Plasma surface treatment of polyimide for adhesive Cu/80Ni20Cr/PI flexible copper layer laminate (Cu/80Ni20Cr/PI계 FCCL에서의 PI의 플라즈마 전처리에 따른 부착력의 영향)
-
- Proceedings of the Korean Institute of Surface Engineering Conference
- /
- 2006.04a
- /
- pp.144-144
- /
- 2006