• Proceedings of the Optical Society of Korea Conference
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• 2001.02a
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• pp.162-163
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• 2001

폴리머를 이용한 광통신 소자는 실리카를 재료로 사용하는 소자와는 달리 고품질의 박막을 얻는 과정이 단순하고, 소자의 제조단가를 줄일 수 있어 많은 주목을 받고 있다 광통신 소자에 응용되는 여러 폴리머 중에서도 폴리이미드는 PMMA (Poly Methyl MethAcrylate) 등 다른 고분자 물질에 비해서 매우 높은 열적 및 환경적 안정성을 가지고 있는 것으로 알려져 있다. 또한 최근에는 폴리이미드가 가지는 단점인 복굴절과 흡수를 낮추기 위하여 불소기 등을 함유한 폴리이미드가 개발되었으며, 굴절률 조정 또한 용이하게 되었다. (중략)

• Polymer(Korea)
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• v.26 no.3
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• pp.375-380
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• 2002

Diamines (p-phenylenediamine , m-phenylenediamine , and n-hexamethylenediamine) were intercalated into sodium montmorillonite for the further reaction with the anhydride end groups of polyamic acid. The anhydride terminated polyamic acid was synthesized using a mole ratio of 4,4'-oxydianilline : 1,2,4,5-benzene tetracarboxylic dianhydride = 1.50 : 1.53. The modified montmorillonite was reacted with polyamic acid terminated with anhydride group in N-methyl-2-pyrrolidone (polyamic acid/clay nanocomposite). After imidization, thin films of the polyimide/clay nanocomposite were prepared. From the results of XRD and TEM, we found that mono layered silicates were dispersed in polyimide matrix and those resultants were exfoliated nanocomposites. Mechanical properties of exfoliated polyimide nanocomposite were better than both those of pure polyimide and those of intercalated polyimide nanocomposite.

• Proceedings of the Membrane Society of Korea Conference
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• 1997.10a
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• pp.71-72
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• 1997

1. 서론 : 공기중의 산소분리용 고분자막은 높은 선택도를 동시에 요구한다. 이 두가지 조건을 만족시키는 소재 개발과 기존의 고분자물질을 수식하는 연구가 진행되고 있다. 고분자막에 대한 수식방법으로는 UV처리, plasma처리등이 있으나, 이들 방법은 선택도는 증가시키나 투과도를 감소시키는 경향이 있다. 기체의 투과저항을 줄이기 위하여 다공성 지지체 위에 박막을 입힌 복합막과 박막의 skin layer와 sub-layer를 갖는 비대칭막은 투과저항을 줄일수 있으나 선택도는 고분자 고유의 80%정도까지 감소되는 것으로 알려졌다. 본 연구의 목적은 고분자 복합막의 투과분리특성을 향상시키기 위한 것으로 지지층의 세공과 표면에 실리카/고분자를 충전, 피복시켜 투과분리특성을 조사하였다. 현재까지의 연구는 낮은 투과계수와 높은 선택도를 갖는 고분자물질이 사용되었으나, 본 연구에서는 폴리이미드로는 폴리이미드 중에서 투과계수가 가장 높다고 알려진 6FDA-p-TeMPD[{(3,3',4,4'-dicarboxyphenyl)hexafluoropropanedianhydride}-{2,3,5,6-Tetra-methyl-1,4-phenylenediamine}] 폴리이미드를 택하였으며 다공성지지체는 aluminum oxide를 사용하였다 . 본 실험에서는 선택도와 투과속도에 주로 영향을 미치는 폴리이미드와 실리카의 양에 대하여 고찰하였다.

• Elastomers and Composites
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• v.47 no.2
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• pp.168-173
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• 2012

Polystyrene-polyimide core-shell microsphere was prepared by dispersion polymerization using poly(amic acid) as the stabilizer. Iron oxide was formed at the microsphere by thermal decomposition of iron pentacarbonyl impregnated in the microsphere. The magnetic polystyrene-polyimide microsphere was monodisperse and the size was about 500 nm. The magnetic polystyrene-polyimide microsphere had 40% of iron oxide, which was identified as $Fe_3O_4$ by X-ray diffraction.

• Polymer(Korea)
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• v.24 no.2
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• pp.228-236
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• 2000

The preparation of organophilic clay from Na$^{+}$-MMT was achieved by intercalation of alkylammonium bromide. The dispersed organophilic clay in NMP was then added to the solution of polyamic acids (BPDA-PPD, BTDA-ODA/ MPD) in NMP. After curing at 30$0^{\circ}C$, thin films of the polyimide/clay nanocomposite were prepared. The results of X-ray diffraction (XRD) shelved that the d-spacings of dried polyamic acid (PAA)-clay complexes increased in proportion to the chain length of the onium ion and patterns of two kinds of PAA-clay complexes were similar. The d-spacings of approximately 13.2 $\AA$ for the polyimide/clay nanocomposites were independent of the initial onium ion chain length and the species of PAA. From the study of XRD and transmission electron microscopy (TEM), we found layered silicates were dispersed in polyimide matrix and the resultants were intercalated nanocomposites. TGA result showed thermal stability of polyimide nanocomposite improved a little more than the pure polyimide. From the result of dynamic mechanical property, we found that the storage modulus of the nanocomposites had increased by 1.2-1.8 times of the pure polyimides.s.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1898-1899
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• 2005

반도체 집적회로 공정에서 사용되는 폴리이미드 포토레지스트(P12723, Dupont)를 감습막으로 사용하는 마이크로 습도센서 소자를 제작하였다. 마이크로 습도센서는 실리콘 웨이퍼 기판 위에 $SiO_2$ 박막을 건식열산화 공정으로 제작하고, Al 박막을 포토리소그라피 공정으로 패터닝 한 IDT (Interdigital Transducer)를 전극 위에 폴리이미드 포토레지스트를 공정변수를 다양하게 조절하면서 감습막으로 제작하였다. 폴리이미드 감습막은 스핀코팅법으로 제작하였으며, 회전수를 조절하여 두께를 변화시켰다. 완성된 마이크로 습도센서 소자의 상대습도 변화$(10{\sim}90% RH)$에 따른 정전용량 값 변화를 항온항습조 내에서 다양한 온도에서 HP4192A Impedance Analyzer를 사용하여 조사함으로써, 폴리이미드 포토레지스트를 사용하는 마이크로 정전용량형 습도센서의 제작 가능성을 검토하였다. 폴리이미드 정전용량형 마이크로 습도센서는 다양한 인가 전원 주파수에서 기준 센서로 사용된 상용 Vaisala Hygrometer와 유사한 감습특성 및 응답특성을 보였다.

• Applied Chemistry for Engineering
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• v.5 no.5
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• pp.756-763
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• 1994

Using 2,2-Bis-(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, 2,2-bis-[4-(4-aminophenoxy)phenyl] hexafluoropropane and 4,4-diaminodiphenyl ether, the homopolyamic acids, copolyamic acids and blend of homopolyamic acids were prepared and converted to polyimide(PI)s by thermal imidization. In results, it has been found that a exchange reaction of polyamic acids can be occurred during thermal imidization. With measurement of mechanical properties, it was suggested that PI/PI molecular composite can be obtained by copolymerization or physical blending of homopolyamic acids.

• Applied Chemistry for Engineering
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• v.10 no.7
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• pp.1014-1019
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• 1999

Copolyamic acid PMDA/6FDA-PDA(PAA) and homopolyamic acids PMDA-PDA(PAA) and 6FDA-PDA(PAA) were synthesized from 1,2,4,5-benzenetetracarboxylic dianhydride(PMDA) and 2,2'-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride(6FDA) as the dianhydride and 1,4-phenylenediamine (PDA) as the diamine. Residual stresses were detected in-situ during thermal imidization of the co- and homopolyimide precursors as a function of processing temperature over the range of $25{\sim}400^{\circ}C$ using thin film stress analyzer(TFSA), and morphological structures were investigated by WAXD. In comparison, the resultant residual stress of polyimide films composed of different compositions decreased with the increasing content of PMDA unit in the chain and was about 5 Mpa in compression mode for PMDA-PDA. In this study, the synthesis of random PMDA/6FDA-PDA copolyimide could be completed and compensate for the difficulty of process due to high $T_g$ of PMDA-PDA and relatively higher stress of 6FDA-PDA. It showed that we can make a low level stress copolyimied having excellent mechanical properties by incorporating appropriate rod-like rigid structure PMDA-PDA unit into 6FDA-PDA polyimide backbone which generally shows higher stress due to rotational hinges such as bulky di(trifluoromethyl). Specially, PMDA/6FDA-PDA(0.9:0.1:1.0) satisfied excellent mechanical property and low level stress as an inter layer showing low dielectric constant.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.75-81
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• 2017

The effects of KOH pretreatment and annealing conditions on the interfacial adhesion and the reliability between epoxy resin and polyimide substrate in the flexible printed circuit board were quantitatively evaluated using $180^{\circ}$ peel test. The initial peel strength of the polyimide without the KOH treatment was 29.4 g/mm and decreased to 10.5 g/mm after 100hrs at $85^{\circ}C/85%$ R.H. temperature/humidity treatment. In case of the polyimide with annealing after KOH treatment, initial peel strength was 29.6 g/mm and then maintained around 27.5 g/mm after $85^{\circ}C/85%$ R.H. temperature/humidity treatment. Systematic X-ray photoelectron spectroscopy analysis results showed that the peel strength after optimum annealing after KOH treatment was maintained high not only due to effective recovery of the polyimide damage by the polyimide surface treatment process, but also effective removal of metallic ions and impurities during various wet process.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.49-56
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• 2007

Effects of post-baking treatment conditions on the interfacial adhesion between electroless plated Ni and polyimide film were evaluated using $180^{\circ}C$ peel test. Measured peel strength values monotonically decrease from $38.6{\pm}1.1g/mm\;to\;26.8{\pm}2.2g/mm$ for the variations of post-baking treatment temperatures from $80^{\circ}C\;to\;180^{\circ}C$, respectively. Wet chemical treatment on the polyimide surface produces carboxyl and amide functional groups on the surface which is closely related to the change in interfacial adhesion between electroless Ni and polyimide films. It is speculated that interfacial adhesion seems to be controlled by carbonyl oxygen bonding near cohesive failure region during post-baking treatment.