• Title/Summary/Keyword: 폐솔더

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Recovery of Sn, Cu, Pb and HNO3 from the spent solder stripping solutions (폐솔더 박리액에서 주석, 구리, 납 및 질산의 회수)

  • An, Jae-U;Ryu, Seung-Hyeong;Kim, Tae-Yeong;Gang, Myeong-Sik;An, Nak-Gyun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2014.11a
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    • pp.89-90
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    • 2014
  • 인쇄회로기판 패턴도금 박리공정 중 발생하는 폐솔더 박리액은 주석, 구리, 철, 납 등 유가금속이 함유된 질산계 폐액이다. 본 연구에서는 이러한 폐솔더 박리액에서 질산과 유가금속을 체계적으로 회수하는 기술을 개발하고자 하였다. 먼저 폐액을 $80^{\circ}C$에서 3시간 정도 반응시켜 주석을 $SnO_2$ 상태로 90% 이상 회수가 가능하였다. 주석이 회수되고 구리, 철, 납만이 존재하는 질산계 폐솔더 박리액에서 확산투석을 이용하여 질산을 94% 이상 회수가 가능하였고 회수된 질산의 농도는 5.1 N 이었다. 질산을 추출한 폐액에서 침전제로 옥살산(Oxalic acid)을 사용하여 구리를 구리옥살레이트 상태로 침전시켜 타금속이온과 선택적으로 분리하였다. 마지막으로 폐액 중 용해되어있는 납을 $65^{\circ}C$이상에서 철 스크랩을 이용한 세멘테이션을 통하여 회수하였다.

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Recycling of valuable resources from the spent tin/solder stripping solution (주석/솔더 폐액으로부터 유가자원의 회수)

  • Ryu, Seung-Hyeong;An, Jae-U;Kim, Tae-Yeong;Gang, Myeong-Sik
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2015.11a
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    • pp.224-225
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    • 2015
  • 폐솔더 박리액으로부터 주석 및 구리의 분리를 위하여 옥살레이트 침전을 통해 각각 금속염으로 회수하기 위한 기초 연구를 실시하였다. 먼저 옥살산의 첨가량에 따라 주석의 침전율이 증가하였으며 당량비(옥살산/주석)의 1.0-1.5배를 첨가할 경우 주석이 99.5%, 구리는 2.0% 정도 침전되었고 철, 납 등은 거의 침전되지 않아 주석만 선택적으로 침전되는 것을 확인 하였다. 반응온도 증가에 따라 주석의 침전율은 증가하여 $60^{\circ}C$ 부근에서 최대값을 보이다가 온도가 더 증가하면 오히려 감소 경향을 보였다. 침전물의 고액분리 용이를 위해 카티온성 고분자 응집제를 이용하여 침강시킨 후, 분리된 침전물을 건조, 분쇄하여 $SnO_2$의 산화물을 얻을 수 있었다. 주석이 제거된 폐솔더 박리액에 옥살산을 첨가하여 구리가 약 91% 이상 침전되어 납, 철 등의 금속과 분리하여 선택적으로 회수가 가능하였다.

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Recovery of Tin and Copper from Waste Solder Stripper by Oxalate Precipitation (옥살레이트 침전법에 의한 폐솔더 박리액에서 주석 및 구리의 회수)

  • Ryu, Seong-Hyung;Ahn, Jae-Woo;Ahn, Hyo-Jin;Kim, Tae-Young
    • Resources Recycling
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    • v.23 no.3
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    • pp.37-43
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    • 2014
  • A study has been made on the recovery of tin and copper from waste solder stripper by oxalate precipitation. With the increasing of the oxalic acid addition, tin was precipitated effectively and removed above 99.5% of tin when the oxalic acid, in an amount 1.0-1.5 times the stoichometric requirement, was added. But, in this case, only 2.0% of copper was precipitated and lead, iron were not precipitated. So, tin was selectively removed from the waste solution. With the increasing of the reaction temperature, the removal percentage of tin was increased and maximum value at arounf $60^{\circ}C$ and decreased with increase in the temperature any more. After filtering the precipitate and drying in oven, $SnO_2$ was obtained from the precipitate. After removal of tin in stripping solution, above 91% of copper was selectively removed by Cu-oxalate by addition of oxalic acid.

Recovery of Nitric Acid from Waste Solder Stripper by Diffusion Dialysis (폐솔더 박리액으로부터 확산투석법에 의한 질산의 회수)

  • Ryu, Seong-Hyung;Kim, Tae-Young;Ahn, Nak-Kyoon;Gang, Myeong-Sik;Ahn, Jae-Woo;Ahn, Jong-Gwan
    • Resources Recycling
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    • v.24 no.5
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    • pp.33-39
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    • 2015
  • A basic study was conducted to effectively recover nitric acid from a waste solder stripper by diffusion dialysis using anion exchange membranes. The effects of flow rate, flux ratio, nitrate concentration, and metallic ion types and concentration on the recovery percentage of nitric acid were investigated. The recovery percentage of nitric acid was decreased with the increase of flow velocity. But the recovery percentage of nitric acid was increased as the increase of flux ratio(W/F) and showing a recovery percentage of nitric acid of about 99% at a flux ratio of 1.5 or more. As the increase of nitric acid concentration in feed solution, the recovery percentage of nitric acid was increased up to 3.0M, but in case of greater than 3.0M, the recovery percentage gradually was decreased. Leakage percentage of metallic ions through the membrane were in the order of Pb, Na and Cu but Fe and Sn did not leakaged. As a result of diffusion dialysis using real waste solder stripper at a flow rate of $0.9L/hr-m^2$, W/F = 1.3, a recovery percentage of nitric acid of approximately 94% was gained.

Produce of High Purity Tin from Spent Solder by Electro Refining (폐 솔더 잉곳으로부터 전해정련에 의한 고순도 주석 생산)

  • Lee, Ki-Woong;Kim, Hong-In;Ahn, Hyo-Jin;Ahn, Jae-Woo;Son, Seong-Ho
    • Resources Recycling
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    • v.24 no.2
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    • pp.62-68
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    • 2015
  • The high pure tin production was conducted from crude-tin containing waste solder by electro-refining process. The electro-refining process maintained at 0.2V produced tin with purity of 99.98%, whereas a little increase of voltage to 0.3 V resulted tin purity of 99.92%. The high pure tin of 3N in the present process was produced by fixing the voltage at 0.3V. Considering the high pure tin production, the current density was maintained within $100-120A/m^2$ with current efficiency of 94%. Addition of sulfuric acid of 20 ~ 25 g/L to the electrolyte solution was performed in order to keep Pb (lead) concentration below 100 mg/L in the final tin product. The anode slime generated during electro refining process was analyzed by X-ray diffraction (XRD) study to understand the phases of impurities in it. It detected the presence of Cu and Ag in the slime as in the form of $Cu_6Sn_5$, $Ag_3Sn$, whereas Pb occurred as $PbSO_4$ compound.

A Study on the Development of Noncontact Soldering Device of PV Cells Using Infrared Lamp (적외선 램프를 이용한 비접촉식 태양전지셀 솔더링 장치 개발에 관한 연구)

  • Lho, Tae-Jung;Kim, Seon-Jin;Park, Min-Yong
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.14 no.1
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    • pp.45-50
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    • 2013
  • The reflector of infrared lamp is designed to the optimal circular shape through the analyses of lumination distributions with a triangular, rectangular and circular configurations of infrared lamps respectively by using Photopia. PLC is used to compare and amplify the difference between soldering temperature profile and feedback value. It is fed to IR lamp controller which adjusts the soldering temperature of PV cell. The soldering temperature measured using an infrared temperature sensor is then fed back to the PLC. The closed control loop of soldering temperature on a PV cell is implemented. The noncontact soldering device of PV cells using infrared lamp which is easily operated by HMI operation panel and controlled robustly by PLC and IR lamp controller is developed.

Electrochemical Behavior of Tin and Silver during the Electrorecycling of Pb-free Solder (Sn-Ag-Cu) Waste (폐무연솔더(Sn-Ag-Cu)의 전해재활용 시 주석과 은의 전기화학적 거동 연구)

  • Kim, Min-seuk;Lee, Jae-chun;Kim, Rina;Chung, Kyeong-woo
    • Resources Recycling
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    • v.31 no.3
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    • pp.61-72
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    • 2022
  • We investigated the electrochemical behavior of Sn (93.0 %)-Ag (4.06 %)-Cu (0.89 %) during electrolysis of Pb-free solder waste to recover tin and silver. A thin strip of the solder waste produced by high-temperature melting and casting was used as a working electrode to perform electrochemical analysis. During anodic polarization, the current peak of an active region decreased with an increase in the concentration of sulfuric acid used as an electrolyte. This resulted in the electro-dissolution of the working electrode in the electrolyte (1.0 molL-1 sulfuric acid) for a constant current study. The study revealed that the thickening of an anode slime layer at the working surface continuously increased the electrode potential of the working electrode. At 10 mAcm-2, the dissolution reaction continued for 25 h. By contrast, at 50 mAcm-2, a sharp increase in the electrode potential stopped the dissolution in 2.5 h. During dissolution, silver enrichment in the anode slime reached 94.3% in the 1 molL-1 sulfuric acid electrolyte containing a 0.3 molL-1 chlorine ion, which was 12.7% higher than that without chlorine addition. Moreover, the chlorine enhanced the stability of the dissolved tin ions in the electrolyte as well as the current efficiency of tin electro-deposition at the counter electrode.