• Title/Summary/Keyword: 칩 마운터

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Object-Oriented Programming Based Chip-Mounter Simulator Using Stochastic Petri Nets (확률 페트리 네트를 이용한 객체기향 기반의 칩마운터 시뮬레이터 구현)

  • Park, Gi-Beom;Park, Tae-Hyoung
    • Journal of Institute of Control, Robotics and Systems
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    • v.7 no.6
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    • pp.540-549
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    • 2001
  • An implementation method for chip-mounter simulator is proposed to improve the productivity and utility of electronic assembly lines. The simulator emulates the assembly sequence graphically to verify the chip mounter program in offline. It also presents functions of time estimation and productivity analysis considering the error probability. To increase the flexibility of simulator, stochastic petri nets are applied to modeling of the assembly sequence. The sequence model is then implemented as extendable classes by an object oriented language. The simulator is applied to a commercial chip mounter to verify the usefulness of the method proposed.

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A Dynamic Programming Approach to Feeder Arrangement Optimization for Multihead-Gantry Chip Mounter (동적계획법에 의한 멀티헤드 겐트리형 칩마운터의 피더배치 최적화)

  • 박태형
    • Journal of Institute of Control, Robotics and Systems
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    • v.8 no.6
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    • pp.514-523
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    • 2002
  • Feeder arrangement is an important element of process planning for printed circuit board assembly systems. This paper newly proposes a feeder arrangement method for multihead-gantry chip mounters. The multihead-gantry chip mounters are very popular in printed circuit board assembly system, but the research has been mainly focused on single-head-gantry chip mounters. We present an integer programming formulation for optimization problem of multihead-gantry chip mounters, and propose a heuristic method to solve the large NP-complete problem in reasonable time. Dynamic programming method is then applied to feeder arrangement optimization to reduce the overall assembly time. Comparative simulation results are finally presented to verify the usefulness of the proposed method.

An Assembly Sequence Planning of a Chip Mounter Using Transportation Algorithm (수송알고리즘에 의한 칩마운터의 조립순서계획)

  • Park, Tae-Hyung;Kim, Cheol-Han
    • Journal of Institute of Control, Robotics and Systems
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    • v.6 no.9
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    • pp.836-843
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    • 2000
  • A sequence planning method is proposed to reduce the assembly time of gantey-type chip mounters with single head. The overall path of the chip mounter is divided into forward and backward path, and formulate the optimization problem is formulated as an transpoetation problem and an Euler's tour problem. The transportation alforithm is applied to find optimal backward path, and Euler's tour algorithm used to generate an assembly sequence. Simulation results are presented to verify the usefulness of the proposed method.

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PCB Assembly Optimization of Chip Mounters for Multiple Feeder Assignment (다중피더배치를 고려한 칩마운터의 조립순서 최적화)

  • Kim Kyung-Min;Park Tae-Hyoung
    • Journal of Institute of Control, Robotics and Systems
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    • v.11 no.2
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    • pp.144-151
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    • 2005
  • We propose an optimization method to reduce the assembly time of chip mounters. Feeder arrangement and assembly sequence are determined considering the multiple feeder assignment. The problem is divided into two sub-problems: feeder arrangement problem and assembly sequence problem. We present mathematical model for each sub-problem. The clustering algorithm and assignment algorithm are applied to solve the feeder arrangement problem. The assignment algorithm and connection algorithm are applied to solve the assembly sequence problem. Simulation results are then presented to verity the usefulness of the proposed method.

A study on the inspection algorithm of FIC device in chip mounter (칩 마운터에의 FIC 부품 인식에 관한 연구)

  • Lyou, Kyoung;Moon, Yun-Shik;Kim, Kyoung-Min;Park, Gwi-Tae
    • Journal of Institute of Control, Robotics and Systems
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    • v.4 no.3
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    • pp.384-391
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    • 1998
  • When a device is mounted on the PCB, it is impossible to have zero defects due to many unpredictable problems. Among these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). It is obvious that given the complexity of the inspection task, the efficiency of a human inspection is questionable. Thus, new technologies for inspection of SMD(Surface Mounting Device) should be explored. An example of such technologies is the Automated Visual Inspection(AVI), wherein the vision system plays a key role to correct this problem. In implementing vision system, high-speed and high-precision are indispensable for practical purposes. In this paper, a new algorithm based on the Radon transform which uses a projection technique to inspect the FIC(Flat Integrated Circuit) device is proposed. The proposed algorithm is compared with other algorithms by measuring the position error(center and angle) and the processing time for the device image, characterized by line scan camera.

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Development of 80W LED Lighting Equipment for Broadcasting System (방송시스템용 80W LED 조명장비의 개발)

  • Lee, Dong-Yoon
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.10 no.6
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    • pp.506-511
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    • 2017
  • LED lighting, which many companies are pursuing commercialization, is a representative green energy technology. However, the LED lighting for broadcasting image should have high output and easy portability compared with general LED lighting devices for street lamps, advertisement or transportation devices. Therefore, while shooting a broadcast image if you use LEDs as a substitute light source for halogen lamps and fluorescent lamps that are large in size and uncomfortable to handle it is expected that the lightening of the equipment will activate the broadcasting image lighting equipment industry. After considering the mass production of the LED module board and the SMT production size of the chip mounter, the board size was determined considering the overall size of the product by model. In this paper, four 20W LED boards are arranged vertically in order to produce an 80W board. In other words, by sharing LED module board size by model, high power LED lighting equipments of 120W and 200W can be selected as an increase in the number of boards.