• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.05a
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• pp.213-216
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• 2001

A micro hole punching system was developed and micro holes of 100m in diameter were successfully made on brass sheets of loom in thickness. A micro punch made of tungsten carbide was designed to withstand the punch load, considering the buckling and the bending moment due to possible misalignment error. The punch was fabricated by the grinding process with diamond wheel. The die was designed considering the punch load and fabricated by micro electrodischarge machining process. In this system the stripper is designed to guide punch tip to minimize the possible misalignment. The punch was installed on a vertical stepper and the die was mounted on an X-Y translation unit. The precision motion controller controlled all motions of the micro hole punching system. In this study technical difficulties and solutions in the micro hole punching process were also discussed.

• Transactions of Materials Processing
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• v.13 no.3
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• pp.190-204
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• 2004

The objective of this study is to develop a highly accurate micro tool alignment system applicable to the micro machining technology. In a specific application such as micro hole punching, radial clearance between micro tools is order of a few micron. Under this micron scale tool clearance, accuracy of tool alignment is very important for ensuring hole quality. In the present study, a two-way image acquisition system was developed, which can produce overlapped image of both micro tools that face each other, and applied to the tool alignment in the micro punching. Also, to meet alignment accuracy of tools within $1\mu\textrm{m}$, the cross correlation image processing algorithm was employed. With this system, $25\mu\textrm{m}$ punching tools with $1\mu\textrm{m}$ radial clearance could be accurately aligned.

• Transactions of Materials Processing
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• v.14 no.3 s.75
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• pp.277-281
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• 2005

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet, ceramic sheet and punch-to- die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor $\kappa$ is introduced to express effect of the process variables.

• Transactions of Materials Processing
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• v.13 no.1
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• pp.65-71
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• 2004

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.02a
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• pp.260-265
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• 2002

In micro hole punching process, it is very difficult to align punch with die hole. Misalignment can cause a falling-on in hole quality and breakage of punch and die. Micro punching using soft die plate without a die hole has a big advantage because it is not necessary to align punch with die hole and to consider die clearance. Soft die plates are made by polymers or hard rubbers which are softer than metals. In this study, several micro punching experiments are conducted. Micro punching test with some materials shows that micro hole punching is feasible with some soft die plates. Through the section shape obtained by mounting and polishing, the punched hole quality is measured and the shapes of burr and dome we studied.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.5 no.3
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• pp.51-57
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• 2006

Hydro-mechanical punching was developed for preventing burr formation. Circular hole punching and Finite element method(FEM) analysis were conducted to investigate shearing characteristics of this process in comparison with conventional and mechanical counter punching. In this process hydrostatic pressing with appropriate medium was utilized instead of counter punch, which resulted in the delay of the point that the fracture is initiated and clean shearing surface was obtained. FEM analysis was utilized to find out optimum processing parameters and shearing mechanism for burr-free hole punching.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.193-197
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• 2005

This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.107-110
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• 2003

The sheet metal shearing process is normally used in the precision elements such as semi-conductor components. In precision elements, burrs usually reduce the quality of machined parts and cause interference, jamming and misalignment during assembly procedures and because of their sharpness, they can be safety hazard to personnel. Furthermore, not only burrs are hard to predict and avoid, but also deburring, the process of removing burrs, is time-consuming and costly. In order to get the burr-free parts, therefore, we developed the precise burr measuring system using the laser. Using the X-Y precious table, we used vertical measuring method. Through the laser measurement system, we gain the minute analog signal, so this signal was amplified by the electric circuit. Finally, we gained the realtime burr data using A/D converter, PC. By introducing the novel laser measuring method which employing vertical measurement mechanism, we could get fast and precious burr data. Through the experiments, the accuracy of the developed system is proved. The burr height measured during the punching process can be used for automatic deburring and in-situ aligning.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.434-438
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• 2003

The shearing process for the sheet metal is normally used in the precision elements such as semi-conductor components. In these precision elements, the burr formation brings a bad effect on the system assembly and demands the additional de-burring process. In this paper, we have developed the desktop-type precision punching system to investigate the burr formation mechanism and present kinematically Punch-die auto aligning methodology, for the purpose of burr unifomizing and minimizing, between the rectangular shaped punch and die. By using the scanning electron microscope, the aligned punching results are compared with the miss-aligned ones. Also, we measured the relative burr heights using the self-designed laser measuring device for insitu self aligning. Since it is hard to get the perfect, so called, burr-free edges during the shearing process, we introduced the ultrasonic do-burring machine. The de-burring operation was carried out by a novel do-burring method, the reversal flow resistance method, under different machining loads and abrasive types. The final do-burring results show the validity of our punching do-burring system pursuing the burr-free punched elements.

• Transactions of Materials Processing
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• v.12 no.4
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• pp.314-319
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• 2003

In the micro hole punching, the size and shape of burr and burnish zone are very important factors to evaluate quality of micro holes which depend on punch-die clearance, strain rate, workpiece material and etc. To get micro holes with small burr and wide burnish zone for industrial demands, not only the parametric study but also a study on fracture behavior in shear band are necessary. In this study, 100 $\mu$m, 25 $\mu$m micro holes in diameter were fabricated on brass (Cu63/Zn37) and SUS 316 foils as aspect ratio 1:1, and the characteristics of micro holes was investigated comparing with those of macro holes over several mm by scanning electron microscopic views and section views. Like macro hole, micro hole is also composed of 4 portions, rollover. burnish zone, fracture zone and burr, and it shows similar fracture behavior in shear band. But by high strain rate (10$^2$∼10$^3$s$^{-1}$ ) condition unlike that of macro hole fabrication and by the increment of relative grain size in the direction of the workpiece thickness, fracture zone is not observed.