• Journal of the Korea Institute of Information and Communication Engineering
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• v.19 no.7
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• pp.1639-1645
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• 2015

In UHD high-speed video transmission system, when a signal within certain frequency region coincides electrically and structurally, the system becomes unstable because the energy is concentrated, and signal flux is interfered and distorted. For the instability, power integrity analysis should be conducted. To remove the signal distortion for MLB, using a high-frequency design technique for EMI phenomenon, EMI which radiates electromagnetic energy fluxed into power layer was analyzed considering system stabilization. In this paper, we proposed an adaptive MLB design method which minimizes high-frequency noise in MLB structure, enhances signal integrity and power integrity, and suppresses EMI. The characteristic impedance for multi-layer circuit board proposed in this study were High-Speed Video Differential Signaling(HSVDS) line width w = 0.203, line gap d = 0.203, beta layer height h = 0.145, line thickness t = 0.0175, dielectric constant ε_r = 4.3, and characteristic impedance Zdiff = 100.186Ω. When high-speed video differential signal interface board was tested with optimized parameters, the magnitude of Eye diagram output was 672mV, jittering was 6.593ps, transmission frequency was 1.322GHz, signal to noise was 29.62dB showing transmission quality improvement of 10dB compared to previous system.

• Journal of the Korea Concrete Institute
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• v.24 no.3
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• pp.275-283
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• 2012

Steel Plate for Rebar Connection was recently developed to splice rebars in delayed slab-wall joints in high-rise building, slurry wall-slab joints, temporary openings, etc. It consists of several couplers and a thin steel plate with shear key. Cyclic loading tests on slab-wall joints were conducted to verify structural behavior of the joints having Steel Plate for Rebar Connection. For comparison, joints with Rebend Connection and without splices were also tested. The joints with Steel Plate for Rebar Connection showed typical flexural behavior in the sequence of tension re-bar yielding, sufficient flexural deformation, crushing of compression concrete, and compression rebar buckling. However, the joints with Rebend Connection had more bond cracks in slabs faces and spalling in side cover-concrete, even though elastic behavior of the joints was similar to that of the joints with Steel Plate for Re-bar Connection. Consequently, the joints with Rebend Connection had less strengths and deformation capacities than the joints with Steel Plate for Re-bar Connection. In addition, stiffness of the joints with Rebend Connection degraded more rapidly than the other joints as cyclic loads were applied. This may be caused by low elastic modulus of re-straightened rebars and restraightening of kinked bar. For two types of diameters (13mm and 16mm) and two types of grades (SD300 and SD400) of rebars, the joints with Steel Plate for Rebar Connection had higher strength than nominal strength calculated from actual material properties. On the contrary, strengths of the joints with Rebend Connection decreased as bar diameter increased and as grade becames higher. Therefore, Rebend Connection should be used with caution in design and construction.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.10 no.7
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• pp.1281-1286
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• 2006

We have used the silicon-carbide(4H-SiC) instead of conventional silicon materials to develope of the planar junction barrier schottky rectifier for ultra high breakdown voltage(1,200 V grade). The substrate size is 2 inch wafer, Its concentration is $3*10^{18}/cm^{3}$ of $n^{+}-$type, thickness of epitaxial layer $12{\mu}m$ conentration is $5*10^{15}cm^{-3}$ of n-type. The fabticated devices are junction barrier schottky rectifier, The guard ring for improvement of breakdown voltage is designed by the box-like impurity of boron, the width and space of guard ring was designed by variation. The contact metals to rectify were used by the $Ni(3,000\:{\AA})/Au(2,000\:{\AA})$. As a results, the on-state voltage is 1.26 V, on-state resistance is $45m{\Omega}/cm^{3}$, maximum value of improved reverse breakdown voltage is 1180V, reverse leakage current density is $2.26*10^{-5}A/CM^{3}$. We had improved the measureme nt results of the electrical parameters.

• Journal of the Korean Society for Nondestructive Testing
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• v.23 no.4
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• pp.322-327
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• 2003

Giant magnetoresistance(GMR) NiO multilayer, which has been used to reading head of highly dense magnetic recording, was fabricated, and oxidized in an air during 80 days to study the dependence of magnetoresistance properties on residual stress in the interfaces. The magnetoresistance ratio and the exchange biasing $field(H_{ex})$ of $NiO(60nm)/Ni_{81}Fe_{19}(5nm)/Co(0.7nm)/Cu(2nm)/Co(0.7nm)/Ni_{81}Fe_{19}(7nm)$ spin valves were increased from 4.9% to 7.3%, and 110 Oe to 170 Oe after natural oxidation in the atmosphere for 80 days, respectively. The sheet resistivity ${\rho}$ decreased from $28{\mu}{\Omega}m$ to $17{\mu}{\Omega}m$, but ${\Delta}p$ did not almost change after the oxidation. Therefore, the increase of MR ratio is due to the decrease in the sheet resistivity. the reduced resistance may result from the increase in the reflection of conduction electrons at the oxidized top surface. Also, the increase in the exchange biasing field is originated from the reduction of residual stress at the interface of $NiO/Ni_{81}Fe_{19}$ according as the aging time increases.

• Journal of the Korean Vacuum Society
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• v.15 no.1
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• pp.89-96
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• 2006

Recent ULSI and multilevel structure trends in microelectronic devices minimize the line width down to less than $0.25{\mu}m$, which results in high current densities in thin film interconnections. Under high current densities, an EM(electromigration) induced failure becomes one of the critical problems in a microelectronic device. This study is to improve thin film interconnection materials by investigating the EM characteristics in Ag, Cu, Au, and Al thin films, etc. EM resistance characteristics of Ag, Cu, Au, and Al thin films with high electrical conductivities were investigated by measuring the activation energies from the TTF (Time-to-Failure) analysis. Optical microscope and XPS (X-ray photoelectron spectroscopy) analysis were used for the failure analysis in thin films. Cu thin films showed relatively high activation energy for the electromigration. Thus Cu thin films may be potentially good candidate for the next choice of advanced thin film interconnection materials where high current density and good EM resitance are required. Passivated Al thin films showed the increased MTF(Mean-time-to-Failure) values, that is, the increased EM resistance characteristics due to the dielectric passivation effects at the interface between the dielectric overlayer and the thin film interconnection materials.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.4
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• pp.1968-1975
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• 2011

This study was performed to propose a development guide for the periphery of local industrial park in the region of Hongseng-gun located at the mid-west of Chungnam province., which is a representative agrarian society, has been approached to a super-aged society where the region shows a continuous decrease in population, and the composition ratio of old ages is about 17.1%. Also, the region is a period of a low ebb due to the traditional agriculture based industrial structure in producing mainly simple productions. Many local governments in agrarian and fishing regions have been efforted for luring some businesses in their regions by constructing industrial complex competitively in order to solve such structural problems in such local regions. However, in some cases, these efforts cause certain destructions in the local original natural environment due to such development of industrial complex and the decrease in the settlement environment of residents. The objective of this study is to establish a local development plan for building the sustainable and comfortable settlement environments based on the settlement of the residents and the labors in such industrial complex by preventing sprawl developments in the construction of general industrial complex. This study was processed as following procedures. First, this study drew the trend in the change of the local society of H-gun through collecting literatures and analyzing it. Second, this study proposed a proper level of settlement environments required to the development of surroundings in such industrial complex based on the survey of the consciousness of residents using a statistical method. Finally, this study proposed a development guide for the surroundings based on the proposed level of settlement environments.

• 한국지구물리탐사학회:학술대회논문집
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• 2002.09a
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• pp.101-125
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• 2002

A lake seismic survey was carried out to investigate possible geohazards for construction of the underground LPG storage at Namyang Lake. The proposed survey site has a land-lake combined geography and furthermore water depth of the lake is shallow. Therefore, various seismic methods such as marine single channel high resolution seismic reflection survey, sonobuoy refraction survey, land refraction survey and land-lake combined refraction survey were applied. Total survey amounts are 34 line-km of high resolution lake seismic survey, 14 lines of sonobuoy refraction survey, 890 m of land refraction survey and 8 lines of land-lake combined refraction survey. During the reflection survey, there were severe water reverberations from the lake bottom obscured subsurface profiling. These strong multiple events appeared in most of the survey area except the northern and southern area near the embankment where seems to be accumulated mainly mud dominated depositions. The sonobuoy refraction profiles also showed the same Phenomena as those of reflection survey. Meanwhile the results of the land-lake combined refraction survey showed relatively better qualities. However, the land refraction survey did not so due to low velocity soil layer and electrical noise. Summarized results from the lake seismic survey are that acoustic basement with relatively flat pattern appeared 30m below water level and showed three types of bedrock such as fresh, moderately weathered and weathered type. According to the results of the combined refraction survey, a velocity distribution pattern of the lake bottom shows three types of seismic velocity zone such as >4.5 km/s, 4.5-4.0km/s and <4.0km/s. The major fault lineament in the area showed NW-SE trend which was different from the Landsat image interpretation. A drilling was confirmed estimated faults by seismic survey.