• Title/Summary/Keyword: 코스퍼터링

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Fabrication of a Micro Cooler using Thermoelectric Thin Film (열전박막을 이용한 마이크로 냉각소자 제작)

  • Han, S.W.;Choi, H.J.;Kim, B.I.;Kim, B.M.;Kim, D.H.;Kim, O.J.
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1459-1462
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    • 2007
  • In general a thermoelectric cooler (TEC) consists of a series of P type and N type thermoelectric materials sandwiched between two wafers. When a DC current passes through these materials, three different effects take place; Peltier effect, Joule heating effect and heat transfer by conduction due to temperature difference between hot and cold plates. In this study we have developed a micro TEC using $Bi_2Te_3$ (N type) and $Bi_{0.5}Sb_{1.5}Te_3$ (P type) thin films. In order to improve that performance of a micro TEC, we made 10 um height TE legs using special PR only for lift-off. We measured COP (coefficient of performance) and temperature difference between hot and cold connectors with current.

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ZnTiO 박막의 성장과 전기적 특성 연구

  • Yu, Han-Tae;Lee, Yeong-Min;Yu, Seung-Yong;Kim, Hyeong-Jun;Lee, Jin-Yong;Lee, Se-Jun;Kim, Deuk-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.190-190
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    • 2010
  • 본 연구에서는 Ti이 도핑된 ZnO의 성장 및 후처리 과정에 따른 구조적, 전기적, 자기적 특성에 관하여 보고한다. ZnTiO 박막은 Pt/SiO2/Si기판에 $500^{\circ}C$, 20 mTorr에서 RF 마그네트론 스퍼터법과 DC 마그네트론 스퍼터법으로 코스퍼터링을 통하여 증착 하였다. 그리고 박막 성장 후 질소분위기에서 $600{\sim}900^{\circ}C$($50^{\circ}$ step)에서 급속 열처리 공정(RTA)을 이용하여 후열처리에 따른 특성변화를 관찰하였다. 구조적 특성변화를 확인하기 위하여 XRD 측정을 하였으며, Ti이 Zn와 치환되어 성장 한 것을 관측하였다. 한편 자기적 특성 확인을 위한 SQUID 측정 결과, ZnTiO 박막에서 강자성 특성인 자기-이력곡선을 확인하였다. 또한 강유전 특성 분석을 위한 I-V 측정에서 ZnTiO 박막에서 강유전 특성인 전류-이력 현상을 관측하였다.

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Fabrication of Silicon Quantum Dots in Si3N4 Matrix Using RF Magnetron Co-Sputtering (RF 마그네트론 코스퍼터링을 이용한 Si3N4 매트릭스 내부의 실리콘 양자점 제조연구)

  • Ha, Rin;Kim, Shin-Ho;Lee, Hyun-Ju;Park, Young-Bin;Lee, Jung-Chul;Bae, Jong-Seong;Kim, Yang-Do
    • Korean Journal of Materials Research
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    • v.20 no.11
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    • pp.606-610
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    • 2010
  • Films consisting of a silicon quantum dot superlattice were fabricated by alternating deposition of silicon rich silicon nitride and $Si_3N_4$ layers using an rf magnetron co-sputtering system. In order to use the silicon quantum dot super lattice structure for third generation multi junction solar cell applications, it is important to control the dot size. Moreover, silicon quantum dots have to be in a regularly spaced array in the dielectric matrix material for in order to allow for effective carrier transport. In this study, therefore, we fabricated silicon quantum dot superlattice films under various conditions and investigated crystallization behavior of the silicon quantum dot super lattice structure. Fourier transform infrared spectroscopy (FTIR) spectra showed an increased intensity of the $840\;cm^{-1}$ peak with increasing annealing temperature due to the increase in the number of Si-N bonds. A more conspicuous characteristic of this process is the increased intensity of the $1100\;cm^{-1}$ peak. This peak was attributed to annealing induced reordering in the films that led to increased Si-$N_4$ bonding. X-ray photoelectron spectroscopy (XPS) analysis showed that peak position was shifted to higher bonding energy as silicon 2p bonding energy changed. This transition is related to the formation of silicon quantum dots. Transmission electron microscopy (TEM) and electron spin resonance (ESR) analysis also confirmed the formation of silicon quantum dots. This study revealed that post annealing at $1100^{\circ}C$ for at least one hour is necessary to precipitate the silicon quantum dots in the $SiN_x$ matrix.