• Korean Journal of Food Science and Technology
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• v.28 no.4
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• pp.624-631
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• 1996

Effect of fluctuation range and intervals of defrosting temperature on quality of frozen foods stored in a domestic refrigerator equipped with an automatic defrost system was evaluated. As defrost system was operated, temperatures of domestic refrigerators were elevated from $-18^{\circ}C\;to\;-5^{\circ}C\;and\;-15^{\circ}C$, and fluctuation intervals were l6 hrs and 30 hrs, respectively. Quality deterioration such as protein denaturation, vitamin loss, exudate production and changes in appearance of frozen foods was minimized by reducing temperature oscillation during storage. Considerable effects of thermal oscillation on ice crystal sizes were observed for frozen beef tissue and ice cream. TTI (time temperature indicator) system also proved that the temperature control of defrost system in domestic refrigerator can improve the quality of foods during storage.

• Korean Journal of Food Science and Technology
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• v.16 no.4
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• pp.429-436
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• 1984

To expand the utility of barley the experiments on the extrusion characteristics of barley flour for snack processing were carried out and the effects of the extrusion conditions on the quality of the extrudates were investigated. The optimum moisture content of barley flour for snack processing was 20%. The moisture content and the density of the extrudates decreased with increasing extrusion temperature and decreasing die size. The die swell ranged from 0.98 to 2.18 according to various extrusion conditions and decreased with increasing temperature above $150^{\circ}C$. The lightness, redness and yellowness increased at higher temperature. The water absorption index and the water solubility index showed their maximum values at $180^{\circ}C$.The gelatinization degree of the extrudates increased with increasing temperature. The fracture fore, Young's modulus and maximum fiber stress decreased, but the deformation to fracture increased, with increasing temperature and decreasing die size. The yield force in puncture test showed lower values at higher temperature. The size and the fraction of the air cells increased with increasing temperature and decreasing die size. The optimum extrusion conditions of barley for snack processing were at the temperature of $180^{\circ}C$, with the die size of 4.5mm when processed at 160 rpm.

• Composites Research
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• v.17 no.1
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• pp.10-17
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• 2004

In this work, the blend system prepared from epoky(DGEBA)/polymethylmethacrylate(PMMA) was investigated in thermal and mechanical interfacial property measurements. The thermal properties were carried out by DSC, DMA, and TGA measurements. Also, the surface free energy and fracture toughness were determined by contact angle and critical stress intensity factor($K_{IC}$), respectively. And the fracture surface was observed by SEM after $K_{IC}$ tests. As experimental results, the curing temperature and glass transition temperature were slightly increased in addition of PMMA. Surface free energy of the blends showed an improved value at low contents of PMMA which could be attributed to the both increasings of London dispersive and polar components. From measurement of $K_{IC}$ of the blends, the highest value was found at 5 phr. This was due to the increasing of compatibility or physical interaction in macromolecular chains between DGEBA and PMMA of the blends.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.17-22
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• 2013

We investigated the optimum bonding conditions for thermo-compression bonding of electrodes between flexible printed circuit board(FPCB) and rigid printed circuit board(RPCB) with Sn-58Bi solder as interlayer. In order to figure out the optimum bonding conditions, peel test of FPCB/RPCB joint was conducted. The peel strength was affected by the bonding conditions, such as temperature and time. The fracture energies were calculated through F-x (Force-displacement) curve during peel test and the relationships between bonding conditions and fracture behaviors were investigated. The optimum condition for the thermo-compression bonding with Sn-58Bi solder was found to be temperature of $195^{\circ}C$ and time of 7 s.

• Tunnel and Underground Space
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• v.21 no.1
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• pp.66-81
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• 2011

In this study, it was aimed to develop a thermal-hydraulic-mechanical coupled fracture mechanics code that models a fracture initiation, propagation and failure of underground rock mass due to thermal and hydraulic loadings. The development was based on a 2D FRACOD (Shen & Stephasson, 1993), and newly developed T-M and H-M coupled analysis modules were implemented into it. T-M coupling in FRACOD employed a fictitious heat source and time-marching method, and explicit iteration method was used in H-M coupling. The validity of developed coupled modules was verified by the comparison with the analytical result, and its applicability to the fracture initiation and propagation behavior due to temperature changes and hydraulic fracturing was confirmed by test simulations.

• Journal of the Korea Society of Computer and Information
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• v.26 no.2
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• pp.53-60
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• 2021

In this paper, we aimed to identify the insulation characteristics and reliability of Epoxy composites, which are widely used as insulation material for electrical & electronic components and electric appliance. To this end, it was necessary to predict variations of electric field due to the distribution of fillers that must be added by economic and mechanical factors. So, we verified the result using an electric field analysis Simulator. Furthermore, under the condtion of DC voltage application, an dielectirc breakdown test was performed according to ambient temperature changes and the distribution of fillers, and the changes were observed. Three types of specimens were manufactured by adding 0, 50 and 100[phr] filling to Epoxy resin. In all specimens, as temperature was increased, the strength of the dielectric strength was decreased. When comparing the simulation results with the actual dielectric breakdown test results, we was able to confirm the technical applicability required for Insulation design of electric appliance.

• Journal of the Korean Vacuum Society
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• v.6 no.2
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• pp.143-150
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• 1997

In this study, doffusion barrier properties of 1000 $\AA$ thick molybdenum compound(Mo, Mo-N, $MoSi_2$, Mo-Si-N) films were investigated using sheet resistance measurement, X-ray diffraction(XRD), X-ray photoelectron spectroscopy(XPS), Scanning electron mircoscopy(SEM), and Rutherford back-scattering spectrometry(RBS). Each barrier material was deposited by the dc magnetron sputtering and annealed at 300-$800^{\circ}C$ for 30 min in vacuum. Mo and MoSi2 barrier were faied at low temperatures due to Cu diffusion through grain boundaries and defects in Mo thin film and the reaction of Cu with Si within $MoSi_2$, respectively. A failure temperature could be raised to $650^{\circ}C$-30 min in the Mo barrier system and to $700^{\circ}C$-30 min in the Mo-silicide system by replacing Mo and $MoSi_2$ with Mo-N and Mo-Si-N, respectively. The crystallization temperature in the Mo-silicide film was raised by the addition of $N_2$. It is considered that not only the $N_2$, stuffing effect but also the variation of crystallization temperature affects the reaction of Cu with Si within Mo-silicide. It is found that Mo-Si-N is the more effective barrier than Mo, $MoSi_2$, or Mo-N to copper penetraion preventing Cu reaction with the substrate for $30^{\circ}C$min at a temperature higher than $650^{\circ}C$.

• Korean Journal of Materials Research
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• v.10 no.12
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• pp.799-806
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• 2000

Cu$_{6}$Sn$_{5}$-dispersed 63Sn-37Pb solder bumps of 760$\mu\textrm{m}$ size were fabricated on Au(0.5$\mu\textrm{m}$)/Ni(5$\mu\textrm{m}$)/Cu(27$\pm$20$\mu\textrm{m}$) BGA substrates by screen printing process, and their shear strength were characterized with variations of dwell time at reflow peak temperature and aging time at 15$0^{\circ}C$ . With dwell time of 30 seconds at reflow peak temperature, the solder bumps with Cu$_{6}$Sn$_{5}$ dispersion exhibited higher shear strength than the value of the 63Sn-37Pb solder bump. With increasing the dwell time longer than 60 seconds, however the shear strength of the Cu$_{6}$Sn$_{5}$-dispersed solder bumps became lower than that the 63Sn-37Pb solder bumps. The failure surface of the solder bumps could be divided into two legions of slow crack propagation and critical crack propagation. The shear strength of the solder bumps was inversely proportional to the slow crack propagation length, regardless of the dwell time at peak temperature, aging time at 150 $^{\circ}C$ and the volume fraction of Cu$_{6}$Sn$_{5}$ dispersion.> 5/ dispersion.

• Journal of the Korea Concrete Institute
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• v.14 no.1
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• pp.126-135
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• 2002

Plate bonding technique has been widely used in strengthening of existing concrete structures, although it has often a serious problem of premature falure such as interface separation and rip-off. However, this premature failure problem has not been well explored yet especially in view of local failure mechanism around the interface of plate ends. The purpose of the present study is, therefore, to identify the local failure of strengthened plates and to derive a separation criterion at the interface of plates. To this end, a comprehensive experimental program has been set up. The double lap pull-out tests considering pure shear force and half beam tests considering combined flexure-shear force were performed. The main experimental parameters include plate thickness, adhesive thickness, and plate end arrangement. The strains along the longitudinal direction of steel plates have been measured and the shear stress were calculated from those measures strains. The effects of plate thickness, bonded length, and plate end treatment have been also clarified from the present test results. Nonlinear finite element analysis has been performed and compared with test results. The Interface properties are also modeled to present the separation failure behavior of strengthened members. The cracking patterns as well as maximum failure loads agree well with test data. The relation between maximum shear and normal stresses at the interface has been derived to propose a separation failure criterion of strengthened members. The present study allows more realistic analysis and design of externally strengthened flexural member with steel plates.

• Journal of the Korea Concrete Institute
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• v.13 no.5
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• pp.491-498
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• 2001

The failure phenomenon of overlaid concrete structures, such as surface crack and peel-off failure in the contact zone, was investigated due to temperature shock(rainfall). To investigate this failure phenomenon, the surface tensile stress, and the shear stress, the vertical tensile stress in the contact zone were analysed using the non-linear stress-strain relationship of material such as strain-hardening- and strain-softening diagrams. Rainfall intensity, overlay thickness and overlay material were the main variables in the analyses. It is assumed that the initial temperature of overlaid concrete structures was heated up to 55$\^{C}$ by the solar heat. With a rain temperature 10$\^{C}$ and the rainfall intensity of nR=1/a, tR=10min, 60min, the stress states of overlaid concrete structures were calculated. The result shows that only fictitious cracks occurred in the overlay surface and no shear bond failure occurred in the contact zone. The vortical tensile stress increasing with overlay thickness was proved to be the cause of peel-off failure in the contact zone. The formulae for relationship between the vertical tensile stress and overlay thickness, material properties were derived. Using this formulae, it is possible to select proper material and overlay thickness to prevent failure in the contact zone due to temperature shock caused by rainfall.