• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.202-202
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• 2004

화합물 반도체는 초고속, 초고주파 디바이스에 적합한 재료인 갈큠비소(GaAs), 인듐-인산듐(InP) 등 2 개 이상의 원소로 구성되어 있고, 실리콘에 비해 결정내의 빠른 전자이동속도와 발광성, 고속동작, 고주파특성, 내열특성을 지니고 있어 발광 소자 (LED)와 이동통신(RE)소자의 개발 등에 다양하게 이용되고 있다. 이와 같이 화합물 반도체는 고부가가치의 첨단산업 부품들로 적용되는 만큼 생산제조 공정에 해당하는 연마, 본딩, 디본딩에 관한 방법과 기술에 대한 연구가 꾸준히 진행되고 있다.(중략)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.10a
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• pp.160-160
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• 2003

• Journal of the Korean Society for Precision Engineering
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• v.22 no.6 s.171
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• pp.144-151
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• 2005

Spin coater is regarded as a major module rotating at high speed to be used build up polymer resin thin film layer fur bonding process of GaAs wafer. This module is consisted of spin unit for spreading uniformly, align device, resin spreading nozzle and et. al. Specially, spin unit which is a component of module can cause to vibrate and finally affect to the uniformity of polymer resin film layer. For the stability prediction of rotation velocity and uniformity of polymer resin film layer, it is very important to understand the dynamic characteristics of assembled spin coater module and the dynamic response mode resulted from rotation behavior of spin chuck. In this paper, stress concentration mode and the deformed shape of spin chuck generated due to angular acceleration process are presented using analytical method for evaluation of structural safety according to the revolution speed variation of spin unit. And also, deformation form of GaAs wafer due to dynamic behavior of spin chuck is presented fur the comparison of former simulated results.