• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.54.1-54.1
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• 2009

유기 태양전지는 전도성 고분자를 사용하고, 상온 공정이 가능한 초저가의 태양전지로서 주목 받는 태양전지이다. 하지만 변환 효율이 낮아 효율 향상이 큰 이슈가 되고 있다. 본 실험에서는 유기 태양전지의 효율 향상을 위해서 나노 임프린트 리소그래피 및 핫엠보싱 리소그래피 방법을 사용하여 미세 기능성 패턴을 형성하였다. 나노 임프린트 리소그래피 및 핫엠보싱 리소그래피는 나노미터급 크기의 고해상도 패턴을 빠르고 경제적으로 형성할 수 있는 가장 유망한 차세대 리소그래피 기술로써, 이를 이용한 미세패턴 구조의 형성으로 인해 다양한 기판의 투과도 향상을 확인 할 수 있었다. 또한, 태양전지 기판에 적용함으로써 향상된 광학적 특성으로 인해 태양전지 효율 향상을 확인 할 수 있었다.

• Journal of the Korean Vacuum Society
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• v.13 no.1
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• pp.34-38
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• 2004

Hot embossing master is indispensable for the fabrication of polymeric optical waveguides using hot embossing technology. Sidewall roughness of silicon master is directly related to optical loss of optical waveguides In this paper, a silicon master was fabricated by using a deep-RIE process. Additionally, thermal oxidation followed by oxide removal was carried out to minimize etched Si sidewall roughness. Thermal oxidation and oxide removal were performed with $H_2O_2$ atmosphere at $1050^{\circ}C$ and $NH_4$F:HF=6:l BOE, respectively, for the oxide thickness of 400$\AA$, 1000$\AA$, 3000$\AA$, 4500$\AA$, 5600$\AA$ and 6200$\AA$. The sidewall roughness was characterized by SEM and SPM-AFH measurements. We found that the roughness was improved from 12nm (RMS) to 6nm (RMS) for the scalloped sidewall and from 162nm (RMS) to 39nm (RMS) for the vertical striation sidewall, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2003.08a
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• pp.71-71
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• 2003

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.371-376
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• 2003

The hot embossing process has been mentioned as one of major nanoreplication techniques. This is due to its simple process, low cost, high replication fidelity and relatively high throughput. As the initial step of quantitating the embossing process, simple parametric study about embossing time have been carried out using high-resolution masters which patterned by the DRIE process and laser machining. Under the various embossing time, the viscous flow of thin PMMA films into microcavities during Compression force has been investigated. Also, a study about simulating the viscous flow during embossing process has planned and continuum scale FDM analysis was applied on this simulation. With currently available test data and condition, simple FDM analysis using FLOW3D was made attempt to match simulation and experiment.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.05a
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• pp.259-264
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• 2004

The hot embossing process as a method for the fabrication of polymer is becoming increasingly important because of its simple process, low cost, high replication fidelity and relatively high throughput. In this paper, we carried out experimental studies and numerical simulations in order to understand the viscous flow of polymer film during hot embossing process. As the initial step of quantitating the hot embossing process, simple parametric studies for the embossing conditions have been carried out using high resolution masters which patterned by DRIE process. Under different embossing times and pressures, the viscous flow of PMMA films into micro/nano cavities has been investigated. Also, the viscous flow during the hot embossing process has been simulated by the continuum based FDM analysis considering micro/nano effect, such as surface tension and contact angle.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.305-310
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• 2004

The Hot Embossing Lithography(HEL) as a method for the fabrication of nanostructure with polymer is becoming increasingly important because of its simple process, low cost, high replication fidelity and relatively high throughput. In this study, we investigated the characteristics of hot embossing lithography as a nanoreplication technique. To grasp characteristics of nano patterning rheology by process parameters(embossing temperature, pressure and time), we have carried out various experiments by using the DVD(400nm pattern width) and Blu-ray nickel stamps(150nm pattern width). During the hot embossing process, we have observed the characteristics of the size effect. The quality of products made by hot embossing is affected by its cooling shrinkage. The demolding process at the glass transition temperature results in low quality because of the shrinkage of the polymer. Therefore, the quantification of the temperature condition is essential for the replication of high quality.

• Proceedings of the Materials Research Society of Korea Conference
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• 2008.05a
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• pp.32.1-32.1
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.95-96
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.321-322
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.629-630
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• 2013