• Economic and Environmental Geology
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• 제41권5호
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• pp.485-496
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• 2008

The purpose of this study is to suggest potential target countries for the package deal projects of coal resources development and power industry by analyzing data on global coal demand and supply and electrical infrastructures. Indexes such as coal deposits, types of coal deposits, electrical coal consumptions per capita, and gross domestic products per capita of the countries need to be evaluated for determining the potential target countries for the package deal projects. Based on the evaluation of the indexes of countries, the potential target countries for the package deal project are underdeveloping Asia or Africa countries such as Bangladesh, Mongolia, and Nigeria.

• Journal of the Korea Society of Computer and Information
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• 제13권6호
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• pp.279-286
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• 2008

The IT industry plays the engine role in Korean economy which reaches up to 17% of Korean GDP. However the current global economic depression which stems mainly from the US has caused insufficient demand in IT industry. The decreased demand leads to a drug in the market, to fierce price competitions and increasing fear on the world IT market depression. Considering the facts, there are strong demands for the diversification of the products of exports and the countries Korea exports to. These need differentiated strategies which can be summarized in various IT package-type overseas expansion model including the consideration in strategic items, countries, connecting large and small-medium size companies or businesses and related industries. The importance of IT industry in Korean economy will grow constantly and the IT package-type overseas expansion models will preside the movements.

• Journal of the Microelectronics and Packaging Society
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• 제13권4호
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• pp.17-25
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• 2006

Thermo-mechanical behavior of flip-chip plastic ball grid array (FC-PBGA) packages are characterized by high sensitive $moir\'{e}$ interferometry. $Moir\'{e}$ fringe patterns are recorded and analyzed for several temperatures. Deformation analysis of bending displacements of the packages and average strains in the solder balls for both single and double-sided package assemblies are presented. The bending displacement of the double-sided package assembly is smaller than that of the single-sided one because of its symmetric structure. The largest effective strain occurred at the solder ball located on the edge of the chip and its magnitude of the double-sided package assembly is greater than that of single-sided one by 50%.

• Journal of Industrial Convergence
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• 제17권4호
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• pp.9-14
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• 2019

This paper presents several problems that can occur in the development of the ultra-compact LED package of less than 1.0mm and introduces the solution to them. In the existing mold structure, since the upper and lower core parts are integrated, various errors have occurred due to the roughness of EDM in the small model, which is a limiting factor in further reducing the mold size. As a countermeasure, the prefabricated model was presented in an earlier study to overcome the obstacles to the development of a ultra-compact LED package. In this paper, several problems have been found during the fabrication of prototypes as a starting work to produce the results for the presented model. The types are suggested and the solutions are discussed. And by changing the existing 2-row structure to 3-row structure in the same size lead frame, the aspect of efficient production is considered. The experimental procedure verifies the proposed solution and conducts a test to produce a prototype to confirm that a good product can be produced.

• Journal of the Microelectronics and Packaging Society
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• 제17권4호
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• pp.49-60
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• 2010

Semiconductor packages are increasingly moving toward miniaturization, lighter and high performance. Futhermore, packages become thinner. Thin packages will generate serious reliability problems such as warpage, crack and other failures. Reliability problems are mainly caused by the CTE mismatch of various package materials. Therefore, proper selection of the package materials and geometrical optimization is very important for controlling the warpage and the stress of the package. In this study, we investigated the characteristics of the warpage and the stress of several packages currently used in mobile devices such as CABGA, fcSCP, SCSP, and MCP. Warpage and stress distribution are analyzed by the finite element simulation. Key material properties which affect the warpage of package are investigated such as the elastic moduli, CTEs of EMC molding and the substrate. Geometrical effects are also investigated including the thickness or size of EMC molding, silicon die and substrate. The simulation results indicate that the most influential factors on warpage are EMC molding thickness, CTE of EMC, elastic modulus of the substrate. Simulation results show that warpage is the largest for SCSP. In order to reduce the warpage, DOE optimization is performed, and the optimization results show that warpage of SCSP becomes $10{\mu}m$.

• Journal of the Microelectronics and Packaging Society
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• 제11권4호
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• pp.13-22
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• 2004

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temperature change is investigated using high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compound and the PCB. Detailed global and local deformations of the package by temperature change are investigated, concerning the variation of natural frequency of MEMS gyro chip.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• 제13권2호
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• pp.60-70
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• 2002

최근 고성능/고집적 RF 소자 및 시스템들의 경박 단소화 추세에 따라 RF 무선 통신 분야에도 초소형미세 가공 기술인 MEMS 기술이 크게 주목받고 있다. 이에 본 고에서는 RF 부품 및 시스템을 MEMS 기술로서 실장하는 RF MEMS 패키지 기술에 대하여 간단히 살펴보았다. 우선, 실리콘 기반의 MEMS 패키지가 우수한 열 전달 특성과 저 손실의 고주파특성으로 인해 RF 시스템의 실장에 매우 적합함을 확인하였다. 또한, MEMS 기술을 이용함으로써 RF회로와 패키지 제작 공정이 동시에 이루어질 수 있도록 하는 일괄터리공정에 대하여 소개하였다.

• 대학교육
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• 통권148호
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• pp.69-80
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• 2007

정부는 대학의 강점 분야에 대한 집중 지원을 통해 특성화를 유도하고, 부처별 지원사업의 시너지 창출을 위해서 교육부·산자부·과기부 등 관계부처 지원사업 간 연계.조정 시스템을 강화하고 중장기적으로 각 부처사업을 현재의 개별 단위사업별 지원체제에서 대학별 발전전략에 따른 패키지형 지원이 가능하도록 개편할계획이다.

• 건강소식
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• 제37권5호
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• pp.30-31
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• 2013

건강검진의 중요성은 재차 강조되지만 생활이 바쁘다는 이유로, 당장 아픈 곳이 없다는 이유로, 검진이 겁이 난다는 이유로 차일피일 미루는 경우가 있다. 왜 건강검진을 해야 하는지, 내게 맞는 건강검진은 무엇인지 알고 보다 적극적으로 건강검진에 참여해보다. 패키지형 건강검진이 많은 요즘, 유의해야할 점도 있다.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 한국조명전기설비학회 2008년도 추계학술대회 논문집
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• pp.25-28
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• 2008

PAR38형의 표준 LED조명 제품 개발을 위한 기존의 PAR38형 제품의 대표 특성으로 빔각, 효율 등의 기준을 정의하고 이에 적합한 LED 패키지를 선정하였다. 개념설계를 위해 기본 사양을 바탕으로 개략적인 설계를 하고 LED 패키지 모듈에 방열시뮬레이션을 수행한 결과로부터 각 설계 요소의 상세 값을 선정하였다. 상세설계를 위해서 선정된 단품패키지 및 기설계된 조명기구에 대한 광학 시뮬레이션과 방열 시뮬레이션을 수행하여 목표 결과에 대한 예측 및 목표 달성을 위한 가능성을 타진하였다. 시뮬레이션 결과를 바탕으로 상세 형상과 특성 향상을 위한 요소를 부여하여 상세설계하고 제품을 제작하였다. 최종적으로 제품에 대한 특성 측정 분석하여 표준 제품으로서 특성을 검증하였다.