• Title/Summary/Keyword: 초정밀

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A Study on the Ultra-Precision Turning of Al Alloy (Al합금의 초정밀 선삭가공)

  • 김우순;채왕석;김동현;난바의치
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2003.04a
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    • pp.416-421
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    • 2003
  • To obtain the surface roughness with range from l0nm to In n need a ultra-Precision machine, cutting condition and the study of materials. And n have to also consider the chip and vibration of diamond tool during processing. In this paper, the cutting conditions for getting mirror surface of aluminum alloy have been examined experimentally by using ultra-precision turning and single crystal diamond tool. In generally, the cutting conditions have effect on the surface roughness in ultra-precision turning. The result of surface roughness was measured by the ZYGO New View 200.

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A Study on the Development of the Superprecision Nano Separator (초정밀 나노 분급기 개발에 관한 연구)

  • 성백섭;윤길하;차용훈
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2003.04a
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    • pp.27-32
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    • 2003
  • Nanotechnology is the creation and utilization of materials, devices, and systems through the control of matter on the nanometer-length scale, that is, at the level of atoms, molecules, and supramolecular structures. The essence of nanotechnology is the ability to work at these levels to generate larger structures with fundamentally new molecular organization. These nanostructures, made with building blocks understood from first principles, are the smallest human-made objects, and they exhibit novel physical, chemical, and biological properties and phenomena. The aim of nanotechnology is to loam to exploit these properties and efficiently manufacture and employ the structures. Control of matter on the nanoscale already plays an important role in scientific disciplines as diverse as physics, chemistry, materials science, biology, medicine, engineering, and computer simulation. This paper describes the superprecision nano separator to productive particle size of nano powder. this separator system is very important in the industrial area for other high technology parts.

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A Study on the Vibrational Reduction Evaluation and the Relative Displacement in the External Vibration of Precision Measuring System (초정밀 측정/가공 장비의 외부진동에 대한 상대변위의 추출과 진동성능 평가에 관한 연구)

  • 전종균;엄호성;김강부;원영재
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.12 no.1
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    • pp.65-72
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    • 2002
  • Generally, there are laser operating equipments( aligner, stepper) and electronic microscope( SEM, TEM) as a high precision manufacturing and inspection equipment in semiconductor production companies, precision examination and measuring laboratories. Mostly, these equipments are characterized by projection and target part. The relative displacements between projection and target part are dominant roles in vibrational problem in these precision equipments. These relative displacements are determined by the position of incoming vibration and the difference of vibration response in projection and target part. In this study, the allowable vibrational limits are suggested and the vibrational reduction plans are proposed by measurement and analysis of vibration phenomenon in the Clean Room in PDP(plasma display panel) production building. The vibration performance is evaluated by comparison relative displacements between projection and target part before/after the vibration isolation plan.

A Study on Ultraprecision Dicing Machining of Silicon Wafer (실리콘 웨이퍼의 초정밀 절단가공에 관한 연구)

  • 김성철
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1999.10a
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    • pp.502-506
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    • 1999
  • Recently, the miniature of electric products such as notebook, cellular-phone etc. is apparently appeared, due to the smaller size of the semiconductor chips. As the size of chip gets smaller, the circuit could be easily damaged by the slightest influence, so it is important to control the chipping generation in the process of dicing. This paper deals with chipping of the silicon wafer dicing. The relationships between the dicing force and the wafer chipping are investigated. It is confirmed that the wafer chipping increases as the dicing force increases.

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Ultra Precision cutting Characteristics for Al 6061 (Al 6061의 초정밀 절삭특성)

  • 박상진
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2000.04a
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    • pp.591-596
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    • 2000
  • The needs of ultra precision machined parts is increase every days. But the experimental data of nonferrous metal is insufficient. The cutting behavior in micro cutting area is different from that of traditional cutting because of the size effect. Al6061 is widely used as optical parts such as LASER reflector's mirror or multimedia instrument. Al6061 opper is machined by ultra precision machine with natural diamond tool. From the experiment and discussion on the cutting force and worked surface roughness as the variable spindle speed, feed rate and depth of cut. As a result, the cutting force increases as the increasing depth of cut, but the worked surface roughness does not increase so much. The surface roughness is good when spindle sped is above 1200rpm, and feed rate is small. The influence of depth of cut is very small.

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A Study on Machined Surfaces Characteristics of Aluminum Alloy by AFM Measurement (AFM 측정법에 의한 알루미늄 합금의 초정밀 가공면 평가 연구)

  • Lee Gab-Jo;Kim Jong-Kwan
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.15 no.2
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    • pp.81-86
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    • 2006
  • The machining parts must be produced within the specification of drawing and those will be able to meet function and efficiency. At that time, it is very important not only precision machine and machining technique but also the measurement technique. So, the improvement of measurement technique is to be joined together at once with improvement of machining technique. Finally, the quality and value of the parts are decided by precision measurement. This paper aims to study on the machined surfaces characteristics of aluminum alloy by AFM(Atomic force microscope) measurement. The objective is contribution to ultra-precision machining by exhibit foundation data of surface roughness and tool wear when parts are cutting with diamond tool at the factory.

Ultra Precision Machining Technique for Optical System Parts (초정밀 가공기를 활용한 광학계 부품 가공기술)

  • Yang, Sun-Choel;Kim, Sang-Hyuk;Huh, Myung-Sang;Chang, Ki-Soo;Park, Soon-Sub;Won, Jong-Ho;Kim, Geon-Hee
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.2
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    • pp.13-19
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    • 2012
  • Ultra Precision Machining Techniques, such as manufacturing Micro Lens Array(MLA), off-axis mirror, $F-{\theta}$ lens for laser printer, are achieved, based on technologies in consequence of development of modern high-precision machining mechanism. Above all, FTS(Fast Tool Servo) and STS(Slow Tool Servo) are more innovative technologies for reducing time and development costs. In this paper, it is described that MLA machining technique by FTS, off-axis mirror machining technique by STS, optics for observing space, and development of infrared aspheric lens for a thermal imaging microscope.

A Study on the Ultra-precision Mirror Finishing Using the System of Experiments (실험 계획법을 이용한 초정밀 연마 가공에 관한 연구)

  • Kim, Hong-Bae
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.7 no.5
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    • pp.134-139
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    • 1998
  • There have been so manu study in the ultra-precision mirror finishing. Already Using system of experiments extract factors effecting surface roughness and find optimal machining conditions in 40${\mu}{\textrm}{m}$, 30${\mu}{\textrm}{m}$, 15${\mu}{\textrm}{m}$ abrasive film. So in this study, Using Abrasive film of 12~3${\mu}{\textrm}{m}$ extract factors effecting surface roughness and results are follows; Factor A(film feed) in 12${\mu}{\textrm}{m}$ and 5${\mu}{\textrm}{m}$ abrasive film, Factor A(film feed) and B(applied force) in 9${\mu}{\textrm}{m}$ abrasive film, Factor C(grinding speed) in 3${\mu}{\textrm}{m}$ abrasive film are main factor effecting surface roughness.

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포커스-e기업: 3D 광학계 및 초정밀 비구면광학계 등의 생산기반 구축 -(주)프로옵틱스 창립 10주년 기념식 및 신사옥 준공식 가져

  • Park, Ji-Yeon
    • The Optical Journal
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    • s.131
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    • pp.32-33
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    • 2011
  • (주)포로옵틱스(대표 정진호, www.prooptics.co.kr)가 지난 1월 19일 산학연 인사들을 초청하여 신사옥 준공식 행사를 가졌다. 2005년 12월 지금의 이천시 부발읍에 사옥 준공식을 가진 후 5년 만에 사세 확장과 함께 신사옥을 완공한 이 회사는 오는 3월 창립 10주년을 앞두고 10주년 기념식도 겸하여 더욱 뜻 깊은 자리가 되었다. 280여 평 규모로 지어진 신사옥에서는 3D 광학계를 비롯하여 초정밀 대구경 비구면 렌즈 가공을 통해 초고미세 노광광학계, 천체 망원경 및 인공위성 광학계를 생산할 수 있는 기반을 구축하게 됐다.

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초정밀 비구면의의 설계, 측정 및 가공의 비용절감을 지원하는 새로운 비구면 표현식 Q Polynomials의 소개

  • Sin, Ji-Sik
    • The Optical Journal
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    • s.150
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    • pp.31-41
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    • 2014
  • 현재까지 많은 업체에서 사용되는 비구면 표현식의 단점을 해결하여 직관적이며 예측가능한 면을 표현할 수 있는 새로운 비구면 표현식, 일명 Q Polynomials (또는 Forbes Polynomials, Q-type Polynomials)을 소개한다. Q Polynomials은 기존 quadratic polynomial을 이용한 표현식과 달리 서로 영향을 미치지 않는 유일한 함수 Qm를 기본으로 하는 다항식으로 구성되어 있기 때문에 각 계수는 하나의 비구면에 대해 유일한 계수다. 각 항의 함수의 모양이 이미 정해져 있기 때문에 계수들의 크기를 살펴보면 비구면도, 측정 가능성, 가공 및 생산 가능성에 대한 예측이 가능하다. 따라서 비구면 설계 시점에서부터 시험/검사, 생산이 실질적으로 가능한 비구면 광학요소인지가 판정되므로 설계시부터 설계자, 시험/검사자, 생산자 사이의 합의가 이루어지는 것과 같다. 따라서 생산성과 간섭계 측정을 이용한 초정밀 비구면를 제조할 수 있는 결과에 이르게 된다. 이미 도입한 여러 업체에서 긍정적인 결과를 얻고 있다. Q polynomials은 기존에 현업에서 사용되고 있는 광학 설계 프로그램에도 적용되어 사용 가능하다.

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