• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.162-165
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• 2007

TFT-LCD process has two advantages as compared with the semiconductor-process. It is that cycle time is short and number of the final products are small. But it needs complicated inspection / assembly line to be treated manually and much higher labor costs in the TFT-LCD process. Also, It is necessary to build PICS(Production Information and Control System) which is automated and intelligent. In this paper, an automated process of LCD module assembly line that can increase productivity and reduce the cost of production to strengthen the competitiveness corresponding with global market is planned in comparison with its manual/semi-auto. It is noted that The automated line for COG$\sim$FOG process replacing with the existing facilities had the following effects; the productivity is increased to about 1.5 times and labor cost reduced 85%. In addition, whole assembly line can be short and simple.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.7-12
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• 2010

In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding, observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.