. It was found that the electrode wear, the entrance and exit clearance gave a significant effect on the diameter of the micro hole when the diameter of the electrode was identical. Grey relational analysis was used to determine the optimal machining condition for minimum machining time without loss of accuracy. The obtained optimal machining condition was the input voltage of 80V, the capacitance of 680pF, the resistance of $500{\Omega}$, the feed rate of $1.5{\mu}m$/s and the spindle speed of 2900rpm. The machining time was reduced to 48% without loss of accuracy under the optimal machining condition.

• 소성∙가공
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• 제21권5호
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• pp.312-318
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• 2012

With an increasing trend toward miniaturization, electrical discharge machining(EDM) has been receiving a lot of attention as a suitable production technology for micro-parts, since it enables the machining of hard conductive materials with a high degree of repeatability and without alteration to the material. When a micro-hole is fabricated by EDM, however, the diameter of the inlet hole is larger than that of the outlet region due to the additional discharge effect caused by the eroded particles. In this paper, a shot blasting surface treatment, in which an abrasive material is accelerated through a pressurized nozzle and directed at the surface of a part, is suggested as an effective method to reduce the tapered shape of EDM micro-hole. In addition, the influence of process parameters such as spark-on time and electrode diameter on the machining performance was investigated. It is shown quantitatively that the difference in diameter between the inlet and outlet holes decreases with the shot blasting treatment and with decreasing spark-on time.

• 한국자동차공학회논문집
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• 제10권6호
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• pp.65-71
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• 2002

Characteristics of corona discharge of the different types of the plasma reactors which are cone-hole and cone-plate is investigated experimentally. The discharge starts at lower voltage for the cathode corona than the anode corona and spark occurs at higher voltage for the cathode corona. And the cathode corona makes more stable discharge than the anode corona. The effect of the base gas in corona discharge for different O$_2$/N$_2$ concentrations is related with the gas molecular weight. The discharge for the smaller molecular weight gas occurs easier than for the high molecular weight gas. The discharge current decreases with the increase of oxygen concentration and it increases more sharply for anode corona than for cathode corona as discharge voltage increases after corona onset voltage. NO-NO$_2$ conversion increases with the energy density of corona discharge and the addition of O$_2$ in a base N$_2$ gas.

• 한국의학물리학회지:의학물리
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• 제25권2호
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• pp.116-121
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• 2014

본 본문은 Bio-MEMS 공정으로 제작한 마이크로 세포 분석 바이오칩을 사용하여 적혈구의 광학적 특성을 전압으로 측정한 실험이다. Bio-MEMS 공정을 이용하여 세포의 원활한 이동과 측정 분석에 사용되는 글라스에 채널 패턴 에칭을 위하여 포토리소그래피(photolithography)와 산화완충식각(BOE: buffered oxide etchant) 공정 조건, 세포 분석과 정보 전달에 사용되는 광섬유의 에칭을 위하여 산화완충식각 공정 조건, 세포나 유체를 칩과 외부의 전달 등에 사용되는 글라스의 홀을 위하여 전기화학방전(ECD: electro chemical discharge) 공정 조건, 글라스 접합을 위한 자외선반응접합(UVSA: ultraviolet sensitive adhesives) 공정 조건을 정립하였다. 또한 유체나 세포의 흐름 제어를 위한 라미나 흐름 조건, 적혈구세포에 대한 산란빔 파형을 측정하였다. 적혈구 실험을 통하여 출력 광섬유의 각도에 따른 산란빔이 출력측의 광섬유각도가 $0^{\circ}$일 때 약 17 V, 각도가 $5^{\circ}$일 때 약 10 V, 각도가 $10^{\circ}$일 때 약 6 V, 각도가 $15^{\circ}$일 때 약 4 V의 전압(Vpp)으로 측정되었다. 따라서 마이크로 세포 분석 바이오칩 제작의 소형화, 단순화, 공정신간 단축, 정량화하였고 적혈구의 광학적 특성을 측정을 측정함으로써 의공학(biomedical), 바이오칩공학(biochip), 반도체공학(semiconductor), 생물정보학(bioinformatics) 등의 응용과학 분야 발전에 기여할 것으로 기대한다.

• 대한산업공학회지
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• 제38권3호
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• pp.220-226
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• 2012

The Electric discharge machining (EDM) process is used to minimize the difference between designed feature and machined feature while the most workpiece is removed through the cutting processes. The tiny-deep hole machining and perpendicular wall machining in mold and die are good applications of EDM. Among EDM equipment, the super drill uses the hollowed electrode to eliminate the debris which causes the second discharge with the electrode and degrades the machining quality. Through the hollow, the high pressured discharge oil is supplied to remove the debris together with the spindle rotation. The thin-hollow electrode tends to easily wear out compared to the sold die-sinking electrode and its wear rate is might not allowed to monitor in real time during discharging. Up to now, the wear amount is measured by off line method, which leads machining time to increase because the hole pass-through moment can be check by visual (manually) with the extra tool path. Therefore, this study suggests the attractive method to evaluate the hole pass-through moment in which the gap voltage and z-axis encoder pulse are monitored to predict the moment. The commercial super drill is used to validate the proposed method and the experiment is carried out.

• 한국기계가공학회지
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• 제16권1호
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• pp.36-41
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• 2017

In this paper, $Si_3N_4/hBN$ ceramics with various hexagonal boron nitride (hBN) contents (0, 10, 20, or 30 wt%) were fabricated via spark plasma sintering (SPS) at $1500^{\circ}C$, 50MPa, and 10m holding time. The material properties such as the relative density, hardness, and fracture toughness were systematically evaluated according to the hBN content in the $Si_3N_4/hBN$ ceramics. The results show that relative density, hardness, and fracture toughness continuously decreased as the hBN content increased. In addition, peak-step drilling (with tool diameter $500{\mu}m$) was performed to observe the effects of hBN content in micro-hole shape and cutting force. A machined hole diameter of $510{\mu}m$ (entrance) and stable cutting force were obtained at 30 wt% hBN content. Consequently, $Si_3N_4/30wt%$ hBN ceramic is a feasible material upon which to apply semi-conductor components, and this study is very meaningful for determining correlations between material properties and machining performance.