• Journal of the Korean Chemical Society
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• v.60 no.6
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• pp.402-409
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• 2016

Thin films of lead sulfide colloidal quantum dots (CQDs) of 2.8 nm in diameter are fabricated and their surfaces are passivated by 3-mercaptopropionic acid (MPA) ligand or hybrid type ($MPA+CdCl_2$) ligand, respectively. The changes in valence band electronic structure and atomic composition of each PbS CQD film upon post-treatment such as air, N2 annealing or UV/Ozone have been studied by photoelectron spectroscopy. The air annealing makes the CQD fermi level to move toward the valence band leading to "p-type doping" regardless of ligand type. The UV/Ozone post-treatment generates $Pb(OH)_2$, $PbSO_x$ and PbO on both CQD surfaces. But the amount of the PbO has been reduced in hybrid type ligand case, especially. That is probably because the extra Pb cations in (111) surface are additionally passivated by $Cl_2$ ligand, which limits the reaction between the Pb cation and ozone.

• Polymer(Korea)
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• v.33 no.5
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• pp.452-457
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• 2009

Hybrid nanomaterials consisting of multi-walled carbon nanotube(MWNT) and/or PEDOT of conductive polymer were prepared in this study. In the presence of catalyst and ligand, the MWNT-Br compound prepared by the successive surface treatment reaction was mixed with MMA to initiate the atom transfer radical polymerization process. PMMA was covalently linked to the surface of MWNT for the formation of MWNT/PMMA nanocomposites. The EDOT and oxidant were added in the aqueous emulsion of PS produced via a miniemulsion polymerization process and then it proceeded to carry out the oxidative chemical polymerization of EDOT for the preparation of PEDOT/PS nanoparticles with the core-shell structure. The aqueous dispersion of PEDOT:poly(styrene sulfonate) (PSS) was mixed with the silica particles treated with a silane compound and thus PEDOT:PSS-clad silica nanoparticles were prepared by the surface chemistry reaction. The hybrid nanomaterials were analyzed by using TEM, FE-SEM, TGA, EDX, UV, and FT-IR.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.104-104
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• 2003

다양한 구조를 갖는 polysilsesquioxane은 열적, 전기적, 기계적 성질이 우수하여 차세대 고집적 반도체용 저 유전율 층간 절연막 재료로 부각되고 있으며, 유/무기 하이브리드 재료로 많은 연구 대상이 되고 있다. 그러나 PMSSQ(polymethylsilsesquioxane)는 취성으로 인한 반도체 제조의 CMP 공정에서 미세 크렉 발생의 위험이 있으므로 막의 인성 강화가 요구되고 있다. 이를 위하여 PMSSQ의 취성을 보완하기 위한 목적으로 선형 분자인 dimethylsiloxane을 10-20mo1% 도입하고자 하였다. 이때 도입된 dimethylsiloxane기가 PMSSQ에 균일하게 분포하지 않으면 실리콘 기판에 코팅 후 약 43$0^{\circ}C$의 열처리 공정 중에 열분해 되는 위험이 있다. 이에 따라 본 연구에서는 dimethylsiloxane기의 열분해에 의한 문제를 최소화하기 위하여 출발 물질인 MTMS(methyltrimethoxysilane)와 DMDMS(dimethyldimethoxysilane)과의 가수분해 속도차이를 고려한 단계(step) 반응법과 MTMS 와 DMDES(dimethyldiethoxysilane)를 사용한 리간드 교환법(ligand exchange)으로 dimethylsiloxane이 PMSSQ에 도입된 공중합체를 합성하였다. 각 합성 방법에 따라 합성된 공중합 PMSSQ의 특성을 TGA, TG-IR, $^1$H-NMR, $^{29}$ Si-NMR과 in-situ IR을 통하여 분석하였다. 또한 dimethylsiloxane 도입 양 및 상기 제조 방법에 따라 합성한 공중합체를 Si 기판위에 코팅하여 43$0^{\circ}C$에서 열처리한 후 코팅막의 강도, 두께 및 굴절율 변화를 ellipsometry 와 nanoindenter로 분석하였다.