• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.29 no.1
• /
• pp.43-49
• /
• 2023

This study reports on the preparation of sodium caseinate-cardanol (CasNa/CL)-based papers coated with different amounts of bentonite (BN) for use as a sustainable packaging material. Their chemical and morphological structures, mechanical properties, water vapor permeability, surface properties, and antioxidant activity of coated papers was assessed as a function of the BN content. The drying of the CasNa/CL coated papers led to the formation of pinholes on their surfaces owing to the presence of trapped water resulting from the difference in the drying rate between the external surface and the inside of the coated layers. Increasing the BN content reduced the pinholes on surface of CasNa/CL/BN coated papers and highly decreased the water vapor transmittance rate of the papers from 387.3±1.9 g/m²·day to 269.25±4.5 g/m²·day. Free radical scavenging assays indicated the addition of CL to the CasNa exhibited the antioxidant activity and antioxidant activity of CasNa/CL/BN did not changed as increase of BN contents. The improved water vapor barrier property and antioxidant activity of CasNa/CL/BN coated papers can be promised for various packaging applications.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.39 no.9
• /
• pp.923-928
• /
• 2015

In this paper, we propose an ultrasonic magnetic abrasive polishing (US-MAP) technique to effectively machine a high-strength material, and we prove the efficiency of hybrid finishing. We use Taguchi's experimental method to determine the influence of each parameter. Based on the results, US-MAP exhibited a higher polishing efficiency than traditional MAP, and a suitable frequency for hybrid finishing was 28 kHz. When investigating the effect of the parameters on the surface roughness, the ultrasonic amplitude had the greatest effect. However, when machining with $55-{\mu}m$ amplitude, the machining efficiency decreased as the magnetic flux density varied.

• Clean Technology
• /
• v.7 no.3
• /
• pp.203-214
• /
• 2001

A silicon oxide cleaning characteristic and its mechanism were studied in RF plasma cleaning system with various gases such as $CHF_3$, $CF_4$, Argon, oxygen and mixing gas. The experimental parameters - working pressure (100 mTorr), RF power (300 W, 500 W), electrode distance (5cm, 8cm, 11.5cm), cleaning time (90, 180 seconds), gas flow (50 sccm) were fixed to compare cleaning efficiency by gas types. The results were as follows. First, the argon plasma is retaining only physical sputtering effect and etch rate was low. Second, the oxygen plasma showed good cleaning efficiency in electrode distace of 5cm, 300W, 180secs, but surface roughness increased. Third, $CF_4$ Plasma could get the best cleaning efficiency. Fourth, $CHF_3$ plasma could know that addition gas that can lower the CFx/F ratio need. We could not get good cleaning efficiency in case of added argon to $CHF_3$. But, we could get good cleaning efficiency in case added oxygen.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.8 no.3
• /
• pp.407-410
• /
• 1998

The characteristics of $(Ba,Sr)TiO_3$[BST] thin films with the variation of $O_2/Ar$ ratio in sputtering gas deposited on $RuO_2$ bottom electrode were investigated. Dielectric constant of BST film increases from 135 to 190 with increasing oxygen partial pressure from 10 to 50, which is mainly due to the improved crystallinity of BST film. The instability of $RuO_2$ surface in $BST/RuO_2$ interface and the increase in the surface roughness of BST thin films with higher $O_2/Ar$ ratio appeared to play an important roles on the degradation of the leakage current characteristics of $Al/BST/RuO_2$ capacitor with various $O_2/Ar$ ratio in sputtering gas. As a consequence, the leakage current of BST thin film showed the lowest value of $1.9{\times}10^{-7}\; A/{\textrm}{cm}^2$ at $O_2/Ar{\approx}1/9$.

• Korean Journal of Optics and Photonics
• /
• v.8 no.4
• /
• pp.277-282
• /
• 1997

The complex refractive index of Diamond-like Carbon (DLC) thin films, which can be applied to optical devices or electrical devices, have been determined using optical methods. DLC thin films are grown on Si(100) substrates and vitreous silica substrates respectively, using the technique of plasma enhanced chemical vapor deposition (PECVD). The spectroscopic ellipsometry data($\psi$, $\Delta$) and the transmission spectra of these DLC films are obtained. These optical spectra are analyzed with the help of the Sellmeier dipersion relation and a quantum mechanically derived dispersion relation. Using spectroscopic ellipsometry data at their transparent region, the refractive index and the effective thickness of DLC films on vitreous silica are model calculated, Then the transmission spectra are inverted to yield the extinction coefficient spectra k(λ) at absorbing region. These spectra are fit to the quantum mechanical dispersion relation and the best fit dispersion constants are determined. The complex refractive indices are easily calculated with these constants. The spectroscopic ellipsometry data at the absorbing region in model calculated to give the packing densities and the degrees of surface microroughness of DLC films. Discussions are made in correlation with the growth condition of DLC films.

• Journal of the Korean Vacuum Society
• /
• v.13 no.1
• /
• pp.34-38
• /
• 2004

Hot embossing master is indispensable for the fabrication of polymeric optical waveguides using hot embossing technology. Sidewall roughness of silicon master is directly related to optical loss of optical waveguides In this paper, a silicon master was fabricated by using a deep-RIE process. Additionally, thermal oxidation followed by oxide removal was carried out to minimize etched Si sidewall roughness. Thermal oxidation and oxide removal were performed with $H_2O_2$ atmosphere at $1050^{\circ}C$ and $NH_4$F:HF=6:l BOE, respectively, for the oxide thickness of 400$\AA$, 1000$\AA$, 3000$\AA$, 4500$\AA$, 5600$\AA$ and 6200$\AA$. The sidewall roughness was characterized by SEM and SPM-AFH measurements. We found that the roughness was improved from 12nm (RMS) to 6nm (RMS) for the scalloped sidewall and from 162nm (RMS) to 39nm (RMS) for the vertical striation sidewall, respectively.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.6 no.4
• /
• pp.130-137
• /
• 1997

The demand for wire-cut EDM is increasing rapidly in the die and tool making industry. In this study machining characteristics such as machining rate, surface roughness, hand drum form and hardness of machined material are investigated experimentally under the conditions varing pulse on time, pulse off time, peak voltage, wire tension after fixing other conditions in SKD 11 and brass and brass workpiece. It was found that various operating conditions had significant influences on machining characteristics. But the hardness of workpiece was uneffected by operating conditions. Also it was obtained experimentally that brass workpeice had better machinability than SKD 11 one.dition according to the current(Ip) in an electric spark machine : 1) Electrode is utilized Cu and Graphite. 2) Work piece is used the material of carbon steel. The condition of experiment is : 1) Current is varied 0.7(A) to 50(A) and the time of electric discharging to work piece in each time is 30(min) to 60(min). 2) After the upper side of work piece was measured in radius(5$\mu$m) of stylus analyzed the surface roughness to ade the table and graph of Rmax by yielding data. 3) Electro wear ratio is : \circled1Cooper was measured ex-machining and post-machining by the electronic balance. \circled2The ex-machining of graphite measured by it, the post-machining was found the data from volume $\times$specific gravity and analyzed to made its table and graph on ground the data. 4) In order to keep the accuracy of voltage affected to the work piece was equipped with the A.V. R and the memory scope was sticked to the electric spark machine. 5) In order to preserve the precision of current, to get rid of the noise occured by internal resistance of electric spark machine and to force injecting for the discharge fluid , it made the fixed table for a work piece to minimize the work error by means of one's failure during the electric discharging.

• Journal of the Korean Society of Hazard Mitigation
• /
• v.9 no.4
• /
• pp.53-59
• /
• 2009

The purpose of this research is particle shape evaluation of granular soil and aggregate using Digital Image Process(DIP). DIP is very useful to measure the roughness and particle shape of aggregates. Couple of aggregates, like standard sand, two different crushed stones, and two different marine aggregates, have been employed. Shape factor of two different marine aggregates is ranged 0.35 to 0.54. Crushed stone I is that of 0.74 which is highly flat, but standard sand is elongated shape. Especially, two marine aggregate showed a big difference of width and length which meaned a long shape. There is any significant difference of elongation ratio and flakiness for each aggregate with different measuring system, like direct measurement of vernier calipers and DIP method. Within the limited test results, DIP is one of useful to get the particle shape of aggregate with limitation of measuring errors and to apply the particle distribution curve.

• Tribology and Lubricants
• /
• v.32 no.2
• /
• pp.67-71
• /
• 2016

This study investigates the characteristics of the sapphire wafer chemical mechanical polishing (CMP) process. The material removal rate is one of the most important factors since it has a significant impact on the production efficiency of a sapphire wafer. Some of the factors affecting the material removal rate include the pressure, platen speed and slurry. Among the factors affecting the CMP process, we analyzed the trends in the material removal rate and surface roughness, which are mechanical factors corresponding to both the pressure and platen speed, were analyzed. We also analyzed the increase in the material removal rate, which is proportional to the pressure and platen speed, using the Preston equation. In the experiment, after polishing a 4-inch sapphire wafer with increasing pressure and platen speed, we confirmed the material removal rate via thickness measurements. Further, surface roughness measurements of the sapphire wafer were performed using atomic force microscopy (AFM) equipment. Using the measurement results, we analyzed the trends in the surface roughness with the increase in material removal rate. In addition, the experimental results, confirmed that the material removal rate increases in proportion to the pressure and platen speed. However, the results showed no association between the material removal rate and surface roughness. The surface roughness after the CMP process showed a largely consistent trend. This study demonstrates the possibility to improve the production efficiency of sapphire wafer while maintaining stable quality via mechanical factors associated with the CMP process.

• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.5
• /
• pp.133-138
• /
• 2002

The technique of high speed machining is widely studied in machining fields, because the high efficiency and accuracy in machining can be obtained in high speed machining. Unfortunately the development of tool fur high speed machining in not close behind that of machine tool. In this study, 10 types flat endmill is prepared for obtaining data according to tool shape. Especially, we concentrated in helix angle, number of cutting edge and rake angle. Cutting condition is selected for several experiments and measuring cutting farce, tool life, tool wear and chip shape according to cutting length. 3-axis cutting farces are acquired from the tool dynamometer with high natural frequency, as the conventional tool dynamometer (9257B, Kistler) has cannot measure the state of high frequency force. Particularly, we found out that the axial cutting force waveform has a good relation with tool wear features. And flow is interrupted at the beginning of cutting by the decrease of rake angle. By above results. it is suggested the endmill tool with 45$^{\circ}$helix angle, 6 cutting edge and -15$^{\circ}$rake angle is suitable for high speed machining.