• 제목/요약/키워드: 혼의

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공차설계에 의한 플립칩 접합용 초음파 혼의 제작 비용 최적화 (Manufacturing Cost Optimization of Ultrasonic Horn for Flip-chip Bonding using Tolerance Design)

  • 김종혁;권원태;이수일
    • 한국정밀공학회지
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    • 제29권8호
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    • pp.879-886
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    • 2012
  • The ultrasonic horn used for bonding of flip chip has been designed to vibrate at a natural frequency. The ultrasonic horn must be manufactured accurately in physical terms, because the small change of mechanical properties may result in the significant change of natural frequency. Therefore, tight tolerance is inevitable to keep the natural frequency in acceptable range. However, since tightening of the tolerance increases the manufacturing cost significantly, trade-off between the cost and accuracy is necessary. In this research, an attempt was made to design the ultra sonic horn within acceptable natural frequency while the manufacturing cost was kept as low as possible. For this purpose, among the 18 tolerances of physical terms of the ultrasonic horn, the most important 4 factors were selected using Taguchi method. The equation to relate those main factors and the natural frequency was made using response surface method. Finally, optimal design scheme for minimum manufacturing cost without a loss of performance was determined using SQP method.

와이어 본딩용 트랜스듀서 혼의 진동 특성 (Vibration Characteristics of a Wire-Bonding Transducer Horn)

  • 임빛;한대웅;이승엽;안근식;강경완;김국환
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2007년도 추계학술대회논문집
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    • pp.583-588
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    • 2007
  • This paper investigates the vibration characteristics of a wire-bonding transducer horn for high speed welding devices. The sample wire-bonder uses the input frequency of 136 kHz. The ultrasonic excitation causes the various vibrations of transducer horn and capillary. The vibration modes and frequencies close to the exciting frequency are identified using ANSYS. The nodal lines and amplification ratio of the ultrasonic horn are also obtained in order to evaluate the bonding performance of the sample wire-bonder system. The FEM results and experimental results show that the sample wire-bonder system uses the bending mode of 136 kHz as principal motion for bonding. The major longitudinal mode exists at 119 kHz below the excitation frequency. It is recommeded that the sample system is to set the excitation frequency at 119 kHz to improve bonding performance.

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4중 릿지 도파관과 렌즈를 이용한 새로운 광대역 혼 안테나 (A Novel Broadband Horn Antenna with Quadruple-Ridged Waveguide and Dielectric Lens)

  • 이기오;박동철
    • 한국군사과학기술학회지
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    • 제11권6호
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    • pp.135-141
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    • 2008
  • 본 논문에서는 다중 편파 및 3:1 이하의 대역폭을 갖는 광대역 혼 안테나 설계 기법을 제시하였다. 급전단은 다중 편파 및 광대역 구현을 위하여 4중 릿지(Quadruple Ridge) 형태의 도파관을 적용하였으며, 반구(Semi­sphere) 형태의 백 쇼(Back Short)를 갖는 캐비티 구조내에 쇼팅 바(Shorting Bar)를 삽입함으로써 반사손실을 최소화하였다. 안테나 개구면에서의 위상보정을 통해 안테나 범 패턴을 개선시키기 위하여 주름진 형태의 유전체 렌즈를 설계하였다. 설계 기법을 기반으로 제작된 얀테나의 측정결과를 제시함으로써 설계 방법의 타당성을 겸증하였다.

진보사서 '조이아 혼'과 그녀의 도서관 자유 사상 (Progressive Librarian 'Zoia M. Horn' and Her Library Freedom Ideologies)

  • 김선호
    • 한국도서관정보학회지
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    • 제47권4호
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    • pp.43-68
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    • 2016
  • 이 글의 목적은 현대 진보사서직 사상의 추세와 다양성을 밝혀서 국내 사서직의 사상적 그리고 정치적 지평을 넓히는데 도움을 주는 것이다. 이 목적을 달성하기 위하여, 미국의 대표적 진보사서인 '조이아 혼(Zoia M. Horn, 1918-2014)'이 자서전에서 기술하고 있는 도서관 자유사상을 귀납적 방법으로 분석하여 결과를 도출하였다. 그 결과, Horn의 핵심적인 도서관 자유사상은 평등, 지적자유, 그리고 인류평화라는 것과 이러한 핵심 사상의 구성요인들을 규명하였다.

위성통신용 삼중대역 동시사용 안테나 설계 (Design of a Simultaneously Operable Tri-band Antenna for SATCOM)

  • 우병석
    • 한국인터넷방송통신학회논문지
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    • 제15권2호
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    • pp.195-202
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    • 2015
  • 위성통신 서비스가 점점 증가함에 따라 단일대역 안테나의 성능을 넘어서는 이중대역 또는 삼중대역 안테나의 필요성도 증가하고 있다. 본 논문에서는 위성통신용 삼중대역 동시사용 안테나를 제안한다. 교체형 혼을 통해 삼중대역을 구현하는 일반적인 다중대역 안테나와는 달리 주름형 혼과 유전체 혼으로 구성된 삼중대역 급전부 조립체 및 그레고리안 타입의 반사판을 사용하여 삼중대역(X, Ku, Ka대역) 신호의 동시 송수신을 가능하게 한다. 제안된 안테나의 특성은 모의실험과 실제측정으로 비교 분석하였다. 그 결과, 제안된 삼중대역 안테나의 방사패턴은 모의실험 계산결과와 비슷한 성능을 보였고, 규격 또한 만족하였다.

Horn의 음향 모델링 연구 - 음향 혼의 해석 및 설계 - (A Study on the Acoustic Modeling of Horn - Analysis and Design of Acoustic Horn -)

  • 사종성;박석태
    • 한국소음진동공학회논문집
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    • 제24권7호
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    • pp.537-548
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    • 2014
  • In this paper, horn loudspeaker modeling was suggested, investigated and verified through comparison of test results and simulation ones based on input electrical impedance curves and acoustic sensitivity ones. First, Thiele Small parameters of horn driver were identified by using pseudo loudspeaker model concept and verified in case of both closed and open horndriver. Second, cone-shaped horn models were investigated and compared with input acoustic impedance curves for real horn(cone angle $6.6^{\circ}$) and short horn(cone angle $27.9^{\circ}$). It showed that Leach model for cone horn was well described to test results, which were electrical impedance and acoustic sensitivity, compared to Lemaitre one. To represent horn system model good approximation in wide frequency range, mass correction filter and lowpass filter were adopted and consequently showed good fitted to test results.

플립칩 접합용 초음파 혼의 목표 주파수와 모드를 고려한 2차원 및 3차원 위상최적화 설계 (2D and 3D Topology Optimization with Target Frequency and Modes of Ultrasonic Horn for Flip-chip Bonding)

  • 하창용;이수일
    • 한국소음진동공학회논문집
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    • 제23권1호
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    • pp.84-91
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    • 2013
  • Ultrasonic flip-chip bonding needs a precise bonding tool which delivers ultrasonic energy into chip bumps effectively to use the selected resonance mode and frequency of the horn structure. The bonding tool is excited at the resonance frequency and the input and output ports should locate at the anti-nodal points of the resonance mode. In this study, we propose new design method with topology optimization for ultrasonic bonding tools. The SIMP(solid isotropic material with penalization) method is used to formulate topology optimization and OC(optimal criteria) algorithm is adopted for the update scheme. MAC(modal assurance criterion) tracking is used for the target frequency and mode. We fabricate two prototypes of ultrasonic tools which are based on 3D optimization models after reviewing 2D and 3D topology optimization results. The prototypes are satisfied with the ultrasonic frequency and vibration amplitude as the ultrasonic bonding tools.

새로운 파일롯 신호 인가 기법을 이용한 피드포워드 선형증폭기의 설계 (Design of Feedforward Linear Power Amplifier using Novel Injection Method of a Pilot Signal)

  • 이경희;박웅희;강상기
    • 한국전자파학회논문지
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    • 제13권10호
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    • pp.998-1004
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    • 2002
  • 본 논문은 하나의 파일롯 신호를 이용하여 다중 캐리어를 수용하는 IMT-2000 전 대역에서 동작하는 중계기용 Feedforward 선형증폭기의 설계 및 제작에 관한 것이다. 본 논문에서 제시한 방법은 기존에 나와있는 파일롯 신호 인가 방법과는 달리 하나의 파일롯 신호를 분기하여 첫번째 루프(혼변조 신호 추출 루프)와 두번째 루프(혼변조 신호 제거 루프)에 인가함으로써, 증폭기에 입력되는 입력신호의 주파수와 레벨의 변화에 따라 자동 적응적으로 혼변조 신호들을 제거하도록 설계하였다. 제작 결과 2110 MHz - 2170 MHz 주파수 범위에서 최종 출력이 20 W$_{avg}$ 일 때 임의의 20 MHz에서 IMD 특성이 -60 dBc 이하가 됨으로써 20 dB 이상을 개선시켰으며 제안된 선형증폭기는 중계기의 다중캐리어 선형증폭기로서 적합함을 확인하였다.

초음파 금속 용착용 40kHz 혼의 설계와 용착성 평가 (Design and Weldability Verification of the 40kHz Horn for Ultrasonic Metal Welding)

  • 장호수;박우열;박동삼
    • 한국기계가공학회지
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    • 제12권2호
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    • pp.55-61
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    • 2013
  • The horn is a key part of the ultrasonic welder. As the shape, mass and material of a horn have effects on the resonant frequency and the vibration mode in ultrasonic welding, a horn has to be designed and manufactured accurately. In this study, 40kHz band horn was designed and manufactured through the vibration mode and finite element analysis. A result of modal analysis showed that the natural frequency of the horn was 39,794Hz, and the frequency response by a harmonic response analysis was 39,800Hz - close to the intended frequency, 40kHz. In addition, weldability of the developed horn was estimated by welding of two Ni sheets and tensile-shear test of welded samples. It was shown the developed horn could be used in metal sheet welding.

플립칩 접합용 초음파 혼의 CFD 열유동 해석 (Heat transfer analysis of CFD at the Ultrasonic horn bonding flip chip)

  • 심현석;리광훈
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회B
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    • pp.2750-2753
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    • 2008
  • This paper introduce the CFD analysis for predicting the heat transfer at the Ultrasonic horn. Approximately Ultrasonic horn separates two part. One is preheating part and the other is cooling part. Temperature of preheating part rise up by $260^{\circ}C$ that make it possible to attach a chip to a semiconductor. Also there is a piezo material in the cooling part. When piezo work, it generates heat of $100^{\circ}C$. It can stand by $150^{\circ}C$. But the high temperature conducted from the preheating part has a bad affect on the piezo. These situation make it necessary cooling at piezo. Previously except of the piezo, all of them are composed of the SUS440c that has good thermal conductivity. This study shows way that not only cooling the piezo but also cutting off the conduction between preheating part and cooling part by using the Ti and Duralumin that have low thermal conductivity compare with the SUS440c. Conclusion of CFD analysis that the heat coming from the piezo can't be transferred the horn cause of the Ti and Duralumin.

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