• 제목/요약/키워드: 파라핀 슬러리

검색결과 4건 처리시간 0.018초

유동저항 감소유체를 운반유체로 한 파라핀 슬러리의 대류 열전달에 관한 연구 (Convective Heat Transfer of a Paraffin Slurry in a Drag Reducing Carrier Fluid)

  • 정동주;최은수
    • 설비공학논문집
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    • 제13권12호
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    • pp.1275-1281
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    • 2001
  • Aqueous polymer solutions are known to have small pressure reduction. Paraffin slurries are known to have high thermal capacity. Paraffin particles are mixed into an aqueous polymer solution to make a new heat transfer fluid having high thermal capacity but low pressure reduction. The heat transfer characteristics of the new slurry was tested in a circular tube having a constant heat transfer boundary condition. The new slurry was found to have high Nusselt numbers as well as high thermal capacity and low pressure reduction in the laminar flow. The trends of the Nusselt numbers along the heating test section were studied for various heating conditions.

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파라핀 슬러리의 생성 및 관내 대류열전달에 관한 연구 (Formation of a paraffin slurry and its convective heat transfer in a circular pipe)

  • 최은수
    • 대한기계학회논문집B
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    • 제22권1호
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    • pp.50-60
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    • 1998
  • As a method to develop an enhanced heat transfer fluid, the fine particles of a phase-change material were mixed with a conventional heat transfer fluid. Paraffin, which can be obtained easily in domestic market, was used for the phase-change material and water was used as a carrier fluid. Fine liquid particles of paraffin were formed in water as an emulsion by using an emulsifier, and they were cooled rapidly to become solid particle, resulting in paraffin slurry. The average diameter of produced solid particles was inversely proportional to the amount of the added emulsifier, which was theoretically proved. The produced paraffin slurry was tested thermally in heat transfer test section having a constant-heat-flux boundary condition. The test section was made of a circular stainless-steel pipe, which was directly heated by the power supply having a maximum of 50 Volts-500 Amperes. DSC(Differential scanning calorimeter) tests showed that two kinds of phase change were involved in the melting of paraffin, and it was explained in two different ways. A five- region-melting model was developed by extending the conventional three-region-melting model, and was used to obtain the local bulk mean temperatures of paraffin slurry in the heating test section. The local heat transfer coefficient showed a maximum where the bulk mean temperature of the paraffin slurry reached at the melting temperature of paraffin.

냉각제들에 따른 불연속 발열체의 냉각성능 연구 (Study on the cooling performance of discrete heat sources using coolants)

  • 최민구;조금남
    • 설비공학논문집
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    • 제11권2호
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    • pp.224-235
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    • 1999
  • The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water, PF-5060, and paraffin slurry. The experimental parameters were coolants including Paraffin slurry with mass fraction of 2.5~7.5%, heat flux of 10~40W/$\textrm{cm}^2$ for the simulated VLSI chips and Reynolds numbers of 3,000~20,000. The size of paraffin slurry was constant as 10~40${\mu}{\textrm}{m}$ before and after the experiment. The chip surface temperatures for paraffin slurry were lower than those for water and PF-5060. The local heat transfer coefficients for the paraffin slurry were larger than those for water and the local heat transfer coefficients reached a row-number-independent and thermally-fully-developed value approximately after the third row. The local Nusselt numbers for paraffin slurry with a mass fraction of 7.5% were larger by 20~38% than those for water. The paraffin slurry with a mass fraction of 5% shelved the best thermal and hydrodynamic characteristics when local heat transfer and pressure drop were considered simultaneously.

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파라핀 슬러리를 사용한 다칩모듈의 냉각특성 (Cooling characteristics of the multichip module using paraffin slurry)

  • 조금남;최민구
    • 대한기계학회논문집B
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    • 제22권6호
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    • pp.888-898
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    • 1998
  • The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water and paraffin slurry. The experimental parameters are mass fraction of 2.5 ~ 7.5% for paraffin slurry, heat flux of 10 ~ 40 W/cm$^{2}$ for the simulated VLSI chips and Reynolds numbers of 5,300 ~ 15,900. The apparatus consisted of test section, paraffin slurry maker, pump, constant temperature baths, flowmeter, etc. The test section made of in-line, four-row array of 12 heat sources for simulating 4 * 3 multichip module which was flush mounted on the top wall of a horizontal rectangular channel with the aspect ratio of 0.2. The inlet temperature was 20 deg. C for all experiments. The size of paraffin slurry was constant as 10 ~ 40 .mu.m befor and after the experiment. The chip surface temperatures for paraffin slurry with the mass fraction of 7.5% showed lower by 16 deg. C than those for water when the heat flux is 40 W/cm$^{2}$. The local heat transfer coefficients for the paraffin slurry with the mass fraction of 7.5% were larger by 17 ~ 25% than those for water at the first and the fourth row. The local heat transfer coefficients reached to a row-number-independent, thermally fully developed value approximately after the third row. The local Nusselt numbers at the fourth row for paraffin slurry with the mass fraction of 7.5% were larger by 23 ~ 29% than those for water.