• Journal of the Korean Vacuum Society
• /
• v.10 no.3
• /
• pp.361-367
• /
• 2001

Recently, Chemical Mechanical Polishing(CMP) has become a leading planarization technique as a method for silicon wafer planarization that can meet the more stringent lithographic requirement of planarity for the future submicron device manufacturing. The SOI(Silicon On Insulator) wafer has received considerable attention as bulk-alternative wafer to improve the performance of semiconductor devices. In this paper, the objective of study is to investigate Material Removal Rate(MRR) and surface micro-roughness effects of slurry and pad in the CMP process. When particle size of slurry is increased, Material Removal rate increase. Surface micro-roughness is greater influenced by pad than by particle size of slurry. As a result of AM measurement, surface micro-roughness was improved from 27 $\AA$ Rms to 0.64 $\AA$Rms.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.1609-1613
• /
• 2003

This research focused on the development of automatically exclusive production equipment of corrupad as changing manual system into automatic system to increase the output. Therefore the minimization of the problem of the rewinding mechanism with eccentric cantilever structure is key to the achievement of the high performance for automation production. Proto-type corrupad rewinding machine is manufactured after considering the effect of the rotational vibration and natural frequency of the structure of machine by using 3D design packages such as ADAMS and I-deas. For evaluating the performance of the proto-type machine, simulations of dynamic and static characteristics using 3D design packages, a series of modal tests by accelerometer and measurements of dynamic behavior by high-speed camera for rewinding part, were carried out. As a result, the proto-type machine was not affected with the rotational vibration. Whirling error of eccentric cantilever structure in driving is small. Therefore the machine developed is most suitable to produce corrupad automatically. However reinforcement of the structure in axial direction is required due to so vibration in that direction.

• Journal of the Korea institute for structural maintenance and inspection
• /
• v.20 no.3
• /
• pp.49-57
• /
• 2016

This study intended to analyze reinforcement effects of PSC I girder bridges to which prestresses are introduced using V type of external strands. So that series of bridge loading tests are carried out on existing PSC I girder bridge for the cases of before-reinforcement and reinforcement. The measured results from tests being analyzed and compared with the ones from MIDAS structural analyzing program, the reinforcing effects of the reinforcement system adopted in this study were investigated. It is found out that when the V type systems are applied to the bridge girders, the slope of load distribution factor curves become lower improving soundness of bridge upper structure. And also it is confirmed that the reinforcement system in this study can be taken as helpful for improvement of both flexural and shear ability of PSC I girder bridges, as well as dynamic behavior. Furthermore it is found when the elastic pads are applied to the system, dynamic reinforcing effects are maximized.

• Journal of the Computational Structural Engineering Institute of Korea
• /
• v.23 no.4
• /
• pp.403-407
• /
• 2010

Gecko adhesion system consists of beam-shaped seta and spatula which has the role of adhesive pad. In this paper, adhesion mechanism of gecko adhesion system is performed by using adhesive beam contact model. this model has a feature of non-uniform stress profile on the contact surface and adhesion/detachment mechanism is determined by the tensile stress of the contact region. a spatula tip pad has the role of reduction of maximum tensile stress and adhesive force is increased due to this effect. As for a reverse loading case, maximum compressive stress drops by the spatula effect and this cause unsymmetric loading conditions between adhesion and detachment forces. In this study, finite element method is used for the analysis of adhesive beam contact model and the results for spatula effect are presented.

• Journal of the Korea institute for structural maintenance and inspection
• /
• v.22 no.1
• /
• pp.23-31
• /
• 2018

Recently, there was an collision accident of vehicle-concrete median barrier and unfortunately, passengers were killed by exceeded capacity of concrete median. Therefore, improving the capacity of concrete median barrier is need to reduce damage. Accordingly, in this study, appropriate collision model verified by using the FE analysis program LS-Dyna and recommend a concrete median barrier section. The improvement parameters such as wire mesh diameter, steel plate, rubber pad were selected for improved capacity of the median barrier. Finally, section of concrete median barrier improved wire mesh diameter decreased volume loss, section of concrete median barrier improved rubber pad accepted impact loading and increased elastic area.

• Journal of the Korean Society for Railway
• /
• v.19 no.4
• /
• pp.498-505
• /
• 2016

As a basic study to develop maintenance-effective optimal ballast track in preparation for upgrading a conventional line to a high speed railway, a full-scale test that combined the components of ballast track was conducted and the characteristic of track settlement was analyzed. As a result of the full-scale test, reduction in maintenance via an increase of the elasticity of only the pad was insignificant; however, the effect increased significantly with increasing of the weight of the sleeper or with increasing of the weight of the sleeper and the thickness of the ballast together with use of a pad with high resiliency. An optimal type of ballast track, in line with upgrading the speed of a conventional line, shall be developed through cost efficiency analysis considering the maintenance cost depending on the track settlement as well as the initial construction cost.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.35 no.1
• /
• pp.17-22
• /
• 2011

ZnO-based thin-film transistors (TFTs) have been fabricated and the mechanical characteristics of electric circuits, such as stress, strain, and deformation are analyzed by the finite element method (FEM). In this study, a mechanical-stability design guide for such systems is proposed; this design takes into account the stress and deformation of the bridge to estimate the stress distribution in an $SiO_2$ film with 0 to 5% stretched on 0.5-${\mu}m$-thick. The predicted buckle amplitude of $SiO_2$ bridges agrees well with experimental results within 0.5% error. The stress and strain at the contact point between bridges and a pad were measured in a previous structural analysis. These structural analysis suggest that the numerical measurement of deformation, SU-8 coating thickness for Neutral Mechanical Plane (NMP) and ITO electrode size on a dielectric layer was useful in enhancing the structural and electrical stabilities.

• Journal of the Microelectronics and Packaging Society
• /
• v.28 no.3
• /
• pp.1-7
• /
• 2021

In this paper, by embedding a bare-die chip-type drive amplifier into the PCB composed of ABF and FR-4, it implements an embedded active device that can be applied in 28 GHz band modules. The ABF has a dielectric constant of 3.2 and a dielectric loss of 0.016. The FR-4 where the drive amplifier is embedded has a dielectric constant of 3.5 and a dielectric loss of 0.02. The proposed embedded module is processed into two structures, and S-parameter properties are confirmed with measurements. The two process structures are an embedding structure of face-up and an embedding structure of face-down. The fabricated module is measured on a designed test board using Taconic's TLY-5A(dielectric constant : 2.17, dielectric loss : 0.0002). The PCB which embedded into the face-down expected better gain performance due to shorter interconnection-line from the RF pad of the Bear-die chip to the pattern of formed layer. But it is verified that the ground at the bottom of the bear-die chip is grounded Through via, resulting in an oscillation. On the other hand, the face-up structure has a stable gain characteristic of more than 10 dB from 25 GHz to 30 GHz, with a gain of 12.32 dB at the center frequency of 28 GHz. The output characteristics of module embedded into the face-up structure are measured using signal generator and spectrum analyzer. When the input power (P_in) of the signal generator was applied from -10 dBm to 20 dBm, the gain compression point (P_1dB) of the embedded module was 20.38 dB. Ultimately, the bare-die chip used in this paper was verified through measurement that the oscillation is improved according to the grounding methods when embedding in a PCB. Thus, the module embedded into the face-up structure will be able to be properly used for communication modules in millimeter wave bands.

• Proceedings of the KIEE Conference
• /
• 2008.10a
• /
• pp.109-110
• /
• 2008

본 논문에서는 900MHz RFID 수동형 태그 전치부를 설계하고 검증하였다. 문턱전압(threshold voltage) 제거 구조의 전압 체배기, 전류를 이용한 복조 회로로 설계되었으며 파워다운 회로를 추가하여 정류동작의 안정성에 중점을 두었다. PWM(Pulse Width Modulation)을 이용한 변조기를 구조로 입력단에 용량성 임피던스의 변화로 변조 동작을 검증하였다. 삼성 0.18um 공정을 이용하였고, 인식거리는 15m, 평균 소모 전력은 약 60uW이며, 패드를 포함한 칩 사이즈는 $1.22mm^2$이다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.171-171
• /
• 2008

본 연구는 초음파 알루미늄 웨지 및 금 볼 본딩을 동시에 적용 가능한 본딩 Pad의 금속학적 안정성을 고려한 표층전극 형성 방법에 관한 것이다. 특히, 이동통신 및 전장용 모듈의 복합 및 융합화로 LTCC기판 패키징에 있어서 다양한 본딩 기술이 요구되고 있다. 전통적인 interconnection 기술인 Au ball 본딩 및 초음파 에너지를 이용한 Al wedge 본딩 기술이 동시에 사용되어야 하는 패키지 구조의 경우 본딩 패드의 표층전극 설계는 서로 상충되는 조건이 요구된다. 따라서, 본 연구에서는 LTCC기판의 표층전극의 Metal finish 방법으로 이용되는 ENEPIG(무전해 Ni/Pd/Au도금)공법으로 Au ball 본딩 및 초음파 Al wedge 본딩을 동시에 가능하게 하는 solution을 제시하여 패키징 자유도뿐만 아니라 Interconnection 신뢰성을 확보할 수 있었다.