• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.2 no.2
• /
• pp.67-74
• /
• 2003

This paper presents the development of the Inspection machine for SMD mounted on cream solder of PCB. There are mounting errors of SMD such as misalignment, missing part, wrong orientation, wrong polarity and so on. The main hardware of the system consists of a machine vision part and a motion control part. Operating software has been developed in GUI environment to help user convenience. The Inspection Jobs consist of two procedures, that is, creation of the inspection reference data and automatic inspection. The Inspection reference data has a tree structure of linked list including PCB information, blocks, components, windows, and inspection methods. This paper presents versatile inspection methods which include a section length method, a projection method and histogram method. Therefore, user can choose the suitable procedure for various components. Finally, the automatic Inspection procedure using the reference data checks the mounting errors of components.

• Journal of the Korea Society of Computer and Information
• /
• v.27 no.11
• /
• pp.115-121
• /
• 2022

In surface mount technology (SMT), the screen printer, which is an equipment for applying solder cream, has a lot of poor coating as the pad becomes smaller. To solve this problem, a jet printer is being used recently. However, if the nozzle at the end of the valve applied to the jet printer head is not cleaned, solder cream remains or an error occurs. To prevent this, the nozzles should be cleaned periodically. In this paper, a more stable cleaning method than the existing technology is presented for the stable application of solder cream on a jet printer. In this method, cut a 35mm wide mujin cloth, wrap it in a roll, and rotate it with a DC geared motor on the other side to clean it. As a result, it was confirmed that the solder paste was not left on the nozzle surface and was well wiped when cleaning with about 2,000 dotting cycles.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.36 no.1
• /
• pp.37-42
• /
• 2012

LIFT (laser-induced forward transfer) is an advanced laser processing method used for selectively transferring micron-sized objects. In our study, this process was applied in order to deposit solder balls in microsystem packaging processes for electronics. Locally melted solder paste could be transferred to a rigid substrate using laser pulses. A thin glass plate with a solder cream layer was used as a donor film, and an IR laser pulse (wavelength = 1070 nm) was used to transfer a micron-sized solder ball to the receptor. Mass balance and energy balance were applied to analyze the shape and temperature profiles of the solder paste drops. The transferred solder bumps had measured diameters of 30-40 ${\mu}m$ and thicknesses of 50 ${\mu}m$ in our experiment. The limits and applications of this method are also presented.

• Journal of the Microelectronics and Packaging Society
• /
• v.27 no.4
• /
• pp.1-10
• /
• 2020

This paper reviews the recent development of electronic textile technology, mainly focusing on chip-textile bonding. Before the chip-textile bonding, a circuit on the textile should be prepared to supply the electrical power and signal to the chip mounted on the fabrics. Either embroidery with conductive yarn or screen-printing with the conductive paste can be applied to implement the circuit on the fabrics depending on the circuit density and resolution. Next, chip-textile bonding can be performed. There are two choices for chip-textile bonding: fixed connection methods such as soldering, ACF/NCA, embroidery, crimping, and secondly removable connection methods like a hook, magnet, zipper. Following the chip-textile bonding process, the chip on the textile is generally encapsulated using PDMS to ensure reliability like water-proof.

• Journal of Platform Technology
• /
• v.8 no.1
• /
• pp.24-32
• /
• 2020

This paper designed and manufactured a chip mounter based on 3D printer technology that can be used for educational research or sample production to disseminate chip mounter, a core technology of SMT line. A stepper motor with open loop control is used for low cost drive design. The shortcomings of the motor's vibration and disassembly caused by the use of the step motor were compensated by the Micro-Step control method. In the chip mounter experiment, the gerber file was generated on the small chip mounter, printed at the actual size, and the solder cream was printed on the HASL-treated PCB in the same manner as the sample board fabrication. As a result of the experiment, unlike the 2012 micro components, parts such as SOIC and TQFP that require correction are twice as long as the component mounting time, but it can be confirmed that they are mounted relatively accurately. In addition, as a result of repeatedly measuring the error of the initial position 10 times, it was confirmed that a relatively small error of about 0.110mm occurs.