• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1995.04a
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• pp.190-195
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• 1995

초음파 세정기에 의한 세정 성능의 향상을 위한 연구로서, 세정조 내에서의 초음파 전파 현상을 이론적으로 밝히고, 수치해석에 의해 실제 상황의 음압 분포를 구하였으며, 실험에 의해 세정액 내 음압 분포를 확인하였다. 세정액 내의 음압 분포는 세정기 진동판으로부터의 거리에 따라 반파장 간격으로 극대점 또는 극소점이 반복된다. 이에 근거하여 세정 성능 향상 대책이 제시될 수 있게 되었다.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.118-122
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• 2004

본 연구에서는 반도체 세정 챔버 내부에서 회전 척을 사용하는 기판의 세정 공정에서 세정장치와 건조장치를 분리하지 알고 일체화하는 기술을 연구하는 한편, 초음파 세정기술을 이용하여, 세정에 사용되는 약액을 절감하는 방법도 연구하였다. UWA(Ultrasonic Water and Clean Air) system은 초음파 진동부, 초순수 공급부 그리고 clean air공급부를 모듈화 하였다. UWA system으로 공급된 초순수에 70～130kHz범위의 초음파가 더하여지고 반도체 기판 위에 분사되면 기판 위의 미세 파티클을 세정하는 효과를 갖는다. 세정 후 연속적으로 clean air를 분사하여 기판 위의 수분을 완전히 제거한다. Particle 세정 작업을 실시한 후 표면을 검사하여 정밀세정 능력을 확인하였다.

• Clean Technology
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• v.18 no.3
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• pp.287-294
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• 2012

In this study, performances of two cleaning methods were analyzed and a cleaning system was designed to develop a cleaning process of electronic components to remanufacture old laser copy machine. First, plasma cleaning as a dry cleaning method was executed to test cleaning ability. In cleaning of printed circuit board (PCB) by plasma, some damages were found near the metal parts, and considering the productivity, this method was not adequate for the cleaning of electronic components. With 4 different cleaning agents, ultrasonic cleaning tests were executed to select an optimal cleaning agent, aqueous agents showed superior cleaning performance compared to semi-aqueous and non-aqueous agents. Cleaning with aqueous cleaning agent A and 28 kHz ultrasonic frequency can be completed in 30 sec to 1 min. Finally, an ultrasonic cleaning system was constructed based on the pre-test results. Optimal cleaning conditions of 40 kHz and $50^{\circ}C$ were found in the field test. The productivity and economic efficiency in remanufacturing of laser copy machine are expected to increase by adapting developed ultrasonic cleaning system.

• Textile Coloration and Finishing
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• v.8 no.4
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• pp.59-68
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• 1996

섬유산업에 초음파의 이용은 극히 새로운 것이 아니며, 초음파를 이용하여 시간단축과 공정개선 등에 관한 많은 문헌들도 있다. 게다가 세정과 기계분야, 안정된 분산용액의 제조에 두드러지게 활용되고 있는 기술이며, 다른 새로운 분야로도 연구확대되고 있다. 주로 세정조에 구성되어 있는 초음파발생자치는 세정효율을 높이기 때문에 응용확대가 기대된다. 특별한 장치가 필요없기 때문에 음화학반응에서 관심이 모아지고 있다. 초음파는 이제 광범위한 습식공정에 영향을 미치는 기술로 이해되고 있다. 이 자료는 이미 연구된 결과를 재조명하고 초음파를 이용하므로서 얻을 수 있는 이점에 대해서 어떤 것이 있는지에 대해 살펴보고자 한다.

• Clean Technology
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• v.17 no.2
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• pp.117-123
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• 2011

In this study, evaluation tests for cleaning performance of various cleaning agents and selection of optimal ultrasonic cleaning parameters were executed to develop an efficient cleaning process in remanufacturing of laser copy machine. Cleaning performance tests were executed with 8 cleaning agents (A~H) to remove the contaminants of oil-ink, toner particles, and shoe polish. Physical properties and foamability tests were also applied. For 3 types of contaminants, cleaning agent G showed superior cleaning performance compared to agent A which has being used at a remanufacturing of laser copy machine in Korea. With cleaning agents selected in pre-tests, ultrasonic cleaning tests were executed to remove real contaminants on the parts of used digital laser copy machine parts. Cleaning agent G at 28 kHz ultrasonic frequency showed faster cleaning performance compared to agent A and other frequencies. The productivity and economic efficiency in remanufacturing of laser copy machine are expected to increase by adapting agent G and 28 kHz frequency at ultrasonic cleaning process.

• Journal of Korean Society of Environmental Engineers
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• v.28 no.2
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• pp.197-206
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• 2006

This study evaluated the effect of ultrasonic irradiation on improving the flux and cleaning efficiency in membrane process which is widely applied for the treatment of landfill leachate. The experiments on improvement of membrane flux according to the types of membranes(hallowfiber microfiltration, MF and tubular ultrafiltration, UF) were performed with changing frequency($40{\sim}120$ kHz), intensity ($200{\sim}500$ W) and irradiation time of ultrasound as well us operation pressure($0.1{\sim}2.3kg/cm^2$). Membrane was fouled for the first 50 min with primary treated leachate and then the change in flux according to ultrasonic irradiation period was observed for 70 min. Parameters influenced to the recovery ratio corresponding the net flux on pure water and to the enhancement ratio applied after ultrasonic irradiation on the flux were analyzed. In same condition, the flux was improved in proportion to ultrasonic intensity while the improvement of flux was inversely proportional to ultrasonic frequency. The cleaning effect of membrane was delayed and reduced when operation pressure of membrane was high. The recovery ratio and enhancement ratio for $0.1{\mu}m$ MF membrane were 10% and 500%, respectively while those were maximized at $75{\sim}98%\;and\;40{\sim}50%$ for UF membrane for 10,000 and 100,000 MWCO, respectively. In conclusion, it was confirmed that ultrasonic cleaning using mechanical vibration is alternative to water or chemical cleaning for improving membrane flux.

• Clean Technology
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• v.19 no.3
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• pp.264-271
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• 2013

In this study, we optimized the removal condition of contaminants attached on the scrap surface to recycle the scrap generated from the Zr alloy tube manufacturing process back to the nuclear grade. The main contaminant is remnant of watersoluble cooling lubricant that is used in the pilgering manufacture during the tube production, and it is assumed to be compressed and carbonized on the surface of tube. Zirlo alloy tube of ${\phi}9.50mm$, which has high occurrence frequency of scrap, was selected as the object to be cleaned, and cleaning abilities of reagents were evaluated by measuring the characteristics of contaminants remained and by analyzing the surface of the tube after cleaning process. For evaluation of each cleaning agent, we selected two types of sodium hydroxide series and three types of potassium hydroxide series. Furthermore, to confirm dependence on tempe-rature and ultrasonic intensities, cleaning at the room temperature, $40^{\circ}C$, and $60^{\circ}C$ was conducted, and results showed that higher the cleaning temperature and higher the ultrasonic intensity, better the cleaning effect. As a result of the bare-eye inspection, while the use of sodium hydroxide provided satisfactory condition on the tube surface, the use of potassium hydroxide series provided satisfactory condition on the tube surface only when the ultrasonic intensity was over 120 W. In the cleaning effect analysis using the gravimetric method, cleaning efficiency of sodium hydroxide series was as high as 97.6% ($60^{\circ}C$, 120 W), but since the tube surface condition was poor after the use of potassium hydroxide, the gravimetric method was not appropriate. In the analytical result of surface contaminants on the tube surface, C, O, Ca, and Zr were detected, and mainly C and O dominated the proportion of contaminants. It was also found that the degree of cleaning on the tube affected the componential ratio of C and O; if the degree of cleaning is high, or if cleaning is well-conducted, the proportion of C is decreased, and the proportion of O is increased. Based on these results, optimal cleaning for application in the industry can be expected by categorizing cleaning process into three steps of Alkali cleaning, Rinsing, and Drying and by adjusting cleaning parameters in each step.

• Air Cleaning Technology
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• v.7 no.2 s.25
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• pp.69-77
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• 1994

• Clean Technology
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• v.19 no.3
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• pp.219-225
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• 2013

Environment-friendly and surfactant-free aqueous cleaning agents have been developed in order to solve various problems generated by surfactants in the aqueous cleaning agents. Aqueous surfactant-free cleaning agents, S-1 and S-2 have been formulated with water-soluble solvents such as propylene glycol and propylene glycol ether on their main components and with some additives. These solvents were chosen because of their good solubility in water and excellent solubility of fluxes which are major contaminants of printed circuit board in the electronic industry. Physical properties of the formulated and the imported cleaning agents were measured to predict their cleaning performance, and their cleaning abilities of flux and solder contaminants were evaluated under the various ultrasonic frequencies by a gravimetric method. The measurement results show that the physical properties of cleaning agent V are generally similar with those of formulated cleaning agents S-1 and S-2. Both the cleaning agent V and the formulated cleaning agents S-1 and S-2 showed similar trends that their pH decrease in the beginning and then increases later on with the increase of their dilution in water. It is considered that the wetting indices of the cleaning agents calculated with experimental values do not not have any influence on their cleaning ability. In ultrasonic cleaning tests under three ultrasonic frequencies of 28, 45, and 100 kHz, their best performances of cleaning solder and flux were obtained at 45 kHz and 28 kHz, respectively, and the cleaning performance of the formulated cleaning agents S-1 and S-2 was better than that of the cleaning agent V. However, in the case of the recommended diluted concentration of 25 wt% cleaning solution, the cleaning performance of the cleaner V for solder and flux was better in the initial stage of cleaning compared to the formulated cleaners. And it may be concluded that the formulated cleaning agents S-1 and S-2 can be applied to cleaning of solder and flux in the industry, based on the experimental results in this study.

• Journal of the Korean Chemical Society
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• v.47 no.6
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• pp.608-613
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• 2003

In order to remove particles on surface of post-oxide CMP wafer, new cleaning solution was prepared by mixing with DHF (Diluted HF), nonionic surfactant PAAE (Polyoxyethylene Alkyl Aryl Ether), DMSO (Dimethylsulfoxide) and D.I.W.. Silicone wafers were intentionally contaminated by silica, alumina and PSL (polystylene latex) which had different zeta potentials in cleaning solution. This cleaning solution under megasonic irradiation could remove particles and metals simultaneously at room temperature in contrast to traditional AMP (mixture of $NH_4OH,\;H_2O_2$ and D.I.W) without any side effects such as increasing of microroughness, metal line corrosion and deposition of organic contaminants. This suggests that this cleaning solution would be useful future application with copper CMP in brush cleaning process as well as traditional post CMP cleaning process.