• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1082-1086
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• 2004

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of wafer. The grinding of wafer is usually used by the infeed grinding machine. The infeed grinding machine has been depended on imports. Therefore, it is necessary to develop the infeed grinding machine because the demand of the infeed grinding machine is increasing more and more. This paper describes the technologies of infeed grinding machine and intend to introduce the studies in the development of the intelligent grinding system for grinding of wafer. The air bearing spindle for the infeed grinding machine was developed by domestic technologies and the grinding part design of the intelligent grinding system for wafer grinding was completed.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.11 no.3
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• pp.28-38
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• 2002

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1099-1104
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• 2004

As consumer in optics, electronics, aerospace and electronics industry grow, the demand for ultra precision aspherical surface lens increases higher. To enhance the precision and productivity of ultra precision aspherical surface micro lens, the following specification of ultra precision grinding system is required: the highest rotational speed of the grinder is 100,000rpm and its turning accuracy is $0.1{\mu}m$, positioning accuracy is $0.1{\mu}m$. The development process of the grinding system for the ultra precision aspherical surface micro lens for optoelectronics industry is introduced. In the work reported in this paper, an intelligent grinding system for ultra precision aspherical surface machining was designed by considering the factors affecting the surface roughness and profiles accuracy. An aerostatic form was adopted to build the spindle of the workpiece and the spindle of grinder and ultra precision LM guide way was adopted in this system.

• Journal of Power System Engineering
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• v.6 no.2
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• pp.60-67
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• 2002

연삭가공은 나노스케일(Nano-scale)의 미소한 입자 절삭날을 이용한 가공으로, 공작물의 표면을 경면(Mirror surface)으로 가공할 수 있어 제품의 최종 마무리공정으로 사용되어 왔다. 그러나 연삭공정에 있어서는 공구(연삭숫돌)의 수명이 다하거나 가공계(Machining system)가 불안정해지면 채터진동과 연삭버닝 등의 현상이 발생하여 가공물의 표면품위를 저하시키는 요인으로 작용하고 있다. 따라서 본 연구는 원통플른지 연삭공정을 대상으로 공작물에서 발생하는 음향방출 신호와 연삭기 주축 모터의 동력 신호를 연삭가공 중에 검출하고, 이를 신경회로망에 적용하여 연삭가공 상태를 진단하는 시스템을 구축하고, 그 성능을 평가하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.31-31
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• 2004

차세대 정보통신 네트워크는 기하급수적으로 급증하는 트래픽 수요와 고속 및 대용량화는 서비스 형태에 따라 인터넷화 및 광통신화로 발전되고 있으며, 사용자들의 요구 통신 속도 또한 크게 증가하고 있어 2005-2010년경에는 인터넷 노드 하나가 처리해야 할 트래픽은 10-100Tbps가 될 전망이며 이를 수용, 교환처리, 전달하기 위한 방법으로 광통신 이외에는 기술적인 대안을 찾기 힘든 실정이다. 한국의 경우 세계최고의 광통신망 구축에 따라 광페룰의 기반 수요가 크게 기대되고 있으며, 전 세계적인 광통신망 구축계획(2005∼2007년, 초고속정보통신망 Fiber to the Home)에 따라 한국의 광통신 인프라에 대한 전세계의 관심이 고조되고 있다.(중략)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1991.04a
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• pp.347-354
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• 1991

최근 기계공업에 있어서 컴퓨터 이용은, 메카트로닉스 및 CAC/CAM 등에서 볼 수 있듯이 급속히 진전되고 있다. 이와 더불어 생산 기술에 있어서도 소프트웨어의 비율이 중대함과 더불어, 그의 질적 향상 및 생산성 향상이 강력히 요망되고 있다. 이와 같이 소프트웨어의 중요성이 널리 인식 됨에도 불구하고, 생산시스템 전체를 통합적으로 취급할 수 있는 소프트웨어의 체계는 아직 확립되어 있지 않다. 금후 기계공업을 더욱 고도화 시키고, 국제경쟁력을 확보하기 위해서는 이의 연구개발을 한층 강력히 추진하지 않으면 안될 상황이다. 특히, 숙련공의 기술 및 Know-How에 의존 하는 일이 많은 연삭 가공분야에서는 이러한 전문가의 경험 및 연구로부터 얻은 지식을 컴퓨터의 지식베이스에 집어넣어 인공지능(AI) 기술 및 Expert System을 이용하여 문제를 해결하는 방법은 극히 유효하다고 볼 수 있다. 이에 연삭 작업 표준 설정의 연구의 발전적 연구로서, 최근 급 속히 연구 개발이 진행되고 있는 지식공학을 연삭가공분야에 응용하여, 지금까지 개발한 Siumlation 수법을 상호보강시켜 하나의 지식 처리 system을 구성하고자 한다.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1092-1098
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• 2004

Today the demand of the optical communication components has been increased. Zirconia Ferrule has become the one of the most important elements because it determines transmission efficiency and quality of information in the optical communication system. Grinding is the major process in the ferrule manufacturing process which require high processing precision. In this reseach, specially designed spindle, chucking system, loading & unloading system and cooling system, as a supporting experimental equipment for development of an Intelligent Coaxial Grinding System (ICGS) for Zirconia Ferrule processing, is developed. We are also analized the adaptability of ICGS in practical use, through the way of evaluation for the performance of the each systems above.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.46-51
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• 2002

A grinding technology is very essential to finish the surface of IT and BT industrial application parts such as wafer, optical connection part and lenses etc. However the finding machine has bead depended on imports. Especially, it is completely imported for machining high precision part relevant to domestic electric and communicational industries. The amount to import grinding machine is about $110milions. It takes about 35% of total import amount of all the machine tools. A domestic finder manufacturer is a very small-scaled bussinessman and research facilities is poor. Recently, it is increasing to demand high speed and precision grinding technology because it brings cost down and value added up. Its further study will be something related to inteligent grinding system fur value added and high precision part. It will make domestic grinding technology to its advanced country level.

• Journal of Power System Engineering
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• v.4 no.2
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• pp.25-30
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• 2000

The grinding process is very complex and relates many parameters to control the process. As this reason, a theoretical analysis and a quantitative estimation of the grinding process has not been well established. In this study, the in-process monitoring system was suggested by applying the neural network for monitoring and shooting the malfunction of cylindrical plunge grinding process. This system used the power signals from the electric power meter. This neural network was composed of processing elements [4-(5-5)-3] with 4 identified power parameters. Because sensitivity is blunted some minute vibration components, the simulation result of this system has appeared about 10% erroneous recognition in the uncertain pattern and the average success rate of the trouble recognition was about 90%. Consequently, the developed system, which applied to the power signals, can be recognize enough to monitor the grinding process as in-process.