• The Journal of Korean Academy of Prosthodontics
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• v.54 no.3
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• pp.218-225
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• 2016

Purpose: The purpose of this study was to evaluate the push-out bond strength of glass-fiber post cemented with different adhesive systems and surface treatments. Materials and methods: 160 tooth samples made from 48 human maxillary single-rooted teeth with similar root length were divided into 4 groups according to the adhesive system (no adhesive, Adper Single Bond 2, Clearfil SE Bond, Clearfil S3). Each group had 4 subgroups according to the post surface treatment methods (no treatment, sandblast, silane, sandblast and silane). Posts (Parapost Fiber White) were cemented with Rely X Unicem. The teeth were sectioned perpendicular to their long axis into 1-mm thick sections. The push-out tests was performed at a speed of 0.5 mm/min. The results were evaluated by 2-way ANOVA, 1-way ANOVA and multiple comparison procedures (Tukey test) (${\alpha}=0.05$). Results: Tukey test showed that the adhesive system significantly influenced the push-out strength. The Clearfil SE Bond group showed the highest value. Post surface treatments showed no significant effect. Conclusion: Bond strength of glass-fiber post cemented with self-adhesive resin cement using Clearfil SE Bond showed significantly higher values compared to other adhesive systems.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.15-19
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• 2015

We demonstrated an inspection system for detecting discoloration of PCB Cu ball pad with an OSP surface finish. Though the OSP surface finish has many advantages such as eco-friendly and low cost, however, it often shows a discoloration phenomenon due to a heating process. In this study, the discoloration was analyzed with device-independent CIELAB color space. First of all, the PCB samples were inspected with standard lamps and CCD camera. The measured data was processed with Labview program for detecting discoloration of Cu ball pad. From the original PCB sample image, the localized Cu ball pad image was selected to reduce the image size by the binarization and edge detection processes and it was also converted to device-independent CIELAB color space using $3{\times}3$ conversion matrix. Both acquisition time and false acceptance rate were significantly reduced with this proposed inspection system. In addition, $L^*$ and $b^*$ values of CIELAB color space were suitable for inspection of discoloration of Cu ball pad.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.383.2-383.2
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• 2016

임계 열유속 현상은 열전달 시스템에서 가열조건이나 유동조건이 변함에 따라 열전달 표면 부근의 유체상태가 액체에서 기체로 바뀌면서 열전달계수가 급격히 감소하는 현상을 말한다. 임계 열유속 발생 시 핵 비등 영역에서 순간적으로 막 비등 영역으로 넘어가면서 원전 시스템의 물리적 파괴를 일으킬 수 있게 된다. 따라서 임계 열유속 현상은 시스템 설계 및 안전해석 뿐만 아니라, 열교환 및 냉각 장치 설계에서 중요하게 고려되고 있다. 특히, 비등 열전달 시스템에서 임계 열유속 발생 시 시스템의 물리적 손상을 야기하게 된다. 따라서 원전 시스템을 보호하면서 성능을 극대화시키기 위해서는 임계 열유속 향상이 필수적이며, 임계 열유속 향상을 위한 대안 중 하나로서 열적 특성이 우수한 나노유체를 열전달 시스템에 적용하여 임계 열유속 향상을 위한 연구가 지속되고 있다. 따라서 본 연구에서는 산화 처리된 다중벽 탄소나노튜브 나노유체를 사용하여 각각 0.5 m/s, 1.0 m/s, 1.5 m/s의 유속에서 임계 열유속과 열전달 계수를 측정하였다. 그 결과 산화 처리된 다중벽 탄소나노튜브 나노유체의 유속이 증가 할수록 임계 열유속이 증가하는 것을 확인 하였으며, 순수물과 비교하여 최대 62.64% 증가함을 확인하였다. 그리고 산화 처리된 다중벽 탄소나노튜브 나노유체의 비등 열전달 계수 또한 유속이 증가 할수록 비등 열전달 계수가 증가하는 것을 확인하였며 최대 24.29% 증가함을 확인하였다.

• Membrane Journal
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• v.18 no.4
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• pp.354-361
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• 2008

Effects of operational conditions and solution chemistry on permeate flux in a hybrid ozone-ceramic ultra-filtration (UF) membrane system treating natural organic matter (NOM) were investigated. Results showed that the extent of permeate flux decline was higher at higher cross-flow velocity and ozone dosage, but it was higher at lower transmembrane pressure (TMP). The mechanism of fouling mitigation was found to be more dependent upon reaction between ozone and natural organic matter at/near catalytic membrane surface than scouring effect due to ozone gas bubbles. Addition of calcium into model NOM solution at high pH led to significant decline in permeate flux while the calcium effect on permeate flux decline was less pronounced at lower pH. After permeate flux decline during the early stage of filtration, the flux started recovering and approached fully to the initial value of it due to degradation of NOM by catalytic ozonation at ceramic membrane surface in the hybrid ozone-ceramic membrane system.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.8
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• pp.11-16
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• 2008

In this paper, firstly we made of the rapid thermal processor equipment with the specifically useful structure to measure wafer stress. Secondly we made of the laser interferometry to inspect the wafer surface curvature based on the large deformation theory. And then the wafer surface fringe image was obtained by experiment, and the full field stress distribution of wafer surface comes into view by signal processing with thining and pitch mapping. After wafer was ground by 1mm and polished from the back side to get easily deformation, and it was heated by three to four times thermal treatments at about 1000 degree temperature. Finally the severe deformation between wafer before and after the heat treatment was shown.

• Polymer(Korea)
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• v.29 no.3
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• pp.221-230
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• 2005

Interfacial interactions and interphases played a key role in multicomponent materials irrespectively of the number and type of their components or their actual structure. They were equally important in particulate filled polymer, polymer blends, fibers-reinforced advanced composites, nanocomposites or biomimetic materials. Recognition of the role of the main factors influencing interfacial adhesion and proper surface modification could lead to significant progress in many fields of research and development, as well as in related technologies. Although the role and importance of interfaces and interphases were the same for all multicomponent materials, the surface modification could be always selected according to the objectives targeted, as well as to the characteristics of the particular system. In this wort therefore, several types of surface modification were performed to improve the interfacial interactions between two components in composite system and their results for the composites were investigated.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.1-6
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• 2014

The demand for fine-pitch devices is increasing due to an increase in I/O pin count, a reduction in power consumption, and a miniaturization of chip and package. In addition non-scalability of Cu pillar/Sn cap or Pb-free solder structure for fine-pitch interconnection leads to the development of bumpless interconnection system. Few bumpless interconnect systems such as BBUL technology, SAB technology, SAM technology, Cu-toCu thermocompression technology, and WOW's bumpless technology using an adhesive have been reviewed in this paper: The key requirements for Cu bumpless technology are the planarization, contamination-free surface, and surface activation.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.40 no.1
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• pp.41-49
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• 2022

Recently interests on the application of thermal cameras have increased with the advance of image analysis technology. Aside from a simple image acquisition, applications such as digital twin and thermal image management systems have gained popularity. To this end, we studied the effect of emissivity on the DN (Digital Number) value in the process of derivation of a relational expression for converting DN to an actual surface temperature. The DN value is a number representing the spectral band value of the thermal image, and is an important element constituting the thermal image data. However, the DN value is not a temperature value indicating the actual surface temperature, but a brightness value indicating high and low heat as brightness, and has a non-linear relationship with the actual surface temperature. The reliable relationship between DN and the actual surface temperature is critical for a thermal image processing. We tested the relationship between the actual surface temperature and the DN value of the thermal image, and then the radiation adjustment was performed to better estimate actual surface temperatures. As a result, the relation graph between the actual surface temperature and the DN value similarly show linear pattern with the relation graph between the radiation-controlled non-contact thermometer and the DN value. And the non-contact temperature after adjusting the emissivity was closer to the actual surface temperature than before adjusting the emissivity.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.12 no.5
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• pp.91-97
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• 2012

Recently, the performances of electrical and electronic devices are improving while the sizes are becoming smaller. As sound-generating systems, the two-dimensional speakers have been developed in place of conventional three-dimensional ones. Piezoelectric materials show the mechanical vibrations due to the voltage applied from outside the materials. The early film speakers had a limitations of output power in that it was not easy to make the conducting macromolecular films on the surfaces of the materials due to the internal chemical properties of materials. We have adopted the corona surface treatment in order to improve the output characteristics by increasing the adhesion of the coating material on to the surface of the center material of piezo film. The results showed the improvement of output power in the wider range of operating frequencies.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.13-20
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• 2023

The process of microelectromechanical system (MEMS) fabrication involves surface treatment to impart functionality to the device. Such surface treatment method is the self-assembled monolayer (SAM) technique, which modifies and functionalizes the surface of MEMS components with organic molecule monolayer, possessing a precisely controllable strength that depends on immersion time and solution concentration. These monolayers spontaneously adsorb on polymeric substrates or metal/ceramic components offering high precision at the nanoscale and modifying surface properties. SAM technology has been utilized in various fields, such as tribological property control, mass-production lithography, and ultrasensitive organic/biomolecular sensor applications. This paper provides an overview of the development and application of SAM technology in various fields.