• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.04b
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• pp.102-107
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• 1995

곡면의 폴리싱은 형상 및 공정 자체의 복잡성 때문에 아직까지 기계화 및 자동화가 잘 이루어지지 않고 있으나 정밀 기계부품 및 금형 관련 산업현장에서 매우 중요한 공정이기때문에 곡면 폴리싱 공정의 기계화 또는 자동화 연구가 최근에 활발히 진행되고 있다. 본 연구에서는 능률적이면서 정밀한 곡면 폴리싱을 위하여 유연성 있는 두 가지 형태의 자력폴리싱 공구를 제작,해석하고 이를 이용한 곡면의 2단계 자력폴리싱 방법에 대하여 실험을 수행하고 고찰하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.4
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• pp.1807-1812
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• 2014

A plastic has a various advantages in engineering elements that it can be formed a curve surface without restriction of shape and product the high volume with various color and lower price. Also, it is being used for many parts of automobile as the weight of cars is getting lighter. The Door A-Fuel Filler is a automobile plastic part by injection molding production. The injected products are involved a lot of factors for the inferior goods after painting. Therefore the painted products are required to have the process of the polishing in order to eliminate the faults. Now polishing process is being worked by hands. The workers tend to evade the process of polishing because the working needs a lot of powers momentarily. This paper presents the development of auto-polishing system that can check the inferior goods by the vision system and control the polishing process by the motion system. As a result, Shorten production time (30 seconds), and decreases by 1 person to work to increase the competitiveness of the production cost was to expect improvement.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.74-78
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• 2002

Ultra-Precision CNC polishing system including on-machine measurement system, a corrective polishing algorithm is developed. The unit removal profiles for various polishing tools and analyzed and tested and dwell time distributions and residual errors for a target removal shape are calculated. The corrective polishing algorithm is tested with various workpieces. This result will be used for the software development of the CNC polishing system.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1014-1020
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• 2003

We have developed the ultrasonic polishing system to get super finishing that consist of machine part that can rotate and travel the main shaft with power 1.5kW, ultrasonic generator with frequency 20kHz. By using this system we were investigated the characteristics of ultrasonic polishing and deduced the major facters which affect the surface roughness by the experimental plans for three different materials such as ceramic, glass, and wafer, and so could be obtained following results. We could be obtained the excellent surface for hard-to-difficult cutting materials. The rotating speed could be found to be major factor influencing the surface roughness. In the case of ceramic and wafer, we were able to obtain good surface roughness when the feed rate and ultrasonic output is higher. In the case of glass, the surface roughness becames worse when ultrasonic output is higher because of increasing of load affacting on the particles in slurry.

• Journal of Digital Contents Society
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• v.5 no.4
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• pp.251-256
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• 2004

The flatness of a silicon wafer concerned with ULSI chip is one of the most critical parameters ensuring high yield of wafers. That is necessary to constitute the circuit with high quality for he surface of silicon wafer, which comes to be base to make the direct circuit of the semiconductor, Flatness, therefore, is the most important factor to guarantee it wafer with high quality. The process of polishing is one of the most crucial production line among 10 processing stages to change the rough surface into the flatnees with best quality. Currently at this process, it is general for an engineer in charge to observe, judge and control the model of wafer from the monitor of measuring equipment with his/her own eyes to enhance the degree of flatness. This, however, is quite a troublesome job for someone has to check of process by one's physical experience. The purpose of this study is to approach the model of wafer with digital contents and to apply the result of the research for an algorithm which enables to control the polishing process by means of measuring the degree of flatness automatically, not by person, but by system. In addition, this paper shows that this algorithm proposed for the whole wafer flatness enables to draw an estimated algorithm which is for the thickness of sites to measure the degree of flatness for each site of wafer.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.10
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• pp.7071-7077
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• 2015

In recently, the demand of cover-glass is increased because smart phone, tablet pc, and electrical device has become widely used. The display of mobile device is enlarged, so it is necessary to have a high strength against the external force such as contact or falling. In fabrication process of cover-glass, a grinding process is very important process to obtain high strength of glass. Conventional grinding process using a grinding wheel is caused such as a scratch, chipping, notch, and micro-crack on a surface. In this paper, polishing system using a abrasive film was developed for a grinding of mobile cover-glass. To evaluate structural stability of the designed system, finite element model of the polishing system is generated, and multi-body dynamic analysis of abrasive film polishing machine is proposed. As a result of the analysis, stress and displacement analysis of abrasive film polishing system are performed, and using laser displacement sensor, structural stability of abrasive film polishing system is confirmed by measuring displacement.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.3
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• pp.53-60
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• 2004

We have developed and manufactured an experimental ultrasonic polishing machine with frequency of 20kHz at the power of vibration 1.7㎾ for effective ultrasonic polishing in processing of high hardness material. Design of the horn is performed by the FEM analysis. The following conclusions were empirically deduced through experimental results to clarify the major elements which affect the surface roughness during the ultrasonic process by following the experimental plans. The ultrasonic polishing machine has been developed in parts of structure part, ultrasonic generator, vibrator. We were able to process the high hardness material without difficulty as a result of ultrasonic polishing by utilizing the groove added step-type horn. Through analyzing by applying the experimental plans, the rotating speed of the horn was determined to be the major factor in influencing the surface roughness. In the case of ceramic, wafer, we were able to obtain good surface roughness when the feed rate and the ultrasonic output were higher. Because the load on slurry particle increases when the ultrasonic output is higher, the processed surface becomes worse in the case of optical glass.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.1
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• pp.109-115
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• 2004

Polishing process has been applied to get extremely fine surfaces, e.g., mirror surfaces such as optical mirrors, lens, molds and etc. Nowadays not only fine surface quality but also submicron order of dimensional accuracy is required for many applications. To meet the requirements polishing process should be provided with an active control of polishing pressure especially for automation of polishing process. In this paper a study on development of an active polishing pressure control system has been presented. A new type of tool assembly has been developed to facilitate the control. The tool is attached to an axis of a polishing machine with a coil spring and control of the polishing pressure is done by the position control of the axis, which needs no additional actuator. The polishing pressure is successfully measured by the measurement of the spring deformation. Control specifications were quantitatively considered by weighting functions and a controller was designed by using loop-shaping technique based on the no synthesis. Some experiments have been executed on a polishing machine with a PC-NC controller. It is shown that the results were coincident well with the theoretical analyses and satisfied the design specifications.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.24-28
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• 1996

Mirror-like polishing system of hemisphericall high-speed precision bearing for digital VTR drum was developed. Mechamism of the polishing process was analyzed in the view point of polishing contact range and contact length between the tool and the workpiece surface. It was suggested that the two stage polishing process adoptiong the diamond grinding wheel and polishing tool instead of multistage lapping processes, which enables the mass production of the bearing by reduction of polishing time.

• The KIPS Transactions:PartC
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• v.11C no.7 s.96
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• pp.951-958
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• 2004

Nowadays NGN is developed for supporting the e-Commerce, Internet trading, e-Government, e-mail, virtual-life and multimedia. Internet gives us the benefit of remote access to the information but causes the attacks that can break server and modify information. Since 2000 Nimda, Code Red Virus and DSoS attacks are spreaded in Internet. This attack programs make tremendous traffic packets on the Internet. In this paper, we designed and developed the Bandwidth Controller in the gateway systems against the bandwidth saturation attacks. This Bandwidth con-troller is implemented in hardware chipset(FPGA) Virtex II Pro which is produced by Xilinx and acts as a policing function. We reference the TBF(Token Bucket Filter) in Linux Kernel 2.4 and implemented this function in HDL(Hardware Description Language) Verilog. This HDL code is synthesized in hardware chipset and performs the gigabit traffic in real time. This policing function can throttle the traffic at the rate of band width controlling policy in bps speed.