• Title/Summary/Keyword: 프린팅

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Synthesis of Ultrafine LaAlO$_3$ Powders with Good Sinterability by Self-Sustaining Combustion Method Using (Glycine+Urea) Fuel ((Glycine+Urea) 혼합연료를 이요한 자발착화 연소반응법에 의한 우수한 소결성의 초미분체 LaAlO$_3$ 분말 합성)

  • Nam, H.D.;Choi, W.S.;Lee, B.H.;Park, S.
    • Journal of the Korean Ceramic Society
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    • v.36 no.2
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    • pp.203-209
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    • 1999
  • LaAlO3d single phase used as the butter layer on Si wafer for YBa2Cu3O7-$\delta$ superconductor application were prepared by solid state reaction method and by self-sustaining combustion process. The microstructure and crystallity of synthesiszed LaAlO3 powder studied using scanning electron microscope (SEM) and X-ray diffractometer(XRD), specific surface area and sintering characteristics fo powder were investigated by Brunauer-Emmett-Teller (BET) method and dilatometer respectively. In solid state reaction method, it is difficult to obtain LaAlO3 single phase up to 150$0^{\circ}C$ period. However, in self-sustaining combustion process, it is to easy to do it only $650^{\circ}C$. Based on the results of analysis of dilatometer it is easier to obtain high sintering density (98.87%) in self-sustaining combustion process than in the solid state reaction method. This reason is that the average particle size prepared by self-sustaining combustion process is nano crystal size and has high specific surface are value(56.54 $m^2$/g) compared with that by solid state reaction method. Also, LaAlO3 layer on the Si wafer has been achieved by screen printing and sintering method. Even though the sintering temperature is 130$0^{\circ}C$, the phenomena of silicon out diffusion in LaAlO3/Si interphase are not observed.

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Preparation and Optoelectric Characteristics of Low Power Consumption Type AC Powder EL Devices with Dielectrics and Rear Contact (유전재료와 후면전극에 따른 저전력 소비형 AC Powder EL 소자 제조 및 광전기적 특성)

  • Lee, Kang-Ryeol;Park, Sung
    • Journal of the Korean Ceramic Society
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    • v.39 no.2
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    • pp.120-125
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    • 2002
  • AC powder EL devices were fabricated by screen printing method with the dielectric materials in insulating layer and the electrical resistivity of rear electrode. Brightness and current density were measured at voltage range of 50∼300 $V_{rms}$ to estimate optoelectrical properties of AC powder EL devices, respectively. Frequency generator was used as system producing frequency and voltage of a sine wave. Brightness and current density were measured by luminometer and multimeter. Also, dielectric constant for dielectric layer was measured by impedance analyser after preparing thick film. Dielectric constant was improved with amount of $TiO_2$ to $BaTiO_3$ powder. By applying such a process to dielectric layer of low cost AC powder EL device, brightness was improved to 50 cd/$m^2$ at similar current density. Dielectric constant $BaTiO_3$ powder by solution combustion process is better than commercial $BaTiO_3$ powder. By applying to that of low power consumption AC powder EL device, brightness was improved to 85 cd/$m^2$. Brightness of AC powder EL device was relatively decreased by control of electrical resistivity of rear electrode, current density was also decreased.

Analysis of Defective Causes in Real Time and Prediction of Facility Replacement Cycle based on Big Data (빅데이터 기반 실시간 불량품 발생 원인 분석 및 설비 교체주기 예측)

  • Hwang, Seung-Yeon;Kwak, Kyung-Min;Shin, Dong-Jin;Kwak, Kwang-Jin;Rho, Young-J;Park, Kyung-won;Park, Jeong-Min;Kim, Jeong-Joon
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.19 no.6
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    • pp.203-212
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    • 2019
  • Along with the recent fourth industrial revolution, the world's manufacturing powerhouses are pushing for national strategies to revive the sluggish manufacturing industry. Moon Jae-in, the government is in accordance with the trend, called 'advancement of science and technology is leading the fourth round of the Industrial Revolution' strategy. Intelligent information technology such as IoT, Cloud, Big Data, Mobile, and AI, which are key technologies that lead the fourth industrial revolution, is promoting the emergence of new industries such as robots and 3D printing and the smarting of existing major manufacturing industries. Advances in technologies such as smart factories have enabled IoT-based sensing technology to measure various data that could not be collected before, and data generated by each process has also exploded. Thus, this paper uses data generators to generate virtual data that can occur in smart factories, and uses them to analyze the cause of the defect in real time and to predict the replacement cycle of the facility.

VR, AR Simulation and 3D Printing for Shoulder and Elbow Practice (VR, AR 시뮬레이션 및 3D Printing을 활용한 어깨와 팔꿈치 수술실습)

  • Lim, Wonbong;Moon, Young Lae
    • Journal of the Institute of Electronics and Information Engineers
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    • v.53 no.12
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    • pp.175-179
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    • 2016
  • Recent advances in technology of medical image have made surgical simulation that is helpful to diagnosis, operation plan, or education. Improving and enhancing the medical imaging have led to the availability of high definition images and three-dimensional (3D) visualization, it allows a better understanding in the surgical and educational field. The Real human field of view is stereoscopic. Therefore, with just 2D images, stereoscopic reconstruction process through the surgeon's head, is necessary. To reduce these process, 3D images have been used. 3D images enhanced 3D visualization, it provides significantly shorter time for surgeon for judgment in complex situations. Based on 3D image data set, virtual medical simulations, such as virtual endoscopy, surgical planning, and real-time interaction, have become possible. This article describes principles and recent applications of newer imaging techniques and special attention is directed towards medical 3D reconstruction techniques. Recent advances in technology of CT, MR and other imaging modalities has resulted in exciting new solutions and possibilities of shoulder imaging. Especially, three-dimensional (3D) images derived from medical devices provides advanced information. This presentation describes the principles and potential applications of 3D imaging techniques, simulation and printing in shoulder and elbow practice.

Thick Film Gas Sensor Based on PCB by Using Nano Particles (나노 입자를 이용한 PCB 기반 후막 가스 센서)

  • Park, Sung-Ho;Lee, Chung-Il;Song, Soon-Ho;Kim, Yong-Jun
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.2 s.43
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    • pp.59-63
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    • 2007
  • This paper presented a low-cost thick film gas sensor module, which was based on simple PCB (Printed Circuit Board) process. The proposed sensor module included a $NO_2/H_2$ gas sensor, a relative humidity sensor, and a heating element. The $NO_2/H_2$ gas and relative humidity sensors were realized by screen-printing $SnO_2,\;BaTiO_3$ nano-powders on IDTS (Interdigital Transducer) of a PCB substrate, respectively. At first 1% $H_2$ gas flowed into the sensor chamber. After 4 min, air filled the chamber while $H_2$ gas flow stopped. This experiment was performed repeatedly. The Identical procedure was used for the $NO_2$ detection. The result for sensing $H_2$ gas showed the increase of voltage from 0.8V to 3.5V due to the conductance increase and its reaction response time by hydrogen flow was 65 sec. $NO_2$ sensing results showed 2.7 V voltage drop due to the conductance decrease and its response time was 3 sec through a voltage monitoring.

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Study of Optimization and Characteristics of PSCF3737(Pr0.3Sr0.7Co0.3Fe0.7O3) for IT-SOFC (중저온형 SOFC를 위한 PSCF3737(Pr0.3Sr0.7Co0.3Fe0.7O3) 공기극 물질의 특성 및 최적화께 관한 연구)

  • Park, Kwang-Jin;Lee, Chang-Bo;Kim, Jung-Hyun;Baek, Seung-Wook;Bae, Joong-Myeon
    • Journal of the Korean Electrochemical Society
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    • v.10 no.3
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    • pp.207-212
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    • 2007
  • [ $PSCF3737(Pr_{0.3}Sr_{0.7}Co_{0.3}Fe_{0.7}O_3)$ ] is a good candidate cathode material for IT-SOFC(intermediate temperature solid oxide fuel cell) because of high MIEC(mixed ionic electronic conductor) conductivity. In this study, the characteristics of PSCF3737 was investigated and optimizations of sintering temperature and thickness for $PSCF3737(Pr_{0.3}Sr_{0.7}Co_{0.3}Fe_{0.7}O_3)$ was carried out. Impedance responses were divided into two parts by frequency region. Middle frequency part (${\sim}10^2\;Hz$) was concerned with oxygen reduction reaction on surface and low frequency part (${\sim}10^{-1}\;Hz$) was related with oxygen diffusion. The reasonable sintering temperature and thickness of cathode were $1200^{\circ}C$ and about $27\;{\mu}m$ with regard to EIS(electrochemical impedance spectroscopy). ASR(areas specific resistance) of optimized cathode is $0.115\;{\Omega}\;cm^2$ at $700^{\circ}C$.

The Reminding Words Evaluation Method for Icon Design (연상단어 평가를 통한 아이콘 디자인 연구)

  • Ha, Kwang Soo
    • The Journal of the Korea Contents Association
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    • v.14 no.10
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    • pp.64-72
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    • 2014
  • As the importance of interface became emphasized recently, function of icon as an element that helps operation and formative function as an aesthetic element are becoming emphasized. Specially, various research methodologies for measuring the understanding degree of users are being attempted in functional aspect, however, they are facing limitations as user evaluation method of quantitative investigation for statistical analysis became overly dependent on the consent from majority. To overcome such limitation, a methodology of measuring sensibility as aesthetic impression or individuality based on the system of emotion or system of understanding of users and designing icon based on the measurement is being attempted continuously. Therefore, this study suggested an evaluation method using reminding words and conducted an empirical study to apply results on the icon design by applying the evaluation method on icon design of printing products to measure the user sensibility and understanding level. Through this process, this study intended to research summaries on the design evaluation method which based on the evaluation of user sensibility and understanding level and to debate effective design methodologies through the process of applying these summaries on the project. The intention was to progress discussion from practical application perspectives apart from the textbook type discussion by applying a research methodology through concrete cases. This study objectified sensibility and understanding level of users in the icon design aspect, suggested a methodology that can be applied on the design, and it is expected to be used when progressing the icon and GUI design.

Solvent-free UV-curable Acrylic Adhesives for 3D printer build sheet (3D 프린터 빌드시트용 무용제 UV 경화형 아크릴 점착제의 제조)

  • Lee, Bae Hwa;Park, Dong Hyup;Kim, Byung Jick
    • Journal of Adhesion and Interface
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    • v.21 no.3
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    • pp.93-100
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    • 2020
  • 3D printing technology enables proper objects to be made through an additive manufacturing method, but resulting in dimension deviation of the product due to contraction phenomenon as cooling melted filament resin injected from high-temperature use environment. In this research, we studied on acrylic adhesives for 3D printer build sheet in order to fabricate high-quality products with a precise shape and to well-mount without distortion. The solvent-free UV-curable acrylic adhesive formulation was designed by adding 4-acryloylmorpholine (ACMO) with high adhesion, toughness, glass transition temperature so that adhesion properties are stable at high temperature and products are easily mounted/detached from the adhesives. The designed formulation was polymerized through two-steps using post-addition of monomers. Using this, the acrylic adhesive was coated to make a film and then analyzed using various experimental techniques. As a result, the fabricated adhesive exhibited high glass transition temperature and there was little gap in peel strength before and after thermal treatment. Moreover, it was confirmed by rheological analysis that this adhesive can provide great bonding/debonding ability without distortion. We demonstrated the fabrication of a rectangular product using a 3D printing method using our acrylic adhesive as a build sheet. Mounting ability and workability were satisfactory and dimension deviation of the product was tiny. Because the product is easily detachable from the acrylic adhesive developed here than conventional build sheets, it is expected that this will provide work convenience to users who use the 3D printer.

Fabrication of Bendable Gd2O2S:Tb Intensifying Screen and Evaluation of Fatigue Properties (유연한 Gd2O2S:Tb 증감지 제작 및 피로누적에 대한 영향)

  • Park, Ji-Koon;Yang, Sung-Woo;Jeon, Je-Hoon;Kim, Joo-Hee;Heo, Ye-Ji;Kang, Sang-Sik;Kim, Kyo-Tae
    • Journal of the Korean Society of Radiology
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    • v.11 no.7
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    • pp.611-617
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    • 2017
  • In this study, it was expected that long-term stability against external mechanical external force could be secured if the phosphor layer had ductility. In this study, a bendable $Gd_2O_2S:Tb$ sensitized paper was fabricated by screen printing method and the image uniformity was evaluated through RMS analysis and histogram analysis to investigate the effect of fatigue accumulation due to long-term external force and repetitive external force. As a result, the dominant pixel area is maintained constant and the relative standard deviation is less than 10% for the long-term external force. However, for the repetitive external force, the dominant pixel area is divided into three areas and the image uniformity is adversely affected. Based on these results, it is suggested that the curved surface detector can be applied by securing the mechanical stability against the existing radiation sensitized paper. However, further studies are needed to apply it to the flexible detector. As a result, flexible radiation sensitizers can be applied to various curved surfaces, and it is expected to be applicable to various fields such as nuclear medicine, medical treatment, and industrial fields in the future.

Wafer Level Hermetic Sealing Characteristics of RF-MEMS Devices using Non-Conductive Epoxy (비전도성 에폭시를 사용한 RF-MEMS 소자의 웨이퍼 레벨 밀봉 실장 특성)

  • 박윤권;이덕중;박흥우;송인상;김정우;송기무;이윤희;김철주;주병권
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.4
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    • pp.11-15
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    • 2001
  • In this paper, hermetic sealing technology was studied for wafer level packaging of the RF-MEMS devices. With the flip-chip bonding method. this non-conductive B-stage epoxy sealing will be profit to the MEMS device sealing. It will be particularly profit to the RF-MEMS device sealing. B-stage epoxy can be cured by 2-step and hermetic sealing can be obtained. After defining 500 $\mu\textrm{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was, then, aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line could be maintained during the sealing process. The height of the seal-line was controlled within $\pm$0.6 $\mu\textrm{m}$ in the 4 inches wafer and the bonding strength was measured to about 20MPa by pull test. The leak rate, that is sealing characteristic of the B-stage epoxy, was about $10^{-7}$ cc/sec from the leak test.

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