• Proceedings of the KIEE Conference
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• 2002.07d
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• pp.2442-2444
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• 2002

표면실장형 인쇄회로기판 조림용 칩마운터의 효율적인 운용을 위한 부품 장착 순서를 최적화하는 방법을 모색한다. 연구 과정은 멀티헤드 칩마운터 부품장착 순서를 동적계획법으로 수학식으로 모델링하고, 동적계획법의 방법으로 대상 칩마운터의 장착 순서를 생성한다. 생성된 결과는 다른 알고리즘을 적용하여 생성된 결과와 비교 분석을 한다.

• Journal of Platform Technology
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• v.8 no.1
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• pp.24-32
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• 2020

This paper designed and manufactured a chip mounter based on 3D printer technology that can be used for educational research or sample production to disseminate chip mounter, a core technology of SMT line. A stepper motor with open loop control is used for low cost drive design. The shortcomings of the motor's vibration and disassembly caused by the use of the step motor were compensated by the Micro-Step control method. In the chip mounter experiment, the gerber file was generated on the small chip mounter, printed at the actual size, and the solder cream was printed on the HASL-treated PCB in the same manner as the sample board fabrication. As a result of the experiment, unlike the 2012 micro components, parts such as SOIC and TQFP that require correction are twice as long as the component mounting time, but it can be confirmed that they are mounted relatively accurately. In addition, as a result of repeatedly measuring the error of the initial position 10 times, it was confirmed that a relatively small error of about 0.110mm occurs.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.217.2-217.2
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• 2005

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.5
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• pp.716-723
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• 2002

Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model (TRM) was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than 7$^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air and -water flow rate.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.96-101
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• 2001

Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than $7^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air flow rate.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.621-628
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• 2000

A kinematic ball bar measuring system can analyze the various errors of a machine tool easil rapidly with only one measurement, But it cannot be used to measure the errors of the equipment the semiconductor manufacturing (e.g. chip mounter, PCB router etc.) not to use a cir interpolation. This paper presents the method to apply a kinematic ball bar measuring system tc machines which use merely a linear interpolation Also, the work of measuring and calibratir various errors of a chip mounter with a kinematic bal1 bar measurement system is accomplished

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.366-370
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• 2002

A kinematic ball bar measurement system can analyze the various errors of a machine tool easily and rapidly in a procedure and can measure many types of equipment such as chip mounter, PCB router, precision stage, etc. In this paper, the thermally induced errors are loused among various errors of a chip mounter because it affects the accuracy of the machine very much. Linear regression technique is adapted for the thermal error modeling. While the measurement and calibration of a chip mounter is difficult in general, this developed system is not only easy to apply for it but also improves the accuracy by 4 times or more.

• Proceedings of the KIEE Conference
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• 2002.07d
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• pp.2436-2438
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• 2002

전자제품의 소형화 및 고기능화 추세에 따라 부품의 크기가 작아지고, PCB 회로의 고집적화가 이루어지면서 생산 장비의 고속성, 정밀성 등의 필요성이 대두되고 있다. 소형 부품 조립에 있어 대표적인 SMD 장착 장비인 칩마운터의 경우 시스템의 고속성 정밀성을 향상시키기 위해서 부품검사를 담당하는 고속의 영상 처리 알고리즘이 필수적이나 개발업체간의 특수성으로 인해 공개적으로 논의되고 있지 않다. 따라서 본 연구에서는 실제 칩마운터에 적용되는 사양을 기준으로 영상처리를 이용한 부품 외형 검사를 통해 위치 및 각도 오차를 계산하는 알고리즘을 제안하였으며, 제시된 알고리즘의 신뢰성 및 유효성을 확인하기 위한 부품 검사 실험을 수행하였다. 아울러, 본 논문에서는 부품검사방법의 정밀도를 높이기 위하여 부화소(subpixel)를 고려한 검사방법을 적용하였다.

• NEWSLETTER 전기공업
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• no.92-27 s.70
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• pp.1-20
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• 1992

• NEWSLETTER 전기공업
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• no.91-25 s.38
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• pp.1-22
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• 1991