• Journal of the Korean Applied Science and Technology
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• v.34 no.2
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• pp.349-356
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• 2017

OH radical generation is one of the common method to evaluate photocatalytic activity. In many of previous studies, only the UV(Ultraviolet) light was applied to test photocatalytic ability of $TiO_2$ nanotubes by studying probe compound(4-Chlorobenzoic acid) concentration change in solution. Also, $TiO_2$ nanotubes were found to show some electrochemical characteristics when the flow of electric current was applied. In this study, the flow of electric current and UV light were applied at the same time to determine whether electrochemical characteristics of $TiO_2$ nanotube plate can give synergetic effect on the photocatalytic activity. $TiO_2$ nanotube was grown on Ti by anodic oxidation to create $TiO_2$ nanotube plate which can be used as a photocatalyst and a electrode that can undergo AOP(Advanced Oxidation Process) for water treatment. Probe compound solution was prepared using 4-chlorobenzoic acid and $H_2O$ as a solvent. NaCl was added to give conductivity to work as electrolyte. As a result, enough level of electric current flow was found to give synergetic photocatalytic effect which can be used for efficient AOP water treatment method.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.43-48
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• 2011

The maximum current density of copper electrorefining is 350 A/$m^2$ and the higher current density is required to promote the copper productivity. The 1000 A/$m^2$ high current density is possible when rotating disc electrode is employed to reduce diffusion thickness. The copper electroplating with 1000 A/$m^2$ is possible at 400 rpm. Thiourea and glue were used to improve the electrodeposition behaviors during copper electrorefining process. Potentiodynamic polarization tests were conducted to investigate the effects of additives on copper electrodeposition. Galvanostatic tests were also conducted at 1000 A/$m^2$. Copper were electroplated on cylindrical rotating electrodes to give the uniform flow on the electrode surface. The lowest surface roughness was obtained when 16 ppm thiourea was added to the electrolytes. The surface roughness was increased with glue concentration. The surface hardness was not influenced by addition of glue. The copper nuclei were getting smaller with thiourea concentration, however there is no glue effects on copper nucleation.